Taiwan Semiconductor Corporation BZT52C33-G RHG

Overview

BZT52C33-G RHG from Taiwan Semiconductor is a 33 V ±5% tolerance surface-mount Zener diode in SOD-123 package, rated for 350 mW power dissipation, with 80 Ω dynamic impedance at 2 mA test current and 0.1 µA leakage current at 23.1 V reverse voltage. It serves as a precision voltage reference or overvoltage clamp in low-power regulation circuits.

For engineers reviewing the BZT52C33-G RHG datasheet, BZT52C33-G RHG pinout, BZT52C33-G RHG application, or BZT52C33-G RHG equivalent, key selection criteria include nominal Zener voltage (33 V), tight 5% tolerance, SOD-123 footprint compatibility, thermal resistance (357 °C/W), and low leakage performance under sub-Zener bias conditions.

Technical Context

This Zener diode operates in reverse breakdown mode to maintain stable voltage across its terminals under controlled current. Its 33 V nominal Zener voltage is specified at 2 mA test current (IZT), with dynamic impedance of 80 Ω and knee impedance of 325 Ω at 0.5 mA (IZK).

The device features a single-die configuration in an SOD-123 plastic package with matte tin-plated leads, rated for junction temperatures from –55 °C to +150 °C and compliant with J-STD-020 moisture sensitivity level 1.

Key Specifications

Pinout & Package

Package: SOD-123 - surface-mount plastic case with cathode band marking; dimensions per JEDEC DO-213AA; weight ≈10.55 mg.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Zener diode applications.

Compared with MMBZ5265B-7-F and 1N4748A, the BZT52C33-G RHG offers optimal balance of SMT compatibility, low leakage (0.1 µA), and industry-standard SOD-123 footprint-making it ideal for high-volume, space-constrained consumer and industrial PCBs where reflow process control and moisture resilience are critical.

Availability

BZT52C33-G RHG is available at Aetrix Electronics and suitable for power supply rail clamp, microcontroller I/O protection, and low-power sensor excitation applications requiring stable component supply and full traceability.

Supply support for BZT52C33-G RHG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Taiwan Semiconductor Corporation (TSC) is a vertically integrated semiconductor manufacturer specializing in discrete devices, analog ICs, and power management solutions for industrial, computing, and consumer markets.

The BZT52C series is part of TSC's standard Zener diode portfolio designed for general-purpose voltage regulation and protection in cost-sensitive, high-reliability surface-mount applications.

FAQ

What is the Zener voltage tolerance for BZT52C33-G RHG?

The BZT52C33-G RHG has a nominal Zener voltage of 33 V with a guaranteed tolerance of ±5%, meaning the actual breakdown voltage falls between 31.0 V and 35.0 V when tested at 2 mA. This tolerance is confirmed in the Electrical Specifications table on page 2 of the official Taiwan Semiconductor datasheet (Version C2007). The BZT52C33-G RHG maintains this specification across its qualified operating temperature range.

What package type does BZT52C33-G RHG use?

The BZT52C33-G RHG uses the SOD-123 surface-mount package, as explicitly stated in the Ordering Information section and Package Outline Dimensions page of the Taiwan Semiconductor datasheet. It features matte tin-plated leads, meets J-STD-002 solderability standards, and carries a moisture sensitivity level (MSL) of 1 per J-STD-020-eliminating pre-reflow baking requirements. The BZT52C33-G RHG footprint matches JEDEC DO-213AA.

What is the maximum power dissipation rating for BZT52C33-G RHG?

The BZ52C33-G RHG is rated for a maximum power dissipation of 350 mW at an ambient temperature of 25 °C. Its thermal resistance from junction-to-ambient is 357 °C/W, and power must be linearly derated above 25 °C per the Power Derating Curve in the datasheet. This rating applies to the BZT52C33-G RHG in its standard SOD-123 package with recommended PCB copper area per the suggested pad layout.

What is the leakage current specification for BZT52C33-G RHG?

The BZT52C33-G RHG specifies a maximum leakage current (I_R) of 0.1 µA at a reverse voltage (V_R) of 23.1 V, which is 70% of its nominal Zener voltage. This value is measured at T_A = 25 °C and is consistent across the full production lot. The low leakage ensures minimal impact on high-impedance bias networks where the BZT52C33-G RHG is deployed as a reference or clamp.

Is BZT52C33-G RHG RoHS and halogen-free compliant?

Yes, the BZT52C33-G RHG is RoHS compliant and halogen-free in accordance with IEC 61249-2-21, as documented in the Features section of the Taiwan Semiconductor datasheet. The molding compound meets UL 94V-0 flammability rating, and all plating and substrate materials have been verified to satisfy both environmental directives. This compliance applies to all units shipped under the BZT52C33-G RHG ordering code.