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Taiwan Semiconductor Corporation BZT52B3V0 RHG
- Part No.:
- BZT52B3V0 RHG
- Manufacturer:
- Taiwan Semiconductor Corporation
- Category:
- Single Zener Diodes
- Package:
- SOD-123F
- Datasheet:
-
BZT52B3V0 RHG.pdf
- Description:
- DIODE ZENER 3V 500MW SOD123F
- Quantity:
- Payment:
- Shipping:
Inventory:5,775
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Product details
Overview
BZT52B3V0 RHG from Taiwan Semiconductor is a surface-mount 3.0 V ±2% tolerance Zener diode in SOD-123F package, rated for 500 mW power dissipation, with 2.94–3.06 V zener voltage at 5 mA test current, 100 Ω dynamic impedance at IZT, and 9 µA maximum reverse leakage at 1 V. It serves as a precision voltage reference or overvoltage clamp in low-power analog and digital supply rails.
For engineers reviewing the BZT52B3V0 RHG datasheet, BZT52B3V0 RHG pinout, BZT52B3V0 RHG application, or BZT52B3V0 RHG equivalent, key selection criteria include its ±2% VZ tolerance, 500 mW thermal rating, SOD-123F footprint compatibility, RoHS-compliant matte tin/Ni finish, and guaranteed high-temperature soldering (260°C/10s).
Technical Context
The BZT52B3V0 RHG operates as a silicon planar Zener diode with controlled avalanche breakdown at nominal 3.0 V, optimized for stable regulation under low-current conditions (IZT = 5 mA). Its junction temperature range spans −65°C to +150°C, and thermal resistance RθJA is 350°C/W under standard PCB mounting conditions.
It features a cathode band polarity indicator, moisture sensitivity level 1, and halogen-free construction per IEC 61249-2-21. The device exhibits 1 µA reverse current at 1 V (VR) and maintains ≤1 V forward voltage at 10 mA, supporting bidirectional signal conditioning and ESD-adjacent protection roles.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VZ @ IZT | 2.94–3.06 V at 5 mA - ensures tight 3.0 V reference stability for low-dropout LDO feedback or ADC reference scaling |
| PD | 500 mW - supports continuous regulation in compact SMD layouts without forced cooling |
| ZZT @ IZT | 100 Ω - limits output voltage deviation under load transients in precision bias networks |
| IR @ VR = 1 V | 9 µA max - minimizes quiescent current drain in battery-powered sensor nodes |
| TJ Range | −65°C to +150°C - enables operation in automotive under-hood and industrial control environments |
| Package | SOD-123F - 3.3–3.9 mm length, 1.5–1.7 mm width, compatible with standard 0805 reflow profiles |
| RoHS/Lead-Free | Pb-free, matte tin/Ni plating - meets IPC-J-STD-020 moisture sensitivity level 1 and JEDEC reflow standards |
Pinout & Package
SOD-123F package: flat lead, surface-mount plastic case with cathode band marking; dimensions: 3.6 mm × 1.6 mm × 1.0 mm (L×W×H), weight 8.85 ± 0.5 mg.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Anode | Forward conduction terminal / Zener cathode reference ground | Connected to circuit ground or lower-potential node when used in shunt regulation |
| Cathode | Zener breakdown terminal / voltage reference output | Connected to regulated node; cathode band identifies this terminal visually and on PCB silkscreen |
Key Features
| Feature | Design Value |
|---|---|
| ±2% VZ tolerance | Enables direct replacement in 3.0 V reference designs without recalibration or resistor trimming |
| 500 mW power rating | Supports sustained 3.0 V clamping at up to 166 mA (P/V) in transient suppression applications |
| SOD-123F footprint | Matches industry-standard 0805 land pattern, enabling drop-in use in space-constrained PCBs |
| Halogen-free & RoHS | Complies with IEC 61249-2-21 and Directive 2011/65/EU for green manufacturing and end-of-life handling |
Applications
| USB Port ESD Clamp | Microcontroller Reset Circuit |
|---|---|
Use Scenario: Protects USB D+/D− lines from ±8 kV contact ESD per IEC 61000-4-2 using low-capacitance Zener clamping. IC Role / Device Role / Timing Role: Bidirectional shunt clamp referenced to VCONN/GND, operating below 3.3 V logic threshold. Use Value: BZT52B3V0 RHG's 3.0 V VZ and 9 µA IR ensure minimal signal loading while clamping transients before IC damage. | Use Scenario: Generates clean 3.0 V reset threshold for ARM Cortex-M0+ microcontrollers during brown-out events. IC Role / Device Role / Timing Role: Precision voltage reference input to dedicated reset supervisor IC (e.g., TPS3808). Use Value: ±2% VZ tolerance guarantees reset assertion within 2.94–3.06 V, meeting MCU spec limits without external resistors. |
| Low-Power Sensor Bias | ADC Reference Divider |
Use Scenario: Provides stable 3.0 V bias for MEMS pressure sensor excitation in battery-operated IoT nodes. IC Role / Device Role / Timing Role: Low-quiescent shunt regulator sourcing <100 µA to sensor bridge. Use Value: 9 µA IR at 1 V and 100 Ω ZZT minimize battery drain and maintain <1 mV output drift across temperature. | Use Scenario: Scales 5 V system rail to 3.0 V reference for 12-bit SAR ADC (e.g., ADS7950) requiring precise input range. IC Role / Device Role / Timing Role: Passive voltage divider top element with matched tolerance and thermal tracking. Use Value: Tight 2.94–3.06 V window ensures full-scale ADC codes map accurately to 0–3.0 V, reducing calibration overhead. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Zener diode applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MMBZ5223BS-7-F | 3.0 V ±5%, 350 mW rating, SOT-23 package, higher ZZT (150 Ω) | Less precise regulation; requires larger board area due to SOT-23 footprint | Choose when cost priority outweighs voltage accuracy and board space is unconstrained |
| 1N4723TR | 3.3 V nominal, ±5%, 1 W rating, DO-41 through-hole package | Higher power but incompatible SMT assembly; 3.3 V VZ shifts ADC reference by +100 mV | Choose only for legacy through-hole designs where 3.3 V tolerance is acceptable |
Compared with MMBZ5223BS-7-F and 1N4723TR, the BZT52B3V0 RHG delivers tighter ±2% voltage control, higher power density in SOD-123F, and lower leakage-making it optimal for modern space- and accuracy-critical SMT systems.
