Diodes Incorporated BZT52C8V2S-7-F

Overview

BZT52C8V2S-7-F from Diodes Incorporated is a surface-mount Zener diode with nominal 8.2 V zener voltage at 5 mA test current, 15 Ω maximum zener impedance at 5 mA, and 200 mW power dissipation in SOD323 package. It provides precision voltage regulation and overvoltage protection in space-constrained DC bias, reference, and clamp circuits.

For engineers reviewing the BZT52C8V2S-7-F datasheet, BZT52C8V2S-7-F pinout, BZT52C8V2S-7-F application, or BZT52C8V2S-7-F equivalent, key selection criteria include zener voltage tolerance (±6.1%), temperature coefficient (+3.2 mV/°C), reverse leakage (0.5 µA at 6.2 V), and AEC-Q101 qualification for automotive-grade reliability.

Technical Context

This Zener diode operates in reverse breakdown to maintain stable voltage across its terminals under varying load or supply conditions. Its planar die construction ensures consistent breakdown characteristics, while the SOD323 package enables high-density PCB layouts and compatibility with automated reflow assembly.

The device exhibits a positive temperature coefficient of +3.2 mV/°C above 6 V, enabling predictable drift compensation in reference designs. With 0.5 µA maximum reverse leakage at VR = 6.2 V and 15 Ω dynamic impedance at IZT = 5 mA, it supports low-power sensing and precision clamping applications.

Key Specifications

Pinout & Package

Two-terminal SOD323 package with cathode marked by a band on the top surface. Anode and cathode terminals are arranged linearly along the long axis; cathode is the banded end.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Zener diode applications.

Compared with MMBZ5231BS-7-F and BZX84-C8V2, BZT52C8V2S-7-F offers optimal balance of 8.2 V accuracy, low 15 Ω impedance, AEC-Q101 qualification, and minimal 1.3×1.7 mm SOD323 footprint for next-generation automotive and portable medical designs.

Availability

BZT52C8V2S-7-F is available at Aetrix Electronics and suitable for automotive ECUs, industrial sensor interfaces, USB power management, and portable medical diagnostics requiring stable component supply and full traceability.

Supply support for BZT52C8V2S-7-F includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, serving automotive, industrial, computing, and consumer markets with high-reliability components.

The BZT52C series belongs to Diodes' automotive-qualified Zener diode product line, engineered for precision voltage regulation and transient suppression in harsh-environment electronics where AEC-Q101 compliance and tight parametric control are mandatory.

FAQ

What is the maximum reverse leakage current for BZT52C8V2S-7-F at 6.2 V?

The maximum reverse leakage current is 0.5 µA at VR = 6.2 V and TA = +25°C, as specified in the Electrical Characteristics table. This value remains stable across the full -65°C to +150°C operating temperature range, supporting low-power always-on monitoring circuits without compromising battery life.

Is BZT52C8V2S-7-F suitable for use in automotive applications?

Yes - BZT52C8V2S-7-F is explicitly qualified to AEC-Q101 standards for high-reliability automotive use. It operates across -65°C to +150°C, features lead-free and halogen-free construction, and meets stringent mechanical and environmental stress requirements defined for under-hood and infotainment systems.

How does the temperature coefficient affect voltage regulation accuracy?

The temperature coefficient is +3.2 mV/°C, meaning the zener voltage increases by 3.2 mV per degree Celsius rise in junction temperature. Over a 100°C range (e.g., -40°C to +60°C), this results in ≈320 mV drift - a known, linear offset that can be compensated in system calibration routines for high-accuracy references.

What is the recommended PCB pad layout for SOD323 mounting?

Diodes Incorporated specifies a recommended pad layout with X = 0.590 mm, Y = 0.450 mm, X1 = 2.700 mm, and thermal relief traces per their package outline document DS30093. Use this layout to achieve proper solder joint formation, thermal dissipation, and mechanical reliability during reflow and thermal cycling.