Taiwan Semiconductor Corporation BZX585B16

Overview

BZX585B16 from Taiwan Semiconductor is a surface-mount Zener diode with nominal zener voltage 16 V (±2%), 200 mW power dissipation, 40 Ω dynamic impedance at 5 mA test current, and SOD-523F package. It provides precision voltage regulation in low-power signal conditioning and reference circuits for consumer and industrial electronics.

For engineers reviewing the BZX585B16 datasheet, BZX585B16 pinout, BZX585B16 application, or BZX585B16 equivalent, key selection criteria include zener tolerance (±2%), thermal resistance (680 °C/W), reverse leakage (<0.045 µA at 10.4 V), temperature coefficient (+11.2 mV/°C), and MSL-1 moisture sensitivity rating.

Technical Context

The BZX585B16 operates as a two-terminal voltage reference device, conducting in reverse breakdown to clamp or regulate voltage at 16 V with tight 2% tolerance. Its low 1.36 mg mass and SOD-523F footprint support high-density PCB layouts in space-constrained applications.

Designed for stable operation across −65 °C to +150 °C storage and junction temperatures, it maintains specified zener characteristics under 260 °C/10 s soldering conditions and complies with RoHS and halogen-free standards per IEC 61249-2-21.

Key Specifications

Pinout & Package

SOD-523F is a two-terminal surface-mount package with anode and cathode terminals identified by cathode band marking. Dimensions: 0.8 mm × 1.6 mm × 0.3 mm (typical); weight ≈1.36 mg.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Zener diode applications.

Compared with BZX585B16, MMBZ5245BS-7-F offers better thermal dissipation but sacrifices voltage precision, while BZX384-B16,115 delivers identical tolerance with 50% more power headroom-both require layout review due to SOD-323's larger footprint versus SOD-523F.

Availability

BZX585B16 is available at Aetrix Electronics and suitable for USB protection, sensor biasing, industrial signal conditioning, and PLC input protection requiring stable component supply and full RoHS/halogen-free compliance.

Supply support for BZX585B16 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Taiwan Semiconductor Corporation (TSC) is a vertically integrated semiconductor manufacturer specializing in discrete devices, analog ICs, and power management solutions for industrial, automotive, and consumer markets.

The BZX585B16 belongs to TSC's Small Signal Product family, engineered for high-reliability, low-power voltage reference and protection functions in compact, thermally efficient surface-mount packages.

FAQ

What is the zener voltage tolerance of BZX585B16?

The BZX585B16 has a nominal zener voltage of 16 V with a guaranteed tolerance of ±2%, meaning its actual breakdown voltage falls between 15.68 V and 16.32 V when tested at 5 mA. This tight tolerance is confirmed in the Electrical Characteristics table of the official Taiwan Semiconductor datasheet (Version C1607) and makes BZX585B16 suitable for precision reference applications where tighter regulation is required than standard 5% Zeners provide.

Is BZX585B16 compatible with lead-free reflow soldering processes?

Yes, BZX585B16 is qualified for high-temperature lead-free reflow with a guaranteed 260 °C / 10 second soldering profile. This specification is explicitly stated in the product features section and verified per J-STD-020 moisture sensitivity level (MSL) Class 1, allowing unlimited floor life and eliminating the need for pre-baking prior to assembly-critical for high-yield, high-throughput manufacturing of consumer and industrial electronics using BZX585B16.

What is the maximum reverse leakage current for BZX585B16?

The maximum reverse leakage current (I_R) for BZX585B16 is 0.045 µA at a reverse voltage of 10.4 V, as specified in the Electrical Characteristics table. This ultra-low leakage supports long battery life in always-on sensor nodes and ensures minimal loading on high-impedance reference dividers-making BZX585B16 especially valuable in low-power analog signal chains where parasitic current paths must be strictly controlled.

Does BZX585B16 meet RoHS and halogen-free requirements?

Yes, BZX585B16 is fully compliant with the RoHS Directive 2011/65/EU and WEEE 2002/96/EC, and is halogen-free per IEC 61249-2-21. These compliance statements appear in both the Features and Mechanical Data sections of the official Taiwan Semiconductor documentation. The green compound encapsulation further confirms environmental compliance, enabling BZX585B16 use in globally marketed products requiring strict material declarations and sustainability certifications.

What is the thermal resistance (R_θJA) of BZX585B16?

The junction-to-ambient thermal resistance (R_θJA) of BZX585B16 is 680 °C/W, as published in the Maximum Ratings table. This value reflects the device's ability to dissipate heat in still air on a standard FR-4 PCB with typical copper pour. When operating at its full 200 mW rating, this R_θJA implies a theoretical junction temperature rise of 136 °C above ambient-so derating is required above ~25 °C ambient to stay within the 150 °C maximum junction temperature limit, a key design consideration for reliable BZX585B16 deployment.