NXP Semiconductors BSR16/LF1R

Overview

BSR16/LF1R from NXP Semiconductors is a PNP bipolar junction transistor (BJT) designed for general-purpose switching in automotive and industrial control circuits, with −60 V V_CEO, −600 mA I_C, and DC current gain (h_FE) of 100–300 at −150 mA, housed in an SOT23 (TO-236AB) surface-mount package.

For engineers reviewing the BSR16/LF1R datasheet, BSR16/LF1R pinout, BSR16/LF1R application, or BSR16/LF1R equivalent, this device supports AEC-Q101-qualified automotive load switching, low-power linear amplification, and discrete-level logic-level interfacing where robust PNP switching with defined saturation behavior is required.

Technical Context

The BSR16/LF1R operates as a single PNP BJT with open-base collector-emitter breakdown voltage of −60 V and emitter-base breakdown of −5 V, enabling reliable operation in negative-rail switching topologies. Its thermal resistance R_th(j-a) is 500 K/W on FR4 PCB, limiting continuous power dissipation to 250 mW at 25 °C ambient.

Switching performance includes t_on = 40 ns and t_off = 365 ns under specified drive conditions (I_Bon = −15 mA, I_Boff = +15 mA), with V_CEsat ≤ −1.3 V at I_C = −150 mA / I_B = −15 mA, supporting efficient low-voltage switching in space-constrained designs.

Key Specifications

Pinout & Package

SOT23 (TO-236AB) plastic surface-mounted package with 3 leads; compact footprint (2.8 × 1.4 mm), 1.1 mm height, and standard reflow solder pad layout per Figure 12.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar PNP switching transistor applications.

Compared with BSR16/LF1R, BSR14 offers polarity-matched performance in NPN form but requires redesign of drive logic and load placement, while MMBT3906LT1G sacrifices automotive qualification, voltage headroom, and current capacity-making it unsuitable for direct replacement in AEC-Q101 or 60 V systems.

Availability

BSR16/LF1R is available at Aetrix Electronics and suitable for automotive body electronics, industrial programmable logic controllers, and medical diagnostic equipment requiring stable component supply with traceable sourcing and lifecycle continuity.

Supply support for BSR16/LF1R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.

The BSR16/LF1R belongs to NXP's general-purpose bipolar transistor product line, engineered for robust, AEC-Q101-compliant discrete switching in harsh-environment control systems where reliability and parametric consistency are critical.

FAQ

What is the maximum continuous collector current rating for BSR16/LF1R?

The BSR16/LF1R has a maximum continuous collector current (I_C) rating of −600 mA at T_amb ≤ 25 °C, as specified in Table 5 (Limiting values). This rating assumes operation within absolute maximum conditions and derates linearly with increasing ambient temperature per the power derating curve in Figure 1. Exceeding −600 mA risks thermal runaway or permanent damage.

Is BSR16/LF1R qualified for automotive applications?

Yes, the BSR16/LF1R is explicitly qualified to AEC-Q101 standards for discrete semiconductors, as confirmed in Section 11.1 and Feature 2 of the datasheet. This qualification covers stress tests including temperature cycling, high-temperature reverse bias, and mechanical shock-making BSR16/LF1R suitable for under-hood and body-control module applications in passenger vehicles.

What is the typical DC current gain (h_FE) of BSR16/LF1R at operating conditions?

The BSR16/LF1R exhibits a typical h_FE of 100–300 at V_CE = −10 V and I_C = −150 mA (pulsed, t_p ≤ 300 µs), per Table 1 and Table 7. This range remains stable across −55 °C to +150 °C ambient, as shown in Figure 3, supporting consistent base drive design across automotive temperature extremes.

What package type does BSR16/LF1R use, and what are its key mechanical dimensions?

The BSR16/LF1R uses the SOT23 (TO-236AB) surface-mount plastic package, with outline dimensions of 2.8 mm × 1.4 mm × 1.1 mm (L × W × H), per Figure 11. Pin pitch is 0.95 mm, and recommended reflow solder footprint matches Figure 12, ensuring compatibility with standard pick-and-place and reflow processes.

How does the saturation voltage (V_CEsat) of BSR16/LF1R affect power dissipation in switching applications?

At I_C = −150 mA and I_B = −15 mA, the BSR16/LF1R achieves V_CEsat ≤ −1.3 V, resulting in conduction loss of ≤195 mW (|V_CEsat| × |I_C|). Combined with its 500 K/W thermal resistance, this yields a junction-to-ambient temperature rise of ≤97.5 K-enabling reliable operation without heatsinking on standard FR4 PCBs.