Diodes Incorporated BZT52C16-13

Overview

BZT52C16-13 from Diodes Incorporated is a surface-mount 16 V Zener diode in SOD123 package, rated for 500 mW power dissipation at TL = +75°C and 370 mW at TA = +25°C, with 40 Ω maximum Zener impedance at 5 mA test current and ±5% voltage tolerance (15.3–17.1 V). It serves as a precision voltage reference or overvoltage clamp in low-power DC supply rails and signal conditioning circuits.

For engineers reviewing the BZT52C16-13 datasheet, BZT52C16-13 pinout, BZT52C16-13 application, or BZT52C16-13 equivalent, key selection criteria include Zener voltage accuracy, thermal resistance (RθJA = 338 °C/W), reverse leakage (<0.1 µA at 10.4 V), temperature coefficient (+11.2 mV/°C), and AEC-Q101 qualification for automotive-grade reliability.

Technical Context

This Zener diode operates in reverse breakdown mode with a nominal 16 V regulation point at 5 mA test current, exhibiting low dynamic impedance (40 Ω) and tight voltage tolerance (±5%) to ensure stable reference performance under varying load and temperature conditions. Its planar die construction and SOD123 package support high-reliability automated assembly.

The device features a positive temperature coefficient of +11.2 mV/°C, enabling predictable drift compensation in temperature-sensitive references, and maintains <0.1 µA reverse leakage at VR = 10.4 V - critical for low-power standby circuits and precision bias networks.

Key Specifications

Pinout & Package

Package: SOD123 - surface-mount plastic case with cathode band marking, 0.010 g weight, UL 94V-0 flammability rating, and matte tin-plated Alloy 42 leadframe for RoHS-compliant solderability.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Zener diode applications.

Compared with MMBZ5245BS-7-F, BZT52C16-13 provides 85% higher power rating and lower impedance in a robust SOD123 package; versus 1N4744A, it offers surface-mount compatibility, tighter voltage tolerance, and automotive qualification - making it optimal for modern automotive and industrial PCBs.

Availability

BZT52C16-13 is available at Aetrix Electronics and suitable for automotive body control units, industrial sensor signal conditioning, and low-power medical monitor reference circuits requiring stable component supply and full traceability.

Supply support for BZT52C16-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-reliability components for automotive, industrial, and consumer markets.

The BZT52 series belongs to Diodes' general-purpose Zener diode product line, designed specifically for cost-effective, AEC-Q101-qualified voltage regulation and clamping in space-constrained surface-mount applications.

FAQ

What is the maximum reverse leakage current for BZT52C16-13 at 10.4 V?

The maximum reverse leakage current is 0.1 µA at VR = 10.4 V and TA = +25°C, as specified in the Electrical Characteristics table. This ultra-low leakage supports energy-efficient designs where standby current must be minimized, such as battery-backed systems and always-on sensor nodes.

Is BZT52C16-13 suitable for automotive applications?

Yes - BZT52C16-13 is qualified to AEC-Q101 standards, with operating temperature range from -65°C to +150°C and rigorous stress testing for high-reliability automotive use, including engine control, lighting, and body electronics modules.

How does the +11.2 mV/°C temperature coefficient affect circuit design?

The positive temperature coefficient means the Zener voltage increases by 11.2 mV per degree Celsius rise in junction temperature. Designers must account for this drift in precision references - for example, a 50°C rise adds ~560 mV to the 16 V nominal value, requiring thermal derating or compensation in wide-temperature applications.

What is the recommended PCB pad layout for SOD123 mounting?

The manufacturer specifies a pad layout with X = 0.900 mm, X1 = 4.050 mm, and Y = 0.950 mm (all dimensions in mm). This geometry ensures proper solder fillet formation, mechanical stability, and thermal relief for the 338 °C/W RθJA rating on FR-4 boards with 1-inch copper pads.