Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Discrete Semiconductor Products > Diodes > Zener > Single Zener Diodes

Taiwan Semiconductor Corporation BZX585B3V3

Name: BZX585B3V3
Brand: Taiwan Semiconductor Corporation
SKU: BZX585B3V3
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: BZX585B3V3

Manufacturer:: Taiwan Semiconductor Corporation

Category:: Single Zener Diodes

Package:: SC-79, SOD-523

Datasheet:: BZX585B3V3.pdf

Description:: DIODE ZENER 3.3V 200MW SOD523F

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:6,420

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

BZX585B3V3 from Taiwan Semiconductor is a surface-mount Zener diode with nominal zener voltage 3.3 V ±2%, 200 mW power dissipation, 95 Ω maximum zener impedance at 5 mA test current, and SOD-523F package - used for precision voltage regulation and overvoltage protection in low-power analog sensor interfaces and microcontroller I/O clamping circuits.

For engineers reviewing the BZX585B3V3 datasheet, BZX585B3V3 pinout, BZX585B3V3 application, or BZX585B3V3 equivalent, key selection criteria include its 3.23–3.37 V zener range at 5 mA, 4.5 μA max reverse leakage at 1.0 V, -3.5 mV/°C temperature coefficient, and MSL1 moisture sensitivity rating for reflow compatibility.

Technical Context

The BZX585B3V3 operates as a two-terminal voltage reference device, maintaining stable reverse breakdown across ambient temperatures from –65°C to +150°C with junction temperature limited to 150°C. Its thermal resistance (Junction-to-Ambient) is 680°C/W, enabling operation up to 200 mW only at TA = 25°C with linear derating above that point.

Zener impedance is specified at 95 Ω (max) under 5 mA test current, and dynamic impedance drops significantly at higher currents - e.g., ~1 Ω at 20 mA per Fig. 2. Reverse leakage remains ≤4.5 μA at VR = 1.0 V, supporting low-quiescent-current bias networks.

Key Specifications

Parameter	Value and Actual Design Meaning
Zener Voltage (V_Z)	3.3 V nominal, 3.23–3.37 V range at I_ZT = 5 mA - ensures tight regulation tolerance for 3.3 V rail monitoring and reference buffering.
Power Dissipation	200 mW at T_A = 25°C - supports continuous operation in space-constrained PCB layouts without forced cooling.
Zener Impedance (Z_ZT)	≤95 Ω at I_ZT = 5 mA - maintains low AC impedance for noise-sensitive analog references and feedback paths.
Reverse Leakage (I_R)	≤4.5 μA at V_R = 1.0 V - minimizes parasitic current draw in battery-powered sensor nodes and standby circuits.
Temperature Coefficient	–3.5 mV/°C - enables predictable drift compensation in temperature-stable voltage references near room temperature.
Package	SOD-523F - 0.7–0.9 mm length, 1.5–1.7 mm width, 0.25–0.40 mm height - compatible with high-density 0201-class placement and reflow profiles.
Moisture Sensitivity	MSL1 - unlimited floor life; no bake requirement before reflow soldering per J-STD-020.

Pinout & Package

SOD-523F is a two-terminal surface-mount package with cathode marked by a band on one end. The device has no internal leads - anode and cathode are exposed metalized pads on opposite ends of the molded body.

Pin/Terminal	Circuit Role	Design Meaning
Anode	Forward conduction terminal / Reference ground node	Connected to circuit ground or lower-potential node when used in reverse-biased regulation mode.
Cathode	Zener breakdown terminal / Regulated output node	Connected to voltage source or signal line requiring clamping or reference; polarity critical for proper breakdown operation.

Key Features

Feature	Design Value
2% Zener voltage tolerance	Enables accurate 3.3 V rail sensing without external trimming in ADC reference or supervisor circuits.
Halogen-free construction	Complies with IEC 61249-2-21 and RoHS Directive 2011/65/EU - meets environmental compliance for consumer and industrial end products.
High-temp soldering rated	Guaranteed performance after 260°C/10s reflow - eliminates risk of parametric shift during standard lead-free assembly.
Low weight (1.36 mg)	Reduces mechanical stress on fine-pitch traces and supports ultra-lightweight portable electronics design.
Green compound molding	Provides consistent visual identification and UV stability for long-term reliability in exposed PCB environments.

