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onsemi BUD42DT4

Part No.:
BUD42DT4
Manufacturer:
onsemi
Category:
Single Bipolar Transistors
Package:
TO-252-3, DPAK (2 Leads + Tab), SC-63
Datasheet:
AetrixBUD42DT4.pdf
Description:
TRANS NPN 350V 4A DPAK
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,238

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Product details

Overview

BUD42DT4 from onsemi is a high-speed, high-gain bipolar NPN transistor with integrated antisaturation network and transient voltage suppression capability, rated for 650 VCEO, 4 A continuous collector current, and 25 W power dissipation in DPAK (Case 369C) surface-mount package - designed for light ballast and inductive switching applications requiring fast turn-off and robust safe operating area.

For engineers reviewing the BUD42DT4 datasheet, pinout, applications, or equivalent options, this page delivers verified electrical specs, thermal behavior, switching timing under clamped inductive loads, built-in freewheeling diode characteristics, and real-world selection guidance for high-voltage switching circuits.

Technical Context

The BUD42DT4 integrates an internal freewheeling diode between emitter and collector, enabling self-protected inductive load commutation without external diodes. Its antisaturation network ensures low dynamic saturation voltage during switching transitions while maintaining flat DC current gain across operating conditions.

It operates with tight parameter spreads enabled by "6 Sigma" manufacturing, supports clamped inductive switching up to 300 V with controlled storage time (tsi ≤ 4 µs at hFE = 5), and features ESD protection rated at 3B per HBM - all within a thermally optimized DPAK package with RJC = 5.0 °C/W.

Key Specifications

Parameter Value and Actual Design Meaning
VCEO(sus) 350 Vdc - Sustains 350 V under inductive turn-off with IC = 100 mA and L = 25 mH, defining usable voltage margin in ballast drivers.
IC Continuous 4.0 Adc - Supports sustained lamp current drive in electronic ballasts without derating below TC = 25°C.
PD @ TC = 25°C 25 W - Enables high-power switching in compact surface-mount layouts; derates linearly at 0.2 W/°C above 25°C.
toff 4.6–6.55 µs - Measured at IC = 1.2 A, IB1 = 0.4 A, IB2 = 0.1 A, VCC = 300 V - critical for minimizing energy loss in high-frequency ballast operation.
VCE(sat) 0.2–1.0 Vdc - Specified at IC = 2 A, IB = 0.5 A - directly determines conduction loss and thermal rise in steady-state operation.
hFE 8–13 - DC current gain at IC = 1–2 A, VCE = 2–5 V - enables predictable base drive design with minimal gain variation across temperature.
RJC 5.0 °C/W - Junction-to-case thermal resistance - allows direct heatsink mounting for efficient thermal management in enclosed fixtures.

Pinout & Package

DPAK (Case 369C) surface-mount package with 4-terminal configuration: exposed collector tab (pins 2 and 4) provides low-inductance, high-current path and thermal interface; pin 1 is base, pin 3 is emitter.

Pin/Terminal Circuit Role Design Meaning
1 Base Control input for transistor switching; requires precise current-limited drive to maintain forced gain and avoid second breakdown.
2 Collector Main high-voltage, high-current output terminal; electrically and thermally connected to exposed metal tab for heatsinking.
3 Emiter Reference node for base-emitter bias and freewheeling diode cathode; connects to ground or low-side switch node.
4 Collector Second collector connection - paralleled with pin 2 to reduce package inductance and improve current sharing in high-dI/dt applications.

Key Features

Feature Design Value
Integrated freewheeling diode VEC = 0.9–1.5 V at IEC = 1.0 A - eliminates need for external flyback diode in lamp ballast and relay driver circuits.
Antisaturation network Dynamic VCE(dsat) = 0.35–0.75 V at t = 3 s (IC = 1 A, IB1 = 200 mA) - reduces storage time and improves switching efficiency.
Tight parameter distribution "6 Sigma" process control - ensures consistent toff, hFE, and VCE(sat) across production lots for reliable system-level timing.
Clamped inductive SOA Validated up to VCE = 300 V, IC = 2 A with reverse-biased base (VBE(off) = −1.5 to −5 V) - guarantees safe operation under worst-case inductive turn-off.
Pb-free & RoHS compliant UL 94 V-0 epoxy at 0.125 in thickness - meets environmental and flammability requirements for commercial lighting equipment.

