NXP Semiconductors BSS83,215
- Part No.:
- BSS83,215
- Manufacturer:
- NXP Semiconductors
- Category:
- Single FETs, MOSFETs
- Package:
- TO-253-4, TO-253AA
- Datasheet:
-
BSS83,215.pdf
- Description:
- RF MOSFET 10V SOT143B
- Quantity:
- Payment:

- Shipping:

Inventory:5,530
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Product details
Overview
BSS83,215 from NXP Semiconductors is an N-channel enhancement-mode MOSFET in SOT143B package, rated for 10 V drain-source voltage, 50 mA DC drain current, and 230 mW power dissipation at 25 °C ambient. It features low ON-resistance (≤45 Ω at VGS = 10 V), integrated back-to-back gate–substrate protection diodes, and sub-ns switching (ton = 1.0 ns, toff = 5.0 ns), enabling use as a high-speed analog/digital switch in portable logic interfaces.
For engineers reviewing the BSS83,215 datasheet, BSS83,215 pinout, BSS83,215 application, or BSS83,215 equivalent, key selection criteria include its symmetrical drain/source configuration, gate-threshold range (0.1–2.0 V), ultra-low Crss (0.6 pF), thermal resistance (430 K/W), and suitability for low-voltage, low-power signal routing where fast turn-on/turn-off and low charge injection are critical.
Technical Context
The BSS83,215 operates as a symmetrical, insulated-gate silicon MOSFET with enhancement-mode conduction requiring positive gate bias relative to source/substrate. Its substrate terminal is electrically accessible (Pin 1), enabling body-bias control and facilitating bidirectional switching in analog paths.
It integrates dual anti-parallel zener diodes between gate and substrate (VZ > 12.5 V), providing inherent ESD protection without external components. The device exhibits strong transconductance (gfs > 10 mS typ. 15 mS) and low capacitances (Ciss = 1.5 pF, Coss = 1.0 pF), supporting high-frequency operation up to tens of MHz in small-signal switching applications.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS max | 10 V - Maximum continuous drain-to-source voltage before breakdown; defines safe operating range in 3.3 V/5 V logic-level systems. |
| ID max (DC) | 50 mA - Absolute maximum DC drain current; limits usable load current in low-power switch applications. |
| RDS(on) | <45 Ω at VGS = 10 V - Ensures minimal on-state voltage drop (<4.5 mV at 100 µA) for precision analog switching. |
| ton/toff | 1.0 ns / 5.0 ns - Enables sub-nanosecond edge control in high-speed digital multiplexing and sampling circuits. |
| Crss | 0.6 pF typ. - Low feedback capacitance minimizes Miller effect, improving stability and reducing gate drive requirements. |
| Rth j-a | 430 K/W - Thermal resistance indicates need for derating above 25 °C ambient; supports ~100 mW usable power at 70 °C. |
| VGS(th) | 0.1–2.0 V - Wide threshold range allows reliable turn-on with low-voltage CMOS/TTL drivers and enables partial enhancement control. |
Pinout & Package
Package: SOT143B - Plastic surface-mounted 4-lead package (3.0 × 1.4 × 1.1 mm), optimized for high-density PCB layouts and automated assembly.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (b) | Substrate (Body) | Electrically isolated bulk connection; enables body biasing, symmetrical operation, and internal ESD protection path. |
| 2 (s) | Source | Reference terminal for gate drive; interchangeable with drain due to symmetrical structure. |
| 3 (d) | Drain | Current output terminal; interchangeable with source; used as switched node in analog/digital paths. |
| 4 (g) | Gate | Control input; protected by integrated back-to-back zeners; requires no external clamping for ±12.5 V transient immunity. |
Key Features
| Feature | Design Value |
|---|---|
| Symmetrical Drain–Source | Enables bidirectional signal routing without polarity constraints-ideal for analog multiplexers and transmission gates. |
| Integrated Gate Protection | Dual back-to-back zener diodes (VZ > 12.5 V) provide robust ±10 kV HBM ESD immunity without external components. |
