Nexperia USA Inc. BZT52H-A2V4-QX

Overview

BZT52H-A2V4-QX from Nexperia is a 2.4 V ±1 % tolerance Zener diode in SOD123F package, rated for 830 mW total power dissipation at 25 °C ambient, with 400 Ω max differential resistance at I_Z = 5 mA and -3.5 to 0.0 mV/K temperature coefficient - used for precision voltage reference and overvoltage clamping in automotive power rail monitoring circuits.

For engineers reviewing the BZT52H-A2V4-QX datasheet, BZT52H-A2V4-QX pinout, BZT52H-A2V4-QX application, or BZT52H-A2V4-QX equivalent, this page delivers verified Zener voltage, thermal resistance (R_th(j-sp) = 150 K/W), reverse current (I_R ≤ 50 μA at V_R = 1 V), AEC-Q101 qualification status, and SOD123F footprint compatibility for PCB layout validation.

Technical Context

This Zener diode operates in reverse breakdown mode with nominal V_Z = 2.4 V at I_Z = 5 mA, exhibiting low dynamic impedance (r_dif ≤ 400 Ω) and tightly controlled temperature coefficient (SZ = -3.5 to 0.0 mV/K). Its AEC-Q101 qualification confirms suitability for automotive environments with T_j up to 150 °C and storage temperature range of -65 to +150 °C.

The device uses planar epitaxial construction for stable Zener characteristics, with forward voltage limited to 0.9 V at I_F = 10 mA and non-repetitive peak reverse current rated at 6.0 A (t_p = 100 μs). Thermal resistance from junction to solder point is 150 K/W on standard FR4 PCB with tin-plated copper.

Key Specifications

Pinout & Package

SOD123F surface-mount plastic package: 2-terminal, flat lead, cathode-marked with bar; dimensions 3.6 × 1.6 × 1.0 mm (L × W × H); optimized for reflow soldering on FR4 PCB with 1 cm² cathode pad.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Zener regulation applications.

Compared with BZT52H-A2V4-QX, the BZT52H-B2V4-Q trades 1 % precision for broader tolerance and lower unit cost, while MMSZ4678T1G lacks automotive qualification and delivers 40 % less power dissipation - making the original part uniquely suitable for AEC-Q101-compliant 2.4 V rail stabilization where accuracy and thermal robustness are co-critical.

Availability

BZT52H-A2V4-QX is available at Aetrix Electronics and suitable for automotive engine control units, infotainment systems, and ADAS camera modules requiring stable component supply with full traceability and long-term lifecycle support.

Supply support for BZT52H-A2V4-QX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on essential efficiency technologies, delivering high-performance, reliable discrete and logic devices for automotive, industrial, and consumer markets.

The BZT52H-Q series belongs to Nexperia's automotive-qualified Zener diode product line, engineered specifically for precision voltage regulation and transient suppression in harsh-temperature vehicle subsystems.

FAQ

What is the maximum allowable junction temperature for continuous operation?

The absolute maximum junction temperature is 150 °C, confirmed by AEC-Q101 thermal stress testing. Operation at this limit requires derating P_tot per the thermal resistance curve - at 100 °C ambient, maximum dissipation drops to approximately 420 mW using R_th(j-a) = 330 K/W.

How does the temperature coefficient affect regulation accuracy over automotive temperature range?

At V_Z = 2.4 V, the SZ ranges from -3.5 to 0.0 mV/K, causing worst-case drift of ±0.38 V across -40 to +125 °C ambient. This is fully characterized in Fig. 6 and remains within system-level error budgets for non-critical reference functions.

Can BZT52H-A2V4-QX replace older BZT52C2V4 in existing designs?

Yes - it shares identical SOD123F footprint and electrical specifications but adds AEC-Q101 qualification, improved thermal resistance (R_th(j-sp) = 150 K/W vs. 200+ K/W), and tighter ±1 % tolerance. No layout changes are needed for drop-in replacement in automotive upgrades.

What is the recommended PCB pad layout for optimal thermal performance?

Use the footprint in Fig. 12: 2.8 mm × 1.2 mm solder land per pad, 1 cm² copper area under cathode pad, and single-sided FR4 with tin plating. This achieves the specified R_th(j-sp) = 150 K/W and prevents thermal runaway during 830 mW operation.