Taiwan Semiconductor Corporation BZX585B9V1

Overview

BZX585B9V1 from Taiwan Semiconductor is a surface-mount Zener diode with nominal zener voltage 9.1 V ±2%, 200 mW power dissipation, 94 Ω dynamic impedance at 5 mA test current, and SOD-523F package. It provides precision voltage regulation in low-power signal conditioning and reference circuits for industrial sensors and portable electronics.

For engineers reviewing the BZX585B9V1 datasheet, BZX585B9V1 pinout, BZX585B9V1 application, or BZX585B9V1 equivalent, key selection criteria include zener tolerance (±2%), thermal resistance (680 °C/W), reverse leakage (<0.45 µA at 7.0 V), temperature coefficient (+3.8 mV/°C), and MSL-1 handling capability.

Technical Context

The BZX585B9V1 operates as a two-terminal voltage reference device, conducting in reverse breakdown to maintain stable voltage across its terminals under varying load and temperature conditions. Its 2% voltage tolerance and +3.8 mV/°C temperature coefficient enable predictable drift behavior in biasing and clamping applications.

Designed for surface-mount assembly, it supports high-temperature soldering (260°C/10s) and complies with RoHS and halogen-free standards (IEC 61249-2-21). The SOD-523F package delivers minimal footprint (0.7–0.9 mm × 1.5–1.7 mm) and low mass (1.36 mg) for space-constrained PCB layouts.

Key Specifications

Pinout & Package

SOD-523F is a two-terminal surface-mount package with cathode marked by a band. No internal leads or exposed pads; both terminals are solderable metallized ends of the silicon die encapsulated in green compound.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Zener diode applications.

Compared with BZX585B9V1, MMBZ5240BS-7-F trades tighter voltage control for broader availability and lower unit cost, while BZX384-B9V1,115 offers identical tolerance with greater power margin at the expense of 2.6× higher mass and larger pad area-critical for vibration-prone or miniaturized designs.

Availability

BZX585B9V1 is available at Aetrix Electronics and suitable for industrial sensor biasing, portable device power rail clamping, and low-power reference source applications requiring stable component supply, consistent parametric performance, and RoHS-compliant sourcing.

Supply support for BZX585B9V1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Taiwan Semiconductor Corporation (TSC) is a vertically integrated semiconductor manufacturer specializing in discrete devices, analog ICs, and power management solutions for industrial, computing, and consumer markets.

The BZX585B9V1 belongs to TSC's Small Signal Product line, engineered for high-reliability, low-power voltage regulation and protection in compact, thermally constrained environments.

FAQ

What is the zener voltage tolerance of BZX585B9V1?

The BZX585B9V1 has a zener voltage tolerance of ±2% at 5 mA test current, meaning its nominal 9.1 V rating falls between 8.92 V and 9.28 V under standard test conditions. This tight tolerance makes BZX585B9V1 suitable for applications demanding precise voltage referencing without calibration, such as analog sensor signal conditioning and ADC reference networks where drift must remain within strict bounds.

Is BZX585B9V1 compatible with lead-free reflow processes?

Yes, BZX585B9V1 is qualified for high-temperature lead-free soldering at 260°C for 10 seconds, fully supporting IPC/JEDEC J-STD-020D reflow profiles. Its SOD-523F package and halogen-free epoxy withstand thermal stress without parameter shift or delamination, ensuring reliable assembly in modern electronics manufacturing lines using BGA, QFN, and other fine-pitch components alongside BZX585B9V1.

What is the maximum reverse leakage current for BZX585B9V1?

The maximum reverse leakage current for BZX585B9V1 is 0.45 µA at 7.0 V reverse bias and 25°C ambient temperature. This ultra-low leakage supports energy-sensitive designs like battery-backed real-time clocks and wireless sensor nodes, where standby current must be minimized. At elevated temperatures (e.g., 85°C), leakage remains below 1 µA, preserving system-level power budget integrity when using BZX585B9V1 as a reference or clamp.

Does BZX585B9V1 have moisture sensitivity level (MSL) rating?

Yes, BZX585B9V1 carries Moisture Sensitivity Level (MSL) 1 per JEDEC J-STD-020, indicating unlimited floor life at ≤30°C/60% RH. No baking or dry-pack requirements apply before surface-mount assembly, simplifying inventory handling and reducing process risk. This MSL-1 rating is confirmed in the official Taiwan Semiconductor datasheet revision C1607 and applies specifically to the SOD-523F packaged BZX585B9V1-not extrapolated from other variants.

What is the thermal resistance (RθJA) of BZX585B9V1?

The junction-to-ambient thermal resistance (RθJA) of BZX585B9V1 is 680 °C/W under standard JEDEC test conditions (single-layer 1 in² copper pad, no airflow). This value reflects its small SOD-523F footprint and limited heat-spreading capability. When dissipating 200 mW, self-heating reaches ~136°C above ambient-requiring careful layout with thermal vias or adjacent copper if operated near maximum ratings. RθJA is measured and specified for BZX585B9V1 in the C1607 datasheet and not derived from family averages.