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NXP Semiconductors BUK1M200-50SDLD,51

Part No.:
BUK1M200-50SDLD,51
Manufacturer:
NXP Semiconductors
Category:
Power Distribution Switches, Load Drivers
Package:
20-SOIC (0.295", 7.50mm Width)
Datasheet:
AetrixBUK1M200-50SDLD,51.pdf
Description:
IC PWR DRIVER N-CHANNEL 1:1 20SO
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,012

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Product details

Overview

BUK1M200-50SDLD from NXP Semiconductors (formerly Philips) is a quad-channel low-side logic-level power MOSFET switch with integrated temperature and overload protection in TOPFET™ technology. It delivers 50 V drain-source voltage rating, ≤200 mΩ RDS(on) at 25 °C, 9.4 W total power dissipation, and operates up to 150 °C junction temperature - designed for driving lamps, solenoids, and DC motors in industrial control modules.

For engineers reviewing the BUK1M200-50SDLD datasheet, BUK1M200-50SDLD pinout, BUK1M200-50SDLD application, or BUK1M200-50SDLD equivalent, key selection considerations include its four independent protected channels, 5 V logic-compatible inputs, latch-reset input-source voltage threshold (1.5–2.9 V), and SO20 (SOT163-1) surface-mount package with thermal resistance of 13.3 K/W when all channels are active.

Technical Context

The BUK1M200-50SDLD integrates four identical low-side TOPFET™ channels, each featuring internal gate drive, current limiting, overtemperature sensing, and overvoltage clamping circuitry. Protection functions operate autonomously per channel using input-supplied bias and reset via input-source voltage reduction below 2.9 V.

Each channel implements crowbar-based short-circuit response (typ. 1.6 ms trip time), drain-current limiting (0.8–1.7 A), and thermal shutdown at 150–165 °C. The device uses TrenchMOS™ die architecture and draws only 100–400 µA input current at 4–5 V, enabling direct microcontroller interfacing without external level-shifting or buffering.

Key Specifications

Parameter Value and Actual Design Meaning
VDS 50 V maximum - supports 24 V industrial bus systems with margin for inductive kickback
RDS(on) ≤200 mΩ at Tsp = 25 °C - enables <1.5 W conduction loss at 1.2 A per channel
Ptot 9.4 W at Tsp ≤25 °C - requires thermal management on PCB for full 4-channel operation
Tj(max) 150 °C - sets thermal design limit for continuous operation under load
ID(lim) 0.8–1.7 A per channel - programmable current limit via input voltage (4–5.5 V range)
td(off) 25–65 µs typical - ensures predictable timing for PWM-controlled loads at ≤10 kHz
VIS(th) 0.6–2.4 V - compatible with 3.3 V and 5 V logic families without pull-up resistors
VESD 2 kV HBM - provides robust handling during automated assembly and field operation

Pinout & Package

Package: SOT163-1 (SO20), 20-pin plastic small-outline surface-mount package, 7.5 mm body width, 13.0 mm × 7.6 mm footprint, with solder-point thermal interface optimized for PCB heat spreading.

Pin/Terminal Circuit Role Design Meaning
D1, D2, D3, D4 Drain terminals (paired per channel) Four independent low-side switch outputs; D1/D2/D3/D4 each connect to load return path
I1, I2, I3, I4 Logic inputs (one per channel) 5 V-tolerant CMOS-compatible control pins; drive current ≤400 µA at 5 V
S1, S2, S3, S4 Source terminals (one per channel) Individual source connections enable independent current sensing or floating load configurations
n.c. (pins 1, 10, 11, 20) No-connect terminals Unused mechanical pads; must remain unconnected per datasheet guidance