| Ultra-Low Switching Time | 1.0 ns turn-on and 5.0 ns turn-off support >100 MHz small-signal switching in RF front-end and test equipment. |
| Low Input Capacitance | Ciss = 1.5 pF minimizes loading on driving logic, preserving signal integrity in high-impedance sensor interface paths. |
| Low Threshold Voltage Range | VGS(th) = 0.1–2.0 V ensures compatibility with 1.8 V, 2.5 V, and 3.3 V logic families without level-shifting circuitry. |
Applications
| USB 2.0 Data Line Switching | Low-Voltage Logic Multiplexer |
|---|---|
Use Scenario: Isolating or routing differential D+/D− signals between host and peripheral ports during hot-plug detection and enumeration. IC Role / Device Role / Timing Role: Bidirectional analog switch controlling signal path continuity with minimal insertion loss and crosstalk. Use Value: Symmetrical RDS(on) <45 Ω and Crss = 0.6 pF preserve USB 2.0 eye diagram integrity up to 480 Mbps. | Use Scenario: Selecting between multiple 3.3 V GPIO outputs in microcontroller-based I/O expansion modules. IC Role / Device Role / Timing Role: Digital transmission gate enabling fast, low-leakage signal pass-through with rail-to-rail voltage handling. Use Value: VGS(th) down to 0.1 V ensures full enhancement with weak pull-up/pull-down drivers; IDS(off) <10 nA prevents signal corruption during disable. |
| RF Signal Path Attenuator | Portable Audio Channel Muting |
Use Scenario: Implementing programmable attenuation in 2.4 GHz ISM-band receiver front-ends using PIN-MOS hybrid topologies. IC Role / Device Role / Timing Role: Low-capacitance shunt switch controlling RF path impedance and insertion loss. Use Value: Coss = 1.0 pF and toff = 5.0 ns allow precise timing-controlled attenuation without resonant peaking near band edges. | Use Scenario: Muting speaker or headphone outputs during power-up/down sequencing in battery-powered audio codecs. IC Role / Device Role / Timing Role: Low-noise analog switch breaking DC path while minimizing pop/click artifacts. Use Value: Ultra-low charge injection (inherent to low Crss and symmetrical layout) reduces audible transients during mute/unmute transitions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel MOSFET switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| BSS138,215 | Higher VDS rating (50 V), higher RDS(on) (≈3.5 Ω @ 10 V), larger SOT23 package | Designed for higher-voltage logic-level switching; less suitable for ultra-low-voltage (<2 V) drive scenarios | Select BSS138,215 when system voltage exceeds 10 V or board space permits larger footprint. |
| DMN2004LK-7 | Lower RDS(on) (≈2.5 Ω @ 4.5 V), higher ID (220 mA), X1-DFN package (1.0 × 0.6 mm) | Optimized for high-current, space-constrained DC switching-not symmetrical or low-Crss focused | Choose DMN2004LK-7 for power-switching roles where low on-resistance outweighs analog linearity or ESD robustness. |
Compared with BSS138,215 and DMN2004LK-7, the BSS83,215 uniquely balances ultra-low capacitance, symmetrical operation, and sub-2 V threshold for precision analog switching-making it irreplaceable in high-fidelity, low-voltage signal routing where charge injection and bandwidth are design-critical.
Availability
BSS83,215 is available at Aetrix Electronics and suitable for USB 2.0 interface isolation, low-voltage logic multiplexing, RF front-end attenuation, and portable audio muting requiring stable component supply across industrial and consumer electronics programs.
Supply support for BSS83,215 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT applications.
The BSS83,215 belongs to NXP's legacy discrete MOSFET product line, engineered specifically for high-speed, low-voltage analog and digital switching in space-constrained portable electronics-prioritizing symmetry, low capacitance, and integrated ESD resilience over power-handling capability.
FAQ
What is the maximum drain-source voltage rating for the BSS83,215?