Applications

Microcontroller I/O Protection	3.3 V Rail Voltage Monitoring
Use Scenario: Clamping ESD transients on GPIO lines of ARM Cortex-M0+ microcontrollers in industrial control modules. IC Role / Device Role / Timing Role: Bidirectional transient suppressor operating in reverse breakdown to limit voltage excursions to ≤3.37 V. Use Value: Prevents latch-up and gate oxide damage while adding <1.5 ns propagation delay due to low capacitance (≈100 pF at 0 V bias).	Use Scenario: Detecting brown-out conditions on 3.3 V power rails in battery-backed real-time clock circuits. IC Role / Device Role / Timing Role: Precision shunt reference feeding comparator input with known 3.3 V threshold. Use Value: Achieves ±2% trip-point accuracy across –40°C to +85°C using its stable –3.5 mV/°C TC and low 4.5 μA leakage.
Low-Power Sensor Biasing	ADC Reference Stabilization
Use Scenario: Providing stable bias voltage to MEMS accelerometer analog front-end in wearable health monitors. IC Role / Device Role / Timing Role: Low-noise DC reference source delivering regulated 3.3 V to op-amp supply rails. Use Value: Maintains <10 mV ripple under 100 μA load variation due to 95 Ω zener impedance and minimal thermal drift.	Use Scenario: Stabilizing reference input of 12-bit SAR ADCs in programmable logic controller analog input modules. IC Role / Device Role / Timing Role: Shunt regulator establishing clean 3.3 V reference independent of main supply fluctuations. Use Value: Limits reference error to <0.5 LSB across temperature via tight 3.23–3.37 V tolerance and MSL1 robustness.

Microcontroller I/O Protection

3.3 V Rail Voltage Monitoring

Use Scenario: Clamping ESD transients on GPIO lines of ARM Cortex-M0+ microcontrollers in industrial control modules.

IC Role / Device Role / Timing Role: Bidirectional transient suppressor operating in reverse breakdown to limit voltage excursions to ≤3.37 V.

Use Value: Prevents latch-up and gate oxide damage while adding <1.5 ns propagation delay due to low capacitance (≈100 pF at 0 V bias).

Use Scenario: Detecting brown-out conditions on 3.3 V power rails in battery-backed real-time clock circuits.

IC Role / Device Role / Timing Role: Precision shunt reference feeding comparator input with known 3.3 V threshold.

Use Value: Achieves ±2% trip-point accuracy across –40°C to +85°C using its stable –3.5 mV/°C TC and low 4.5 μA leakage.

Low-Power Sensor Biasing

ADC Reference Stabilization

Use Scenario: Providing stable bias voltage to MEMS accelerometer analog front-end in wearable health monitors.

IC Role / Device Role / Timing Role: Low-noise DC reference source delivering regulated 3.3 V to op-amp supply rails.

Use Value: Maintains <10 mV ripple under 100 μA load variation due to 95 Ω zener impedance and minimal thermal drift.

Use Scenario: Stabilizing reference input of 12-bit SAR ADCs in programmable logic controller analog input modules.

IC Role / Device Role / Timing Role: Shunt regulator establishing clean 3.3 V reference independent of main supply fluctuations.

Use Value: Limits reference error to <0.5 LSB across temperature via tight 3.23–3.37 V tolerance and MSL1 robustness.

Equivalent & Alternatives

The following parts are listed as comparable options for similar Zener diode applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
MMBZ5226BS-7-F	Zener voltage 3.3 V ±5%, 350 mW power rating, SOT-323 package (larger footprint), 100 Ω Z_ZT at 20 mA	Higher power handling but larger board area; less precise tolerance affects accuracy-critical references	Select when higher surge energy absorption is required and 5% tolerance is acceptable in cost-sensitive designs.
BZX384-B3V3,115	Zener voltage 3.3 V ±2%, 300 mW rating, SOD-323 package (1.7 × 1.3 mm), 90 Ω Z_ZT at 5 mA, MSL1	Nearly identical electrical specs but 30% larger footprint; same halogen-free/RoHS compliance	Prefer when existing layout accommodates SOD-323 and higher power margin is needed without changing tolerance or TC.

Compared with BZX585B3V3, MMBZ5226BS-7-F trades tighter voltage tolerance for higher power and larger size, while BZX384-B3V3,115 offers identical tolerance and improved power margin in a physically larger SOD-323 package - both require footprint verification but support equivalent functional roles in voltage reference and clamping.

Availability

BZX585B3V3 is available at Aetrix Electronics and suitable for microcontroller I/O protection, 3.3 V rail voltage monitoring, and low-power sensor biasing requiring stable component supply, full traceability, and RoHS-compliant sourcing.

Supply support for BZX585B3V3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Taiwan Semiconductor Corporation (TSC) is a vertically integrated semiconductor manufacturer specializing in discrete devices, analog ICs, and power management solutions for industrial, automotive, and consumer markets.

The BZX585B3V3 belongs to TSC's Small Signal Product family - engineered for high-reliability, low-profile voltage regulation in space-constrained, thermally demanding applications such as portable instrumentation and IoT edge nodes.