Key Features

Feature Design Value
Quad-channel integration Four fully independent protected switches in single SO20 package - reduces board area vs. discrete solutions by >60%
Autonomous overload protection Per-channel current limiting + thermal shutdown + latch/reset via input voltage - eliminates need for external sense resistors or controllers
Inductive load safe turn-off Overfatigue clamping limits voltage spike during inductive load switching - protects against >50 V transients
Microcontroller-direct drive Low 100–400 µA input current at 4–5 V - allows GPIO direct connection without buffer stages or level shifters
ESD-hardened design 2 kV HBM rating on all pins - meets IEC 61000-4-2 Level 2 for industrial environments
Resettable latched protection Input-source voltage drop to ≤2.9 V resets fault state - enables software-controlled recovery without power cycle

Applications

Industrial PLC Output Module Automated Test Equipment (ATE) Load Switching

Use Scenario: Driving 24 V solenoid valves and indicator lamps in modular I/O racks with space-constrained PCB layouts.

IC Role / Device Role / Timing Role: Low-side switch providing isolated, protected output per channel with diagnostic feedback via input-state monitoring.

Use Value: Eliminates need for four separate driver ICs and discrete protection components, reducing BOM count by 12+ parts while maintaining fault tolerance.

Use Scenario: Sequencing power to DUT (device under test) subcircuits during functional validation, requiring precise on/off control and short-circuit resilience.

IC Role / Device Role / Timing Role: Programmable load switch with fast turn-off (≤65 µs) and automatic current-limiting to prevent damage during test fixture miswiring.

Use Value: Enables safe hot-switching of multiple DUT rails without manual intervention or external current monitors.

DC Motor Control for HVAC Actuators Heater Zone Control in Building Management Systems

Use Scenario: Controlling bidirectional 12–24 V DC gearmotor actuators for damper positioning in commercial HVAC units.

IC Role / Device Role / Timing Role: Low-side driver for H-bridge half-bridges, with built-in overtemperature protection preventing thermal runaway during stall conditions.

Use Value: Sustains 1.2 A continuous per channel with self-protection - avoids motor driver failure due to jammed mechanisms or ambient temperature rise.

Use Scenario: Switching resistive heating elements (e.g., PTC heaters) across multiple zones in smart thermostats and energy management panels.

IC Role / Device Role / Timing Role: High-reliability on/off switch with current limiting and thermal cutoff - prevents heater element burnout or fire hazard during open-circuit sensor faults.

Use Value: Integrates protection previously requiring external fuses, thermistors, and comparators - improves system MTBF and simplifies certification.

Equivalent & Alternatives

The following parts are listed as comparable options for similar low-side protected switch applications.

Alternative Part Technical Difference Application Difference Selection Advice
STSPIN250TR Single-channel, 45 V, 1.8 A rated; integrated current regulation but no thermal latch/reset Lacks multi-channel integration and input-voltage reset - requires external MCU polling for fault recovery Preferred for cost-sensitive single-load designs where thermal autonomy is secondary
TPS27082LDR Quad-channel, 36 V, 1.5 A; includes precise current reporting (analog output) but no overvoltage clamping Provides real-time current telemetry but lacks inductive-spike suppression - needs external TVS for solenoid loads Chosen when closed-loop current monitoring is required, and external transient protection is acceptable

Compared with STSPIN250TR and TPS27082LDR, the BUK1M200-50SDLD uniquely combines quad-channel integration, autonomous overvoltage clamping, and input-driven latch reset - making it optimal for space-constrained industrial modules needing self-protecting, software-recoverable switching without auxiliary components.

Availability

BUK1M200-50SDLD is available at Aetrix Electronics and suitable for industrial PLC output modules, HVAC actuator control, and building management system heater zoning requiring stable component supply and long-term lifecycle support.

Supply support for BUK1M200-50SDLD includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with roots in Philips' pioneering analog and power IC development.

The BUK1M200-50SDLD belongs to NXP's legacy TOPFET™ family of intelligent power switches, engineered specifically for ruggedized industrial control systems demanding high reliability, integrated protection, and minimal external component count.

FAQ

What is the maximum continuous drain current per channel for BUK1M200-50SDLD?

