STMicroelectronics BU931P
- Part No.:
- BU931P
- Manufacturer:
- STMicroelectronics
- Category:
- Single Bipolar Transistors
- Package:
- TO-247-3
- Datasheet:
-
BU931P.pdf
- Description:
- TRANS NPN DARL 400V 15A TO-247-3
- Quantity:
- Payment:

- Shipping:

Inventory:471
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
BU931P from STMicroelectronics is an automotive-grade NPN power Darlington transistor designed as a high-voltage ignition coil driver, featuring VCEO = 400 V, IC = 10 A, and Tj up to 175 °C, with AEC-Q101 qualification for under-hood electronic ignition systems.
For engineers reviewing the BU931P datasheet, BU931P pinout, BU931P application, or BU931P equivalent, key selection criteria include ruggedness under inductive switching stress, safe operating area at elevated junction temperature, and compliance with automotive ignition transient voltage requirements (e.g., load dump, ISO 7637-2).
Technical Context
The BU931P employs multi-epitaxial planar bipolar technology optimized for high-energy inductive load switching. Its internal structure integrates a monolithic Darlington pair with integrated base-emitter clamp diode, enabling robust turn-off under high dV/dt conditions typical of ignition coil flyback.
It operates in linear and saturated switching modes with specified VCE(sat) ≤ 1.8 V at IC = 10 A / IB = 250 mA and supports pulse operation up to 20 A peak collector current with ≤2% duty cycle, validated per AEC-Q101 stress test profiles.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCEO | 400 V - Sustaining voltage under zero-base-current condition; defines maximum inductive flyback voltage tolerance before breakdown |
| IC | 10 A continuous - Rated collector current at Tc = 25 °C; derates linearly above case temperature |
| PTOT | 125 W at Tc = 25 °C - Total power dissipation limit; requires heatsink for sustained operation above ~40 °C case temp |
| RthJC | 1.2 °C/W - Junction-to-case thermal resistance; enables thermal design using measured case temperature |
| hFE | 300 min at IC = 5 A - DC current gain ensures low base drive requirement for full saturation at rated load |
| ts + tf | < 15.5 μs - Storage + fall time with RBE = 47 Ω; critical for minimizing energy loss during coil de-energization |
| Tj max | 175 °C - Maximum operating junction temperature; qualified per AEC-Q101 for under-hood automotive environments |
Pinout & Package
BU931P is housed in TO-220 type A package with isolated tab (collector-connected), standard 3-pin vertical mounting configuration. The metal tab serves as the collector terminal and must be electrically isolated from heatsink unless system grounding scheme permits direct connection.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Collector (Tab) | Main power output path | Electrically connected to metal tab; requires insulated mounting hardware when referenced to non-collector potential |
| Base | Control input | Drives Darlington pair; requires current-limited source (e.g., 70–250 mA) for full saturation at 10 A load |
| Emitter | Power return path | Low-side return node; connects to ground or low-side switch; carries full load current |
Key Features
| Feature | Design Value |
|---|---|
| AEC-Q101 qualification | Validated for automotive under-hood use including temperature cycling, humidity, and mechanical shock per Rev G |
| High VCEO(sus) | 400 V sustaining voltage ensures reliable operation during 300 V clamp events in 12 V ignition systems |
| Integrated clamp diode | Monolithic emitter-base diode limits reverse base-emitter voltage to 5 V, preventing B-E junction failure during flyback |
| Rugged SOA | Safe operating area supports 10 A × 400 V for ≥10 ms pulses, covering worst-case ignition dwell/flyback transients |
| TO-220 isolation | Electrically isolated tab allows flexible mounting without additional insulating hardware in grounded-collector configurations |
Applications
| Gasoline Engine Ignition | Distributorless Ignition Systems (DIS) |
|---|---|
Use Scenario: Direct drive of primary winding in coil-on-plug (COP) or coil-near-plug (CNP) units in 4–12 cylinder engines. IC Role / Device Role / Timing Role: High-current, high-voltage switch controlling dwell time and energy delivery to ignition coil. Use Value: Enables precise spark timing control with <15.5 μs turn-off delay, reducing misfire risk at high RPM. | Use Scenario: Dual-coil modules driving paired cylinders in waste-spark DIS architectures. IC Role / Device Role / Timing Role: Primary-side power switch synchronized to crank/cam signals via external controller. Use Value: Supports 20 A peak current for dual-coil simultaneous firing while maintaining <1.8 V saturation drop. |
| Heavy-Duty Diesel Preheat Control | Two-Stroke Marine Engine Ignition |