FAQ

What is the maximum reverse leakage current for BZX585B3V3 at 1.0 V?

The BZX585B3V3 exhibits a maximum reverse leakage current of 4.5 μA when biased at 1.0 V, measured at TA = 25°C. This low leakage supports energy-efficient operation in always-on sensor bias networks and extends battery life in portable systems using the BZX585B3V3 as a reference or clamp element.

Is BZX585B3V3 compatible with lead-free reflow soldering processes?

Yes, the BZX585B3V3 is qualified for high-temperature soldering at 260°C for 10 seconds, fully compliant with JEDEC J-STD-020 Class 1 reflow profiles. Its SOD-523F package and halogen-free epoxy ensure reliable interconnect formation without delamination or parametric shift during standard lead-free assembly of the BZX585B3V3.

What is the thermal resistance (Junction-to-Ambient) of BZX585B3V3?

The BZX585B3V3 has a Junction-to-Ambient thermal resistance (R_θJA) of 680°C/W under standard PCB mounting conditions (single-layer copper, no thermal vias). This value defines the derating curve shown in Fig. 3 - power must be reduced linearly above 25°C ambient to maintain TJ ≤ 150°C in the BZX585B3V3.

Does BZX585B3V3 have a defined zener impedance at low test currents?

Yes, the BZX585B3V3 specifies maximum zener impedance of 95 Ω at I_ZT = 5 mA. While not explicitly rated below 5 mA, Fig. 2 shows impedance rising sharply below 1 mA - so for sub-mA applications, designers should verify stability using the BZX585B3V3's actual dynamic curve rather than relying on the 5 mA spec alone.

How does the temperature coefficient of BZX585B3V3 affect its use in precision references?

The BZX585B3V3 has a temperature coefficient of –3.5 mV/°C at I_ZT = 5 mA, meaning its zener voltage decreases by ~0.1% per °C rise near 25°C. For precision references, this requires either temperature compensation or operation within narrow ambient ranges - a key design consideration when specifying the BZX585B3V3 in metrology-grade circuits.

BZX585B3V3 Specifications

Product attributes: Attribute value

Manufacturer:: Taiwan Semiconductor Corporation

Series:: -

Package/Case:: SC-79, SOD-523

Packaging:: Tape & Reel (TR)

Product Status:: Active

Voltage - Zener (Nom) (Vz):: 3.3 V

Tolerance:: ±2%

Power - Max:: 200 mW

Impedance (Max) (Zzt):: 95 Ohms

Current - Reverse Leakage @ Vr:: 4.5 µA @ 1 V

Voltage - Forward (Vf) (Max) @ If:: -

Operating Temperature:: 150°C (TJ)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: SOD-523F

BZX585B3V3 FAQ

1.How can I place an order for BZX585B3V3 through Aetrix?

Please submit a Request for Quotation (RFQ) for BZX585B3V3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for BZX585B3V3 reliable?

The price and inventory of BZX585B3V3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BZX585B3V3 is usually 5 days.

3.What payment methods are accepted for BZX585B3V3?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BZX585B3V3 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for BZX585B3V3?

BZX585B3V3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your BZX585B3V3 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for BZX585B3V3?

For technical support, including BZX585B3V3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BZX585B3V3 requirements.

6.How does Aetrix verify that BZX585B3V3 is sourced from the original manufacturer or authorized distributors?

All BZX585B3V3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BZX585B3V3 meets industry standards.

7.What is the process for return or replacement of BZX585B3V3?

All BZX585B3V3 units undergo pre-shipment inspection (PSI). If there is an issue with BZX585B3V3, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The BZX585B3V3 part is unused and in its original packaging.

Return procedure for BZX585B3V3:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-09-09 Counterfeit Electronic Components: How to Detect, Authenticate, and Test Suspect Parts

Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …

2026-09-08 Obsolete Electronic Components: How to Source and Evaluate Replacements

A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.

2026-09-07 TTL vs CMOS Logic Levels: 74HC and 74HCT Compatibility Explained

TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.

2026-09-04 Logic Level Shifter: How to Connect 3.3V and 5V Logic Safely

A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.

2026-09-03 74HC595 vs TPIC6B595: Output Drive, Pinout, Current, and Load Selection

The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…

2026-09-02 74HC595 Pinout, Timing, Output Current, and Applications

The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…

2026-09-01 Latch vs Flip-Flop: Timing, Differences and Design Choices

A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…

2026-08-30 D Latch Circuit: Truth Table, Timing, ICs and Applications

A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …

2026-08-28 SR Latch Explained: NOR and NAND Circuits, Truth Tables, and Applications

An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…

2026-08-27 Latch Circuit: SR and D Latches, Truth Tables, Timing, and Applications

Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…