Taiwan Semiconductor Corporation BZD17C39P

Overview

BZD17C39P from Taiwan Semiconductor is a 0.8 W surface-mount silicon Zener diode with a nominal zener voltage of 39 V (37–41 V range), 21 Ω typical differential resistance, and ±0.06 %/°C temperature coefficient; it delivers stable voltage regulation in power supply feedback loops and overvoltage protection circuits for industrial DC-DC converters.

For engineers reviewing the BZD17C39P datasheet, BZD17C39P pinout, BZD17C39P application, or BZD17C39P equivalent, key selection criteria include its Sub SMA package thermal performance (R_θJA = 180 °C/W on 5 mm × 5 mm Cu pad), 10 µA max reverse leakage at 30 V, and 300 W non-repetitive surge capability under 100 µs pulses - critical for transient suppression in automotive body electronics and industrial sensor interfaces.

Technical Context

The BZD17C39P operates as a single-die, unidirectional Zener diode optimized for precision voltage reference and clamping functions. Its design targets stable operation across –55 °C to +175 °C junction temperature, with low leakage (≤1.0 µA @ VR = 30 V) and tight V_Z tolerance (±5.1% at I_ZT = 10 mA).

It features matte tin-plated leads compliant with J-STD-002 solderability, meets JESD201 Class 2 whisker resistance, and carries moisture sensitivity level 1 per J-STD-020 - enabling standard reflow without dry-pack handling in high-volume SMT assembly.

Key Specifications

Pinout & Package

Package: Sub SMA - low-profile surface-mount case with cathode band polarity marking; UL 94V-0 molding compound; 0.019 g weight; RoHS and halogen-free compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Zener diode applications.

Compared with BZX84-C39 and BZT52-B39, the BZD17C39P offers 60% higher power rating and 40% lower dynamic resistance in a thermally superior Sub SMA package - making it preferred for industrial-grade voltage regulation where long-term stability and surge resilience are mandatory.

Availability

BZD17C39P is available at Aetrix Electronics and suitable for industrial power supplies, automotive body electronics, medical sensor biasing, and smart metering systems requiring stable component supply with full traceability and extended lifecycle support.

Supply support for BZD17C39P includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Taiwan Semiconductor Corporation (TSC) is a vertically integrated semiconductor manufacturer specializing in discrete power devices, analog ICs, and protection components for industrial, automotive, and consumer markets.

The BZD17C series is part of TSC's high-reliability Zener diode product line designed specifically for stable voltage reference and transient suppression in thermally demanding, high-volume SMT applications.

FAQ

What is the exact zener voltage range for BZD17C39P at test current?

The BZD17C39P has a guaranteed zener voltage range of 37 V to 41 V when measured at I_ZT = 10 mA, per Taiwan Semiconductor's L2103 datasheet revision. This 4 V window reflects ±5.1% tolerance around the nominal 39 V rating and is validated under TA = 25°C conditions with specified test setup compliance.

Does BZD17C39P support lead-free reflow soldering?

Yes, BZD17C39P features matte tin-plated leads qualified to J-STD-002 for solderability and is rated for standard lead-free reflow profiles (peak ≤260°C). Its Sub SMA package is moisture sensitivity level 1 (J-STD-020), eliminating pre-bake requirements and supporting direct placement into high-throughput SMT lines.

What is the maximum allowable reverse voltage before breakdown for BZD17C39P?

The BZD17C39P exhibits ≤1.0 µA reverse leakage current at V_R = 30 V, meaning it remains effectively non-conductive up to that voltage. Breakdown begins near 37 V, so 30 V serves as the safe maximum reverse bias for blocking-mode operation without significant conduction.

How does the thermal resistance of BZD17C39P compare between junction-to-lead and junction-to-ambient?

The BZD17C39P has R_θJL = 30 °C/W and R_θJA = 180 °C/W (on 5 mm × 5 mm Cu pad). This 6× difference confirms that efficient heat transfer to the PCB copper is essential - using internal layers or thermal vias beneath the pad significantly improves power handling beyond the 0.8 W nominal rating.

Can BZD17C39P be used as a substitute for BZD17C36P in an existing design?

Substituting BZD17C39P for BZD17C36P shifts the zener voltage from 34–38 V to 37–41 V - a +3 V nominal increase. While both share identical Sub SMA packaging and thermal specs, this change affects regulation setpoints and clamping thresholds; redesign validation is required for feedback networks or overvoltage trip logic dependent on exact V_Z.