Use Scenario: Switching glow plug preheat circuits in commercial diesel engines with extended dwell periods. IC Role / Device Role / Timing Role: High-duty-cycle linear regulator for controlled current ramp into resistive glow plugs. Use Value: 175 °C Tj rating and 125 W dissipation allow sustained 10 A operation without thermal shutdown. | Use Scenario: Compact ignition drivers in outboard marine engines exposed to salt fog and vibration. IC Role / Device Role / Timing Role: Ruggedized switching element interfacing microcontroller PWM to high-inductance coils. Use Value: AEC-Q101 qualification and TO-220 isolation ensure reliability in harsh marine EMI/thermal environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-voltage ignition switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| BU931T | Same die, TO-220 package with non-isolated tab; RthJC = 1.2 °C/W identical; no ECOPACK® marking | Requires insulating kit for grounded heatsinks; otherwise functionally identical in ignition circuits | Select BU931T only if tab isolation is managed externally and RoHS compliance is not required |
| STGD10NB60S | 600 V, 10 A N-channel MOSFET; gate-driven, no base current; RDS(on) = 0.6 Ω vs. VCE(sat) = 1.8 V | Needs gate driver IC and overvoltage protection; lower conduction loss but higher EMI during switching | Choose for efficiency-critical designs with available gate drive resources and layout control for dv/dt noise |
Compared with BU931T, the BU931P offers factory-insulated tab for simplified thermal mounting; versus STGD10NB60S, it eliminates gate drive complexity and provides inherent ruggedness against voltage transients without external clamping.
Availability
BU931P is available at Aetrix Electronics and suitable for gasoline engine ignition modules, distributorless ignition systems (DIS), and heavy-duty diesel preheat controllers requiring stable component supply across automotive production lifecycles.
Supply support for BU931P includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, specializing in automotive, industrial, and power discrete technologies with broad manufacturing and qualification infrastructure.
The BU931P belongs to ST's automotive-qualified power transistor family, engineered specifically for high-reliability, high-energy switching in engine management systems where thermal resilience and transient immunity are critical.
FAQ
Is BU931P pin-compatible with BU931T?
Yes - BU931P and BU931T share identical TO-220 pinout (Collector–Base–Emitter) and electrical specifications. The sole difference is BU931P's electrically isolated tab, which eliminates need for mica washers when mounted to grounded heatsinks.
What is the recommended base drive circuit for BU931P in ignition applications?
A current-limited base driver delivering 70–250 mA is required. Typical implementation uses a 12 V logic-level signal through a 47 Ω series resistor and optional base-emitter clamp (e.g., 5.1 V Zener) to prevent reverse bias during flyback.
Does BU931P require a heatsink in continuous 10 A operation?
Yes - at 10 A and VCE(sat) ≈ 1.8 V, power dissipation exceeds 18 W. With RthJC = 1.2 °C/W, even modest ambient temperatures necessitate a heatsink to maintain Tj ≤ 175 °C; thermal interface material and mounting torque are critical.
Can BU931P replace BU931 in legacy designs?
No - BU931 was packaged in TO-247 and discontinued in 2008. BU931P is not a drop-in replacement due to different footprint, thermal path, and mounting hole pattern; redesign of PCB and mechanical interface is required.
BU931P Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- -
- Package/Case:
- TO-247-3
- Packaging:
- Tube
- Product Status:
- Active
- Transistor Type:
- NPN - Darlington
- Current - Collector (Ic) (Max):
- 15 A
- Voltage - Collector Emitter Breakdown (Max):
- 400 V
- Vce Saturation (Max) @ Ib, Ic:
- 1.8V @ 250mA, 10A
- Current - Collector Cutoff (Max):
- 100µA
- DC Current Gain (hFE) (Min) @ Ic, Vce:
- 300 @ 5A, 10V
- Power - Max:
- 135 W
- Frequency - Transition:
- -
- Operating Temperature:
- 175°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Through Hole
- Supplier Device Package:
- TO-247-3
BU931P FAQ
1.How can I place an order for BU931P through Aetrix?
Please submit a Request for Quotation (RFQ) for BU931P on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BU931P reliable?
The price and inventory of BU931P are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BU931P is usually 5 days.
3.What payment methods are accepted for BU931P?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BU931P transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BU931P?
BU931P orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BU931P order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BU931P?
For technical support, including BU931P datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BU931P requirements.
6.How does Aetrix verify that BU931P is sourced from the original manufacturer or authorized distributors?
All BU931P products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BU931P meets industry standards.
7.What is the process for return or replacement of BU931P?
All BU931P units undergo pre-shipment inspection (PSI). If there is an issue with BU931P, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BU931P part is unused and in its original packaging.
Return procedure for BU931P:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
BU931P Tags

-
MMBT3906LT1G
onsemi

-
MMBT3904-7-F
Diodes Incorporated

-
MMBT3904LT1G
onsemi

-
MMBT3906-7-F
Diodes Incorporated

-
MMBT3904-TP
Micro Commercial Co

-
MMBT2222A-7-F
Diodes Incorporated

-
BC846BLT1G
onsemi

-
BC847B,215
Nexperia USA Inc.

-
SMMBT3904LT1G
onsemi

-
MMBT2222A-TP
Micro Commercial Co

-
MMBTA06LT1G
onsemi

-
MMBT2222ALT1G
onsemi
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

