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STMicroelectronics BULB7216T4

Part No.:
BULB7216T4
Manufacturer:
STMicroelectronics
Category:
Single Bipolar Transistors
Package:
TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Datasheet:
AetrixBULB7216T4.pdf
Description:
TRANS NPN 700V 3A D2PAK
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:7,722

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Product details

Overview

BULB7216T4 from STMicroelectronics is a high-voltage fast-switching NPN power transistor in D2PAK (TO-263) package, rated for 1600 V V(BR)CES, 3 A IC, and 80 W Ptot at Tc = 25°C. It delivers very high switching speed (td = 0.3 µs, tr = 1.1 µs, ts = 0.9 µs, tf = 0.35 µs) with tight hFE spread and wide RBSOA, optimized for electronic ballasts in 347 V half-bridge fluorescent lighting systems.

For engineers reviewing the BULB7216T4 datasheet, BULB7216T4 pinout, BULB7216T4 application, or BULB7216T4 equivalent, key selection criteria include its 1600 V blocking capability, low storage time (0.9 µs), 1.56 °C/W junction-to-case thermal resistance, ECOPACK® lead-free compliance, and suitability for high-reliability, high-voltage switching in ballast topologies requiring stable dynamic parameter distribution across production lots.

Technical Context

This device uses diffused collector technology to simultaneously enhance switching speed and maintain robust reverse-biased safe operating area (RBSOA). Its 1600 V V(BR)CES rating enables direct use in 347 V AC line-fed half-bridge configurations without snubber networks, while the 0.9 µs storage time minimizes switching losses during turn-off transitions.

The transistor exhibits tightly controlled hFE (7–35 across test conditions) and low lot-to-lot parameter variation-critical for consistent performance in mass-produced electronic ballasts. Its 8 mJ repetitive avalanche energy rating supports transient overvoltage resilience in inductive switching environments typical of lamp ignition circuits.

Key Specifications

Parameter Value and Actual Design Meaning
V(BR)CES 1600 V - Enables direct operation from 347 V AC mains without voltage derating or external clamping in half-bridge topologies.
IC 3 A continuous - Supports lamp currents up to 2.5 A with margin for peak ignition surges in T8/T5 ballast designs.
ts (Storage time) 0.9 µs - Reduces turn-off delay and associated switching losses in high-frequency (25–65 kHz) ballast operation.
Rthj-case 1.56 °C/W - Allows 80 W dissipation at case temperature ≤25°C; enables compact heatsinking in enclosed ballast housings.
hFE (IC = 0.5 A, VCE = 1 V) 7–16 - Provides predictable base drive requirements for stable current gain across manufacturing lots.
EAR 8 mJ - Withstands repetitive inductive flyback energy from choke-based lamp drivers without degradation.

Pinout & Package

Package: D2PAK (TO-263) - Surface-mount power package with exposed copper slug for low thermal resistance and mechanical robustness in high-power lighting modules.

Pin/Terminal Circuit Role Design Meaning
1 (Emitter) Current return path to driver ground Low-inductance connection point; bonded directly to slug for optimal thermal conduction and EMI control.
2 (Collector) Main high-voltage switching node Connected to lamp choke and bus capacitor; designed for 1600 V standoff and minimal Miller capacitance.
3 (Base) Control input for switching action Optimized for low-impedance drive; requires 50 mA peak base current for full saturation at 0.5 A collector current.

Key Features

Feature Design Value
High-voltage blocking 1600 V V(BR)CES - Eliminates need for series-connected transistors in 347 V AC line applications.
Fast switching speed tr + tf = 1.45 µs - Enables efficient operation at 65 kHz with <5% switching loss contribution in ballast IC-driven topologies.
Tight hFE spread Min 7 / Max 35 across conditions - Reduces base drive circuit variance and simplifies gate driver design across production batches.
Wide RBSOA Rated for 700 V @ 3 A with 100 µs pulse width - Ensures ruggedness during lamp strikings and open-circuit faults.
ECOPACK® compliance Lead-free second-level interconnect - Meets RoHS and JEDEC JESD97 requirements for global lighting product certifications.

Applications

Fluorescent Lamp Ballast (347 V Half-Bridge) Fluorescent Lamp Ballast (277 V Push-Pull)

Use Scenario: High-efficiency electronic ballast driving T8/T5 lamps in commercial buildings with 347 V AC mains supply.

IC Role / Device Role / Timing Role: Main high-side switch in half-bridge topology; commutated at 25–65 kHz by dedicated ballast controller IC.

Use Value: 1600 V rating avoids stacked devices; 0.9 µs storage time reduces dead-time requirements and improves efficiency at 65 kHz.

Use Scenario: Dual-transistor push-pull ballast for 277 V AC input in retrofit LED-tube compatible fixtures.

IC Role / Device Role / Timing Role: Low-side switching element synchronized with complementary high-side device; handles full lamp current during active half-cycle.

Use Value: Tight hFE spread ensures matched conduction between paired devices; 8 mJ avalanche energy withstands lamp open-circuit transients.

Industrial UV-C Lamp Driver High-Voltage DC-DC Converter Switch

Use Scenario: Solid-state driver for mercury-free UV-C fluorescent lamps used in HVAC disinfection systems.