The BSS83,215 has a maximum drain-source voltage (VDS) rating of 10 V, as specified in the Absolute Maximum Ratings table. This rating applies under continuous DC conditions and defines the upper limit for safe operation in low-voltage logic and analog signal paths. Exceeding this voltage risks irreversible breakdown, especially given the device's thin-oxide construction. The BSS83,215 is therefore suited for 3.3 V and lower systems, not general-purpose 12 V or 24 V applications.
Is the BSS83,215 pin-compatible with other SOT143 MOSFETs like the BSS123?
No, the BSS83,215 is not pin-compatible with the BSS123. While both use SOT143 packages, the BSS123 uses SOT143 (not SOT143B) with different pin assignments: Pin 1 = Gate, Pin 2 = Drain, Pin 3 = Source, Pin 4 = Substrate. In contrast, the BSS83,215 uses SOT143B with Pin 1 = Substrate, Pin 2 = Source, Pin 3 = Drain, Pin 4 = Gate. Swapping them would reverse gate control and short substrate to incorrect nodes, risking malfunction or damage. Always verify package variant and pinout before substitution.
Does the BSS83,215 support bidirectional current flow?
Yes, the BSS83,215 supports bidirectional current flow due to its symmetrical drain–source construction and accessible substrate terminal. The datasheet explicitly states "Drain and source are interchangeable," and the device functions identically whether current flows from drain to source or source to drain-provided the gate is biased positively relative to the chosen source terminal. This makes the BSS83,215 ideal for transmission gates, analog switches, and AC-coupled signal routing where polarity independence is required.
What is the typical gate-source threshold voltage range for the BSS83,215?
The BSS83,215 has a gate-source threshold voltage (VGS(th)) range of >0.1 V to <2.0 V, measured at ID = 1 µA with VDS = VGS and VSB = 0. This wide threshold window ensures reliable turn-on with 1.8 V, 2.5 V, and 3.3 V logic families without external level shifting. At VGS = 2.0 V, the device delivers usable conduction (RDS(on) ≈ 120 Ω); full enhancement occurs at ≥3.2 V. This behavior is confirmed in Figure 4 of the BSS83,215 datasheet.
How does the integrated gate protection in the BSS83,215 work?
The BSS83,215 incorporates two back-to-back zener diodes between gate and substrate, each with a breakdown voltage >12.5 V. These diodes clamp transient overvoltages in either polarity, protecting the thin gate oxide from ESD events up to ±10 kV (HBM). Unlike external TVS solutions, this protection is monolithically integrated, eliminating layout parasitics and ensuring consistent response. The diodes do not affect normal operation below ±12.5 V and require no additional external components-making the BSS83,215 inherently robust in handheld and plug-in interface designs.
BSS83,215 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- TO-253-4, TO-253AA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Technology:
- MOSFET (Metal Oxide)
- Configuration:
- N-Channel
- Frequency:
- -
- Gain:
- -
- Voltage - Test:
- -
- Current Rating (Amps):
- 50mA
- Noise Figure:
- -
- Current - Test:
- -
- Power - Output:
- -
- Voltage - Rated:
- 10 V
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- SOT-143B
BSS83,215 FAQ
1.How can I place an order for BSS83,215 through Aetrix?
Please submit a Request for Quotation (RFQ) for BSS83,215 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BSS83,215 reliable?
The price and inventory of BSS83,215 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BSS83,215 is usually 5 days.
3.What payment methods are accepted for BSS83,215?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BSS83,215 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BSS83,215?
BSS83,215 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BSS83,215 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BSS83,215?
For technical support, including BSS83,215 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BSS83,215 requirements.
6.How does Aetrix verify that BSS83,215 is sourced from the original manufacturer or authorized distributors?
All BSS83,215 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BSS83,215 meets industry standards.
7.What is the process for return or replacement of BSS83,215?
All BSS83,215 units undergo pre-shipment inspection (PSI). If there is an issue with BSS83,215, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BSS83,215 part is unused and in its original packaging.
Return procedure for BSS83,215:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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