The BUK1M200-50SDLD does not specify a single maximum continuous drain current; instead, it features programmable current limiting dependent on input-source voltage. At VIS = 5 V, the typical drain current limit is 1.3 A per channel, with a min/max range of 0.8–1.7 A. This limit is enforced by internal circuitry and remains active until the protection latch is reset by lowering VIS below 2.9 V.

Does BUK1M200-50SDLD support 3.3 V logic-level input control?

Yes, BUK1M200-50SDLD supports 3.3 V logic-level inputs. Its input-source threshold voltage (VIS(th)) ranges from 0.6 V to 2.4 V, and typical operation begins at VIS ≥4 V. At 3.3 V, the device remains in the off-state but retains full ESD protection and latch-reset capability - for reliable turn-on, 4 V minimum is recommended per datasheet Figure 6 and Table 5.

How is thermal protection implemented in BUK1M200-50SDLD?

BUK1M200-50SDLD implements per-channel overtemperature protection with a junction temperature threshold of 150–165 °C. When exceeded, the channel latches off and remains disabled until VIS is reduced to ≤2.9 V for ≥100 µs. Thermal resistance from junction to solder point is 13.3 K/W with all four channels active, requiring adequate copper pour and thermal vias for sustained operation near limits.

Can BUK1M200-50SDLD safely switch inductive loads like solenoids?

Yes, BUK1M200-50SDLD is explicitly designed for inductive load switching. It incorporates "overfatigue clamping" that activates during turn-off to clamp drain-source voltage spikes, with non-repetitive clamping energy rated at 100 mJ. This feature suppresses transients exceeding 50 V, protecting both the device and downstream circuitry without requiring external flyback diodes in many cases.

What is the function of the n.c. pins (1, 10, 11, 20) on BUK1M200-50SDLD?

Pins 1, 10, 11, and 20 on the BUK1M200-50SDLD are designated as "not connected" (n.c.) in the official pin description table. These are mechanical pads with no internal silicon connection. They must remain unconnected in PCB layout - neither grounded nor routed - to avoid unintended coupling or thermal interference, as confirmed in Section 2.1 of the Philips product data sheet Rev. 01.

BUK1M200-50SDLD,51 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
20-SOIC (0.295", 7.50mm Width)
Series:
TOPFET™
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Switch Type:
General Purpose
Number of Outputs:
4
Ratio - Input:Output:
1:1
Output Configuration:
Low Side
Output Type:
N-Channel
Interface:
On/Off
Voltage - Load:
50V (Max)
Voltage - Supply (Vcc/Vdd):
Not Required
Current - Output (Max):
800mA
Rds On (Typ):
150mOhm
Input Type:
Non-Inverting
Features:
-
Fault Protection:
Current Limiting (Fixed), Over Temperature, Over Voltage
Operating Temperature:
150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
20-SO

BUK1M200-50SDLD,51 FAQ

1.How can I place an order for BUK1M200-50SDLD,51 through Aetrix?

Please submit a Request for Quotation (RFQ) for BUK1M200-50SDLD,51 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for BUK1M200-50SDLD,51 reliable?

The price and inventory of BUK1M200-50SDLD,51 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BUK1M200-50SDLD,51 is usually 5 days.

3.What payment methods are accepted for BUK1M200-50SDLD,51?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BUK1M200-50SDLD,51 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for BUK1M200-50SDLD,51?

BUK1M200-50SDLD,51 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your BUK1M200-50SDLD,51 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for BUK1M200-50SDLD,51?

For technical support, including BUK1M200-50SDLD,51 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BUK1M200-50SDLD,51 requirements.

6.How does Aetrix verify that BUK1M200-50SDLD,51 is sourced from the original manufacturer or authorized distributors?

All BUK1M200-50SDLD,51 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BUK1M200-50SDLD,51 meets industry standards.

7.What is the process for return or replacement of BUK1M200-50SDLD,51?

All BUK1M200-50SDLD,51 units undergo pre-shipment inspection (PSI). If there is an issue with BUK1M200-50SDLD,51, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The BUK1M200-50SDLD,51 part is unused and in its original packaging.

Return procedure for BUK1M200-50SDLD,51:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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