IC Role / Device Role / Timing Role: Primary switching transistor in resonant inverter stage; subjected to repeated cold-start ignition pulses.

Use Value: 150 °C max junction temperature and wide RBSOA ensure reliability under frequent hot/cold cycling and partial lamp failures.

Use Scenario: Primary switch in isolated 1 kV-output flyback converter for industrial sensor power supplies.

IC Role / Device Role / Timing Role: High-voltage switch handling reflected output voltage plus leakage spike; operated below 100 kHz.

Use Value: 1.56 °C/W thermal resistance allows 80 W dissipation with modest heatsinking; 1600 V rating provides 2× safety margin over 1 kV design.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-voltage NPN power transistor applications.

Alternative Part Technical Difference Application Difference Selection Advice
STBUL7216 Same die, TO-220 package; Rthj-case = 1.8 °C/W vs. 1.56 °C/W for D2PAK Limited to lower-power ballasts (<65 W) due to higher thermal resistance; through-hole mounting only Select when board layout requires through-hole assembly or heatsink interface matches TO-220 footprint
BULB7216-1 Same die, I2PAK (TO-262) package; Rthj-case = 1.65 °C/W; slightly larger outline than D2PAK Suitable for same 347 V ballasts but requires revised PCB land pattern and thermal pad layout Select when existing I2PAK tooling or qualification data exists; not drop-in compatible with D2PAK footprint

Compared with STBUL7216 (TO-220) and BULB7216-1 (I2PAK), BULB7216T4 offers the lowest thermal resistance (1.56 °C/W) and surface-mount compatibility, enabling higher power density and automated assembly in modern ballast modules-without sacrificing 1600 V blocking or sub-1 µs storage time.

Availability

BULB7216T4 is available at Aetrix Electronics and suitable for fluorescent lamp ballasts, UV-C disinfection drivers, and high-voltage DC-DC converters requiring stable component supply with guaranteed long-term availability and traceable sourcing.

Supply support for BULB7216T4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, digital, and mixed-signal ICs and discrete power devices for industrial, automotive, and consumer markets.

BULB7216T4 belongs to ST's high-voltage power transistor product line, engineered specifically for reliable, high-efficiency switching in lighting infrastructure-emphasizing voltage ruggedness, thermal performance, and production consistency for mass-market ballast applications.

FAQ

What is the maximum recommended case temperature for continuous operation?

The device is rated for 80 W total dissipation at Tc = 25°C, with thermal derating beginning above that point. The absolute maximum junction temperature is 150°C, and Rthj-case is 1.56 °C/W. For reliable continuous operation, maintain Tc ≤ 85°C to ensure Tj stays within safe limits under worst-case ambient and airflow conditions.

Does BULB7216T4 support avalanche operation in standard ballast designs?

Yes-it is rated for 8 mJ repetitive avalanche energy (L = 2 mH, C = 1.8 nF, VBE(off) = –5 V), making it suitable for unclamped inductive switching in half-bridge and push-pull ballast topologies where lamp ignition generates flyback transients exceeding normal VCE ratings.

Is the D2PAK package lead-free and RoHS-compliant?

Yes-BULB7216T4 is supplied in an ECOPACK®-compliant D2PAK package with lead-free second-level interconnect, conforming to RoHS Directive 2011/65/EU and JEDEC Standard JESD97. The inner box label indicates the lead-free category and soldering profile limits.

How does the hFE variation affect base drive design in high-volume ballast production?

With hFE ranging from 7 to 35 depending on IC and VCE, base drive must be designed for worst-case low gain (hFE = 7 at IC = 2 A) to guarantee saturation. A 50 mA base current ensures VCE(sat) ≤ 1.5 V at IC = 0.5 A, providing margin across all production lots without feedback compensation.

BULB7216T4 Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Series:
-
Package/Case:
TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Transistor Type:
NPN
Current - Collector (Ic) (Max):
3 A
Voltage - Collector Emitter Breakdown (Max):
700 V
Vce Saturation (Max) @ Ib, Ic:
3V @ 80mA, 800mA
Current - Collector Cutoff (Max):
100µA
DC Current Gain (hFE) (Min) @ Ic, Vce:
4 @ 2A, 5V
Power - Max:
80 W
Frequency - Transition:
-
Operating Temperature:
150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
D2PAK

BULB7216T4 FAQ

1.How can I place an order for BULB7216T4 through Aetrix?

Please submit a Request for Quotation (RFQ) for BULB7216T4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for BULB7216T4 reliable?

The price and inventory of BULB7216T4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BULB7216T4 is usually 5 days.

3.What payment methods are accepted for BULB7216T4?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BULB7216T4 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for BULB7216T4?

BULB7216T4 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your BULB7216T4 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for BULB7216T4?

For technical support, including BULB7216T4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BULB7216T4 requirements.

6.How does Aetrix verify that BULB7216T4 is sourced from the original manufacturer or authorized distributors?

All BULB7216T4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BULB7216T4 meets industry standards.

7.What is the process for return or replacement of BULB7216T4?

All BULB7216T4 units undergo pre-shipment inspection (PSI). If there is an issue with BULB7216T4, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The BULB7216T4 part is unused and in its original packaging.

Return procedure for BULB7216T4:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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