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NXP Semiconductors BSS83,235

Part No.:
BSS83,235
Manufacturer:
NXP Semiconductors
Category:
Single FETs, MOSFETs
Package:
TO-253-4, TO-253AA
Datasheet:
AetrixBSS83,235.pdf
Description:
RF MOSFET 10V SOT143B
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:5,771

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Product details

Overview

BSS83,235 from NXP Semiconductors is an N-channel enhancement-mode MOSFET in SOT143B package, rated for 10 V drain-source voltage, 50 mA DC drain current, and 230 mW power dissipation at 25 °C ambient. It features low ON-resistance (<45 Ω at VGS = 10 V), sub-1 pF feedback capacitance (0.6 pF typ.), and integrated back-to-back gate–substrate diodes for input overvoltage protection - used as analog/digital switch or switch driver in low-voltage signal routing.

For engineers reviewing the BSS83,235 datasheet, BSS83,235 pinout, BSS83,235 application, or BSS83,235 equivalent, key selection criteria include its symmetrical drain/source configuration, gate-threshold range (0.1–2.0 V), ultrafast switching (ton = 1.0 ns typ., toff = 5.0 ns typ.), and suitability for low-power, high-speed discrete switching in space-constrained PCB layouts.

Technical Context

The BSS83,235 operates as a symmetrical, insulated-gate silicon MOSFET with substrate terminal (pin 1) electrically isolated and internally protected by dual zener diodes between gate and substrate. Its enhancement-mode behavior requires positive VGS to conduct, with threshold defined at ID = 1 µA and VSB = 0.

Thermal performance is characterized by Rth j-a = 430 K/W (free air), junction temperature limit of 125 °C, and storage range from −65 to +150 °C. Device operation under VSB = 6.8 V shifts RDS(on) to 80–120 Ω (typ./max), confirming body-diode-aware biasing requirements in bidirectional switch configurations.

Key Specifications

Parameter Value and Actual Design Meaning
VDS max10 V - maximum continuous drain-source voltage before breakdown; defines safe operating range in low-voltage logic-level switching.
ID max (DC)50 mA - absolute maximum DC drain current; constrains use to signal-level, not power-level, load switching.
RDS(on)<45 Ω at VGS = 10 V - ensures minimal conduction loss in on-state; critical for low-insertion-loss analog switching.
Crss0.6 pF typ. - feed-through capacitance determines high-frequency crosstalk and switching speed limitation.
ton/toff1.0 ns / 5.0 ns typ. - enables nanosecond-scale digital switching; suitable for clock gating and fast multiplexing.
VGS(th)0.1–2.0 V - wide threshold range allows compatibility with 1.8 V, 2.5 V, and 3.3 V logic families without level shifting.
Ptot230 mW at Tamb = 25 °C - sets thermal derating envelope; requires layout-aware copper pour for sustained 50 mA operation.

Pinout & Package

Package: SOT143B - plastic surface-mounted 4-lead package (3.0 × 1.4 mm footprint, 1.1 mm height), optimized for high-density PCB assembly and RF-sensitive routing.

Pin/Terminal Circuit Role Design Meaning
1 (b)Substrate (bulk)Internally connected to source-body junction; must be tied to lowest potential in circuit to maintain channel control and prevent latch-up.
2 (s)SourcePrimary current return path; interchangeable with drain per datasheet note - enables bidirectional signal switching.
3 (d)DrainCurrent output node; interchangeable with source - supports symmetrical analog switch topologies without polarity constraints.
4 (g)GateControl electrode; protected by back-to-back zeners (VZ > 12.5 V) - tolerates ±12 V transient spikes without external clamping.

Key Features

Feature Design Value
Symmetrical D/S structureDrain and source are fully interchangeable - eliminates routing directionality in analog switch designs and simplifies PCB layout.
Integrated gate protectionBack-to-back zener diodes between gate and substrate - suppresses ESD and overvoltage transients up to ±12.5 V without external components.
Ultra-low Crss0.6 pF typical - minimizes capacitive feedthrough in high-frequency signal paths, preserving signal integrity in RF/mixed-signal applications.
Nanosecond switchington = 1.0 ns, toff = 5.0 ns - enables precise timing control in clock distribution, test equipment, and high-speed data routing.
Low VGS(th) range0.1–2.0 V - ensures reliable turn-on with sub-2 V logic families (e.g., 1.8 V LVTTL), reducing need for gate drivers.

Applications

USB 2.0 Data Line Switching Low-Voltage Logic-Level Translation

Use Scenario: Isolating or routing differential D+/D− signals between USB host and peripheral ports during hot-plug detection or port sharing.

IC Role / Device Role / Timing Role: Bidirectional analog switch controlling signal path continuity with <1 ns propagation delay skew.

Use Value: Symmetrical RDS(on) and sub-pF Crss preserve USB 2.0 eye diagram integrity and meet ≤1.5 ns rise/fall time requirements.

Use Scenario: Level-shifting control signals between 1.8 V microcontroller GPIO and 3.3 V peripheral enable lines without active translators.

IC Role / Device Role / Timing Role: Passive voltage-domain interface switch activated by native MCU output voltage.

Use Value: VGS(th) down to 0.1 V ensures full enhancement at 1.8 V drive, eliminating need for dedicated level shifters.

RF Signal Path Attenuation Test Equipment Signal Gating

Use Scenario: Inserting calibrated attenuation in 50 Ω RF paths (e.g., 900 MHz ISM band) using series/shunt switch topology.

IC Role / Device Role / Timing Role: Low-capacitance series switch providing <0.1 dB insertion loss at 1 GHz when ON.

