Taiwan Semiconductor Corporation BZX585B6V8

Overview

BZX585B6V8 from Taiwan Semiconductor is a surface-mount Zener diode with nominal zener voltage 6.8 V ±2%, 200 mW power dissipation, 75 Ω dynamic impedance at 15 mA test current, and SOD-523F package. It provides precise voltage regulation in low-power signal conditioning, reference, and protection circuits across consumer and industrial electronics.

For engineers reviewing the BZX585B6V8 datasheet, BZX585B6V8 pinout, BZX585B6V8 application, or BZX585B6V8 equivalent, key selection criteria include zener tolerance (±2%), low thermal resistance (680 °C/W), MSL-1 moisture sensitivity, and guaranteed 260 °C/10s soldering compatibility - all critical for high-reliability PCB assembly and stable reference design.

Technical Context

The BZX585B6V8 operates as a two-terminal voltage reference device, clamping reverse voltage at 6.8 V with tight 2% initial tolerance and temperature coefficient of +1.2 mV/°C. Its low 75 Ω zener impedance at I_ZT = 15 mA ensures stable regulation under varying load currents.

Designed for ambient temperatures up to +150 °C and storage from –65 °C to +150 °C, it maintains performance in thermally constrained layouts. The SOD-523F package enables high-density placement while supporting reflow profiles compliant with IPC/JEDEC J-STD-020.

Key Specifications

Pinout & Package

SOD-523F is a two-terminal surface-mount package with anode and cathode marked by polarity band. Dimensions: 1.6 mm (L) × 0.8 mm (W) × 0.4 mm (H); weight ≈ 1.36 mg.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Zener diode applications.

Compared with BZX585B6V8, MMBZ5235BS-7-F offers greater power headroom but sacrifices voltage precision and board area efficiency; BZX384-B6V8,115 matches tolerance and reliability while increasing power rating and relaxing test-current dependency - making it viable where thermal margin or existing SOD-323 land patterns exist.

Availability

BZX585B6V8 is available at Aetrix Electronics and suitable for low-power voltage reference, overvoltage clamp, signal translation, and current source biasing applications requiring stable component supply, halogen-free compliance, and MSL-1 handling.

Supply support for BZX585B6V8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Taiwan Semiconductor Corporation (TSC) is a vertically integrated semiconductor manufacturer specializing in discrete devices, analog ICs, and power management solutions for industrial, automotive, and consumer markets.

The BZX585B6V8 belongs to TSC's Small Signal Product line, engineered for high-precision, low-power voltage regulation in space-constrained and thermally demanding PCB environments.

FAQ

What is the zener voltage tolerance of BZX585B6V8?

The BZX585B6V8 has a nominal zener voltage of 6.8 V with a tolerance of ±2%, meaning its actual breakdown voltage falls between 6.66 V and 6.94 V when tested at 15 mA. This tight tolerance is specified per the manufacturer's datasheet revision C1607 and supports precision reference applications without trimming. The BZX585B6V8 achieves this consistency through process-controlled doping and laser trimming during final test.

What is the maximum power dissipation for BZX585B6V8 at room temperature?

The BZX585B6V8 has a maximum power dissipation of 200 mW at ambient temperature (T_A) = 25 °C. Derating is required above this temperature - for example, at 75 °C ambient, usable power drops to approximately 100 mW due to its 680 °C/W junction-to-ambient thermal resistance. This limit directly constrains the maximum sustainable zener current to ~29 mA at 6.8 V in still-air conditions.

Is BZX585B6V8 compatible with lead-free reflow soldering processes?

Yes, the BZX585B6V8 is qualified for lead-free reflow soldering at 260 °C for 10 seconds, meeting IPC/JEDEC J-STD-020 requirements. Its SOD-523F package and halogen-free epoxy ensure robustness under standard Pb-free thermal profiles. This qualification is documented in the manufacturer's datasheet (Version C1607) and verified through accelerated reliability testing - confirming no parametric shift or mechanical degradation in the BZX585B6V8 after exposure.

What is the reverse leakage current specification for BZX585B6V8?

The BZX585B6V8 specifies a maximum reverse leakage current (I_R) of 0.18 μA at V_R = 4.5 V and T_A = 25 °C. This ultra-low leakage supports high-impedance bias networks and battery-sensitive designs. Measured under standardized conditions, this value reflects the device's ability to minimize quiescent current draw while maintaining reliable 6.8 V clamping behavior - a key parameter confirmed in the electrical characteristics table of the BZX585B6V8 datasheet.

Does BZX585B6V8 have moisture sensitivity level (MSL) rating?

Yes, the BZX585B6V8 carries Moisture Sensitivity Level (MSL) 1 per JEDEC J-STD-020, meaning it can be stored indefinitely at ≤30 °C/60% RH without baking prior to soldering. This eliminates pre-reflow bake steps, reduces handling risk, and simplifies logistics for high-mix production. The MSL-1 rating is explicitly stated in the mechanical data section of the BZX585B6V8 datasheet (Version C1607) and applies to the SOD-523F packaged device.