Taiwan Semiconductor Corporation BZD17C200PH

Overview

BZD17C200PH from Taiwan Semiconductor is a single-die, AEC-Q101-qualified silicon Zener diode in Sub SMA package, with nominal zener voltage 200 V (min 188 V, max 212 V), 0.8 W power dissipation at 25°C, 4 μA reverse current at 150 V, and 350 Ω typical differential resistance. It serves as a precision voltage reference and overvoltage protection device in automotive power supply monitoring circuits.

For engineers reviewing the BZD17C200PH datasheet, BZD17C200PH pinout, BZD17C200PH application, or BZD17C200PH equivalent, key selection criteria include its 200 V zener tolerance (±6%), low leakage at rated VR, thermal stability up to 175°C junction temperature, and compliance with JESD201 Class 2 whisker testing for under-hood automotive use.

Technical Context

The BZD17C200PH operates as a voltage-regulating element using avalanche breakdown mechanism, optimized for stable reference generation in high-voltage DC rails. Its 350 Ω differential resistance and ±0.09 %/°C temperature coefficient ensure minimal drift across temperature in feedback networks.

Designed for surface-mount assembly on 5 mm × 5 mm copper pads, it delivers 300 W non-repetitive surge capability (100 μs pulse) and 180 °C/W junction-to-ambient thermal resistance - enabling robust transient suppression without heatsinking in space-constrained modules.

Key Specifications

Pinout & Package

Sub SMA package: surface-mount, single-anode/single-cathode configuration with cathode band marking; 0.019 g mass; UL 94V-0 molding compound; matte tin-plated leads.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Zener diode applications.

Compared with BZX84-C200 and BZT52-B200, the BZD17C200PH uniquely combines AEC-Q101 qualification, 300 W transient rating, and Sub SMA thermal performance - making it the only option qualified for under-hood automotive clamping where both reliability and surge margin are mandatory.

Availability

BZD17C200PH is available at Aetrix Electronics and suitable for automotive load dump protection, high-voltage reference design, and industrial overvoltage lockout applications requiring stable component supply with full traceability and long-term lifecycle support.

Supply support for BZD17C200PH includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and discrete semiconductor manufacturer headquartered in Hsinchu, Taiwan, specializing in high-reliability power devices and protection components.

The BZD17C series is part of TSC's AEC-Q101-qualified Zener portfolio, engineered specifically for automotive and industrial voltage regulation and transient suppression where thermal robustness and long-term parametric stability are critical.

FAQ

What is the exact zener voltage tolerance of BZD17C200PH at 4 mA test current?

The BZD17C200PH has a guaranteed zener voltage range of 188 V to 212 V at I_ZT = 4 mA, representing a ±6% tolerance around the nominal 200 V rating. This specification is verified per the manufacturer's electrical characteristics table and applies across the full operating temperature range of –55°C to +175°C junction temperature.

Does BZD17C200PH support automotive-grade reliability requirements?

Yes, the BZD17C200PH is explicitly AEC-Q101 qualified and meets JESD201 Class 2 whisker testing, moisture sensitivity level 1, and UL 94V-0 flammability standards. These qualifications confirm its suitability for automotive powertrain, body control, and ADAS applications where long-term reliability under thermal and mechanical stress is mandatory.

What is the maximum non-repetitive surge power the BZD17C200PH can withstand?

The BZD17C200PH is rated for 300 W non-repetitive peak pulse power dissipation under 100 μs square-wave conditions with T_J = 25°C prior to surge. This rating enables effective clamping of ISO 7637-2 load dump transients and ESD events without permanent parameter shift or failure.

How does the thermal performance of BZD17C200PH compare between junction-to-lead and junction-to-ambient?

The BZD17C200PH has R_θJL = 30 °C/W and R_θJA = 180 °C/W (measured on 5 mm × 5 mm Cu pad). The 6× lower junction-to-lead resistance indicates efficient heat transfer to the PCB copper, making thermal design highly dependent on pad layout - unlike junction-to-ambient, which assumes still air and minimal copper.

Is BZD17C200PH halogen-free and RoHS compliant?

Yes, the BZD17C200PH uses halogen-free molding compound per IEC 61249-2-21 and is fully RoHS compliant. These material attributes are documented in the mechanical data section and confirmed in the product's ordering information and compliance notices.