Use Value: Ciss = 1.5 pF and Coss = 1.0 pF minimize impedance mismatch; RDS(on) <45 Ω maintains 50 Ω system match.

Use Scenario: Enabling/disabling signal acquisition windows in automated test equipment (ATE) with sub-10 ns timing resolution.

IC Role / Device Role / Timing Role: Precision timing gate for analog stimulus/response capture with deterministic on/off edges.

Use Value: 1.0 ns ton and 5.0 ns toff support ≥100 MHz gating rates; low leakage (<10 nA) prevents signal drift during hold periods.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel enhancement-mode MOSFET switching applications.

Alternative Part Technical Difference Application Difference Selection Advice
DMN2004K-7RDS(on) = 3.5 Ω @ VGS = 4.5 V; SOT-23 package; higher current rating (220 mA).Designed for higher-power load switching; unsuitable where ultra-low capacitance or symmetrical D/S is required.Select DMN2004K-7 only when lower RDS(on) and higher ID outweigh need for Crss <1 pF and bidirectional operation.
2N7002K-T1-GE3RDS(on) = 3.5 Ω @ VGS = 10 V; SOT-23; no substrate terminal; no integrated gate zeners.Lacks symmetrical D/S and gate protection; requires external ESD clamping in noisy environments.Choose 2N7002K-T1-GE3 for cost-sensitive, non-critical digital switching where layout space permits external protection.

Compared with DMN2004K-7 and 2N7002K-T1-GE3, the BSS83,235 uniquely delivers symmetrical operation, integrated gate protection, and sub-pF Crss - making it irreplaceable in precision analog switching, RF path control, and low-voltage bidirectional signal routing where layout density and signal fidelity are constrained.

Availability

BSS83,235 is available at Aetrix Electronics and suitable for USB interface isolation, low-voltage logic translation, RF signal path control, and automated test equipment signal gating requiring stable component supply and long-term obsolescence management.

Supply support for BSS83,235 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and consumer applications.

The BSS83,235 belongs to NXP's legacy discrete MOSFET portfolio designed specifically for high-speed, low-voltage analog and digital switching - emphasizing symmetry, low parasitics, and robust gate protection in miniature surface-mount packages.

FAQ

What is the maximum continuous drain current for the BSS83,235?

The BSS83,235 has a maximum DC drain current (ID) of 50 mA, specified up to Tamb = 25 °C. Derating is required above this temperature per the Rth j-a = 430 K/W thermal resistance; at 70 °C ambient, usable ID drops to approximately 27 mA to maintain Tj ≤ 125 °C. This rating confirms the BSS83,235 is intended for signal-level, not power-level, switching applications.

Is the BSS83,235 pin-compatible with other SOT-143 devices?

The BSS83,235 uses the SOT143B package with standardized 4-lead pinout (substrate, source, drain, gate), but pin compatibility is not guaranteed across all SOT143-marked parts due to internal substrate connection differences. The BSS83,235 explicitly ties pin 1 to substrate - a design-specific feature not shared by all SOT143 variants - so direct substitution requires verification of substrate handling and zener protection architecture in the target design.

Does the BSS83,235 support bidirectional signal flow?

Yes, the BSS83,235 supports bidirectional signal flow because its drain and source terminals are interchangeable per the official datasheet note. This symmetry arises from its symmetrical MOS structure and absence of intrinsic body diode dominance - enabling true analog switch behavior in both directions when VSB = 0, as confirmed in Fig.3 and Fig.7 of the BSS83,235 product specification.

What is the gate-source threshold voltage range for the BSS83,235?

The BSS83,235 gate-source threshold voltage (VGS(th)) is specified from >0.1 V to <2.0 V, measured at ID = 1 µA with VSB = 0. This wide range ensures reliable turn-on with 1.8 V, 2.5 V, and 3.3 V logic families without external level shifting. The BSS83,235 achieves full enhancement at VGS ≥ 3.2 V even under elevated VSB = 6.8 V conditions, as shown in Fig.4.

How does the integrated gate protection in the BSS83,235 function?

The BSS83,235 integrates back-to-back zener diodes between gate and substrate (pin 1), providing bidirectional ESD and overvoltage protection. Each diode exhibits VZ > 12.5 V at ±10 µA, allowing the BSS83,235 to withstand transient spikes up to ±12 V without external clamps. This protection is intrinsic to the die structure and remains active regardless of source/drain bias - a key differentiator from unprotected MOSFETs like the 2N7002K-T1-GE3.

BSS83,235 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
-
Package/Case:
TO-253-4, TO-253AA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Technology:
MOSFET (Metal Oxide)
Configuration:
N-Channel
Frequency:
-
Gain:
-
Voltage - Test:
-
Current Rating (Amps):
50mA
Noise Figure:
-
Current - Test:
-
Power - Output:
-
Voltage - Rated:
10 V
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
SOT-143B

BSS83,235 FAQ

1.How can I place an order for BSS83,235 through Aetrix?

Please submit a Request for Quotation (RFQ) for BSS83,235 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for BSS83,235 reliable?

The price and inventory of BSS83,235 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BSS83,235 is usually 5 days.

3.What payment methods are accepted for BSS83,235?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BSS83,235 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for BSS83,235?

BSS83,235 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your BSS83,235 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for BSS83,235?

For technical support, including BSS83,235 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BSS83,235 requirements.

6.How does Aetrix verify that BSS83,235 is sourced from the original manufacturer or authorized distributors?

All BSS83,235 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BSS83,235 meets industry standards.

7.What is the process for return or replacement of BSS83,235?

All BSS83,235 units undergo pre-shipment inspection (PSI). If there is an issue with BSS83,235, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The BSS83,235 part is unused and in its original packaging.

Return procedure for BSS83,235:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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