Nexperia USA Inc. BZB984-C3V0,115

Overview

BZB984-C3V0,115 from Nexperia is a dual Zener voltage regulator diode in SOT663 package with nominal 3.0 V regulation voltage (±5% tolerance), 80 Ω typical differential resistance at I_Z = 5 mA, and 10 µA maximum reverse current at V_R = 2.8 V. It delivers low-power regulation and ESD protection in space-constrained consumer and industrial PCBs.

For engineers reviewing the BZB984-C3V0,115 datasheet, BZB984-C3V0,115 pinout, BZB984-C3V0,115 application, or BZB984-C3V0,115 equivalent, key selection criteria include common-anode dual-Zener topology, 425 mW total power dissipation (2 diodes loaded), thermal resistance of 294 K/W (junction-to-ambient, free air), and SOT663 footprint compatibility with high-density reflow assembly.

Technical Context

This device integrates two independent Zener diodes sharing a common anode terminal, enabling bidirectional clamping or dual-rail regulation from a single ultra-small SMD package. Its 3.0 V nominal Zener voltage targets low-voltage logic rail stabilization and I/O line protection in 3.3 V systems.

The ±5% V_Z tolerance, 1.6 mV/K temperature coefficient at I_Z = 5 mA, and 0.9 V forward voltage at I_F = 10 mA define its precision and conduction behavior under both reverse and forward bias - critical for transient suppression and level-shifting functions.

Key Specifications

Pinout & Package

SOT663 is a 3-terminal ultra-small flat plastic surface-mount package (1.7 × 1.5 × 0.5 mm) with gull-wing leads optimized for high-density reflow assembly and minimal board area consumption.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-Zener regulation applications.

Compared with DMN2016LFG-7 and BZX84-C3V0,215, the BZB984-C3V0,115 uniquely delivers matched dual-Zener performance in one SOT663 footprint - reducing component count, improving thermal coupling between diodes, and enabling compact bidirectional protection without inter-device matching drift.

Availability

BZB984-C3V0,115 is available at Aetrix Electronics and suitable for USB interface protection, 3.3 V LDO feedback stabilization, and IoT sensor reference applications requiring stable component supply and long-term obsolescence management.

Supply support for BZB984-C3V0,115 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert specializing in high-performance, energy-efficient components for automotive, industrial, and consumer electronics - with leadership in logic, discrete, and MOSFET technologies.

The BZB984 series belongs to Nexperia's precision Zener diode product line, engineered for low-power voltage regulation and ESD protection in miniaturized, high-reliability PCB designs where space and thermal constraints dominate.

FAQ

What is the maximum non-repetitive peak reverse power dissipation for BZB984-C3V0,115?

The device supports up to 40 W non-repetitive peak reverse power dissipation (P_ZSM) at t_p = 100 µs and T_amb = 25 °C, as defined in Table 5 of the datasheet. This rating enables robust transient suppression for ESD and surge events without permanent degradation when applied within specified pulse limits.

Can BZB984-C3V0,115 be used in automotive applications?

No - the BZB984 series is explicitly marked as non-automotive qualified in the revision history (Section 13). It has not undergone AEC-Q101 stress testing or automotive-grade qualification, and Nexperia disclaims liability for use in safety-critical or automotive environments per legal disclaimers in Section 14.

How does the common-anode configuration affect PCB layout?

The CA (Pin 3) must connect to a stable reference plane - typically GND for clamping or V_CC for reverse-biased regulation. K1 and K2 (Pins 1 and 2) route independently to protected nodes, allowing asymmetric trace lengths without compromising clamping symmetry due to shared internal anode metallization.

What is the thermal resistance from junction to solder point for this device?

R_th(j-sp) is 125 K/W for two diodes loaded, measured at the cathode tab solder joint (Section 9, Table 6). This value assumes standard FR4 PCB with single-sided copper and tin-plated finish, and directly informs heatsinking strategy when mounting on thermal pads or copper pours.