Applications

Compact Fluorescent Lamp (CFL) Ballasts LED Driver Primary Switch

Use Scenario: High-frequency resonant half-bridge driving CFL lamps with inductive impedance and voltage spikes during zero-crossing.

IC Role / Device Role / Timing Role: Main switching transistor handling 300 V clamp, 2–4 A peak current, and sub-µs storage time control via antisaturation network.

Use Value: Integrated freewheeling diode and tight tsi distribution eliminate external components and ensure consistent lamp ignition across production units.

Use Scenario: Primary-side switch in isolated flyback LED drivers powering streetlights or industrial luminaires.

IC Role / Device Role / Timing Role: High-voltage NPN switch sustaining 350 VCEO, delivering 4 A peak current, and managing dynamic saturation during PWM transitions.

Use Value: Low RJC (5.0 °C/W) and DPAK thermal pad enable direct PCB copper pour heatsinking - reducing thermal interface layers and improving long-term reliability.

Inductive Load Relay Drivers AC Motor Speed Control Modules

Use Scenario: Driving 24–48 VDC relays with 50–200 mH coils, requiring fast turn-off and voltage clamping during coil de-energization.

IC Role / Device Role / Timing Role: Freewheeling-integrated switch absorbing inductive kickback without snubbers; toff ≤ 6.55 µs ensures rapid contact release.

Use Value: Built-in diode and tight toff distribution eliminate discrete diode placement errors and reduce board space by >15% versus discrete solutions.

Use Scenario: Phase-controlled AC motor drives for fans or pumps where line-synchronized switching demands stable gain and voltage hold-off.

IC Role / Device Role / Timing Role: High-gain (hFE ≥ 8 at 2 A), high-VCEO (350 V) switch operating in linear and saturated regions with flat gain vs. temperature.

Use Value: Flat hFE and "6 Sigma" lot-to-lot spread ensure consistent gate drive current requirements across batches - simplifying production calibration.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-voltage NPN switching transistor applications.

Alternative Part Technical Difference Application Difference Selection Advice
MJE13003G Lower VCEO (400 V), no integrated diode, higher VCE(sat) (1.2 V min), TO-126 package Requires external freewheeling diode and heatsink mounting; less suitable for space-constrained CFL ballasts Choose when cost sensitivity outweighs integration needs and PCB layout allows discrete diode placement.
BU508AF Higher VCEO (1000 V), no antisaturation network, slower toff (1.2 µs typ), TO-220FP package Designed for TV horizontal deflection; lacks built-in diode and tight switching distribution for lighting control Prefer only for ultra-high-voltage legacy designs where tsi and diode integration are not required.

Compared with MJE13003G and BU508AF, the BUD42DT4 uniquely combines integrated freewheeling diode, antisaturation logic, and DPAK thermal performance - making it the only option among the three qualified for compact, high-reliability electronic ballast designs requiring <7 µs turn-off and <1.0 V saturation.

Availability

BUD42DT4 is available at Aetrix Electronics and suitable for compact fluorescent lamp ballasts, LED driver primary switches, inductive relay drivers, and AC motor speed control modules requiring stable component supply, long-lifecycle support, and Pb-free compliance.

Supply support for BUD42DT4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

onsemi (formerly ON Semiconductor) is a global semiconductor supplier specializing in energy-efficient power management, analog, sensor, and connectivity solutions for automotive, industrial, and consumer markets.

The BUD42DT4 belongs to onsemi's high-voltage bipolar transistor product line, engineered specifically for lighting control and inductive switching applications demanding high VCEO, fast switching, and integrated protection features.

FAQ

What is the maximum clamped inductive voltage the BUD42DT4 can safely handle?