Availability
BZT52B3V0 RHG is available at Aetrix Electronics and suitable for USB interface protection, microcontroller reset supervision, and low-power sensor biasing requiring stable component supply across automotive, industrial, and consumer electronics programs.
Supply support for BZT52B3V0 RHG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Taiwan Semiconductor is a vertically integrated analog and discrete semiconductor manufacturer headquartered in Hsinchu, Taiwan, specializing in high-reliability small-signal devices for global industrial and automotive markets.
The BZT52B3V0 RHG belongs to Taiwan Semiconductor's Small Signal Product line, engineered for precision voltage regulation and transient suppression in compact, thermally constrained SMT applications.
FAQ
What is the zener voltage tolerance of the BZT52B3V0 RHG?
The BZT52B3V0 RHG has a zener voltage tolerance of ±2% at 5 mA test current, yielding a guaranteed VZ range of 2.94 V to 3.06 V. This tight tolerance is confirmed in the DS_S1405026 datasheet and enables direct use in applications requiring high reference accuracy without external trimming components.
What package type does the BZT52B3V0 RHG use?
The BZT52B3V0 RHG uses the SOD-123F surface-mount package, measuring 3.6 mm × 1.6 mm × 1.0 mm with a cathode band for polarity identification. Its matte tin/Ni lead finish complies with MIL-STD-202 Method 208 and supports reflow soldering up to 260°C for 10 seconds.
What is the maximum power dissipation rating for the BZT52B3V0 RHG?
The BZT52B3V0 RHG is rated for 500 mW maximum power dissipation at 25°C ambient temperature. Derating begins above 25°C at 3.57 mW/°C (based on RθJA = 350°C/W), allowing ~350 mW at 65°C ambient-sufficient for most low-power regulation and clamping tasks.
Does the BZT52B3V0 RHG meet RoHS and halogen-free requirements?
Yes, the BZT52B3V0 RHG is Pb-free and RoHS compliant per Directive 2011/65/EU, with halogen-free construction certified to IEC 61249-2-21. The "G" suffix in RHG explicitly denotes green compound, and the matte tin/Ni underplate ensures solderability and long-term reliability.
What is the reverse leakage current specification for the BZT52B3V0 RHG?
The BZT52B3V0 RHG specifies a maximum reverse leakage current (IR) of 9 µA at 1 V reverse voltage and 25°C ambient. This low leakage supports energy-sensitive applications such as battery-backed sensors and always-on monitoring circuits where standby current must remain sub-10 µA.
BZT52B3V0 RHG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Taiwan Semiconductor Corporation
- Series:
- -
- Package/Case:
- SOD-123F
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Voltage - Zener (Nom) (Vz):
- 3 V
- Tolerance:
- ±2%
- Power - Max:
- 500 mW
- Impedance (Max) (Zzt):
- 100 Ohms
- Current - Reverse Leakage @ Vr:
- 9 µA @ 1 V
- Voltage - Forward (Vf) (Max) @ If:
- 1 V @ 10 mA
- Operating Temperature:
- 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- SOD-123F
BZT52B3V0 RHG FAQ
1.How can I place an order for BZT52B3V0 RHG through Aetrix?
Please submit a Request for Quotation (RFQ) for BZT52B3V0 RHG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BZT52B3V0 RHG reliable?
The price and inventory of BZT52B3V0 RHG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BZT52B3V0 RHG is usually 5 days.
3.What payment methods are accepted for BZT52B3V0 RHG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BZT52B3V0 RHG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BZT52B3V0 RHG?
BZT52B3V0 RHG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BZT52B3V0 RHG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BZT52B3V0 RHG?
For technical support, including BZT52B3V0 RHG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BZT52B3V0 RHG requirements.
6.How does Aetrix verify that BZT52B3V0 RHG is sourced from the original manufacturer or authorized distributors?
All BZT52B3V0 RHG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BZT52B3V0 RHG meets industry standards.
7.What is the process for return or replacement of BZT52B3V0 RHG?
All BZT52B3V0 RHG units undergo pre-shipment inspection (PSI). If there is an issue with BZT52B3V0 RHG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BZT52B3V0 RHG part is unused and in its original packaging.
Return procedure for BZT52B3V0 RHG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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