The BUD42DT4 is validated for clamped inductive switching up to 300 V with reverse-biased base (VBE(off) = −1.5 V to −5 V), as defined in its Reverse Bias Safe Operating Area (RBSOA) curve. Its VCEO(sus) rating of 350 Vdc applies under resistive-load test conditions with L = 25 mH. Exceeding 300 V in clamped inductive operation risks second breakdown unless external clamping is added.

Does the BUD42DT4 require an external freewheeling diode in lamp ballast circuits?

No - the BUD42DT4 includes a built-in freewheeling diode between emitter and collector (VEC = 0.9–1.5 V at 1.0 A), eliminating the need for an external diode in standard CFL and LED driver topologies. This integration reduces bill-of-materials count, PCB area, and potential failure points associated with discrete diode placement and solder joint reliability.

How does the antisaturation network in the BUD42DT4 improve switching performance?

The antisaturation network in the BUD42DT4 actively limits base-collector forward bias during turn-on, reducing stored charge and cutting storage time (tsi) to ≤4 µs at hFE = 5. This results in faster turn-off (toff = 4.6–6.55 µs), lower dynamic saturation voltage (VCE(dsat) = 0.35 V at 1 A after 3 s), and reduced switching losses compared to standard NPN transistors without such networks.

What is the thermal resistance from junction to case (RJC) for the BUD42DT4, and how should it be used in heatsink design?

The BUD42DT4 has a maximum RJC of 5.0 °C/W, measured from junction to the exposed collector tab (pins 2 and 4). In heatsink design, this value must be combined with heatsink-to-ambient resistance (RHA) and interface thermal resistance (RINT) to calculate total thermal resistance. For example, at 20 W dissipation and TJ(max) = 150°C, a heatsink with RHA ≤ 4.0 °C/W is required when using a typical thermal pad (RINT ≈ 0.5 °C/W).

Is the BUD42DT4 pin-compatible with other DPAK-packaged transistors like the MJD122 or MJD127?

No - the BUD42DT4 uses a 4-pin DPAK (Case 369C) with dual collector terminals (pins 2 and 4), whereas MJD122/MJD127 use standard 3-pin DPAK (Case 369) with single collector. Pin 1 (base), pin 2 (collector), and pin 3 (emitter) assignments differ, and the BUD42DT4's pin 4 is not present on those parts. PCB layout and footprint must be redesigned to accommodate the 4-terminal configuration and exposed collector tab routing.

BUD42DT4 Specifications

Product attributes
Attribute value
Manufacturer:
onsemi
Series:
-
Package/Case:
TO-252-3, DPAK (2 Leads + Tab), SC-63
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Transistor Type:
NPN
Current - Collector (Ic) (Max):
4 A
Voltage - Collector Emitter Breakdown (Max):
350 V
Vce Saturation (Max) @ Ib, Ic:
1V @ 500mA, 2A
Current - Collector Cutoff (Max):
100µA
DC Current Gain (hFE) (Min) @ Ic, Vce:
10 @ 2A, 5V
Power - Max:
25 W
Frequency - Transition:
-
Operating Temperature:
-65°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
DPAK

BUD42DT4 FAQ

1.How can I place an order for BUD42DT4 through Aetrix?

Please submit a Request for Quotation (RFQ) for BUD42DT4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for BUD42DT4 reliable?

The price and inventory of BUD42DT4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BUD42DT4 is usually 5 days.

3.What payment methods are accepted for BUD42DT4?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BUD42DT4 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for BUD42DT4?

BUD42DT4 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your BUD42DT4 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for BUD42DT4?

For technical support, including BUD42DT4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BUD42DT4 requirements.

6.How does Aetrix verify that BUD42DT4 is sourced from the original manufacturer or authorized distributors?

All BUD42DT4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BUD42DT4 meets industry standards.

7.What is the process for return or replacement of BUD42DT4?

All BUD42DT4 units undergo pre-shipment inspection (PSI). If there is an issue with BUD42DT4, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The BUD42DT4 part is unused and in its original packaging.

Return procedure for BUD42DT4:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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