Nexperia USA Inc. BZX585-C5V1,135

Overview

BZX585-C5V1,135 from Nexperia is a ±5 % tolerance Zener diode in SOD523 (SC-79) package, rated for 5.1 V nominal regulation at 5 mA, with 400 Ω typical differential resistance and 300 mW total power dissipation. It serves as a precision voltage reference or overvoltage clamp in low-power analog signal conditioning and microcontroller I/O protection circuits.

For engineers reviewing the BZX585-C5V1,135 datasheet, BZX585-C5V1,135 pinout, BZX585-C5V1,135 application, or BZX585-C5V1,135 equivalent, this device is selected for compact board space, stable low-current regulation, and transient surge handling up to 40 W in pulse-limited scenarios.

Technical Context

This Zener diode operates in reverse breakdown mode with a nominal Zener voltage of 5.1 V at 5 mA test current, exhibiting a temperature coefficient of −2.7 to −0.5 mV/K across its operating range. Its low 400 Ω differential resistance ensures minimal voltage deviation under load variation.

The device supports non-repetitive peak reverse power dissipation of 40 W for 100 µs square-wave pulses at 25 °C ambient, while maintaining continuous operation within 300 mW total power limit on FR4 PCB with 35 mm² copper area at cathode tab.

Key Specifications

Pinout & Package

SOD523 (SC-79) ultra-small flat-lead surface-mount package: 1.25 mm × 0.85 mm body, 0.65 mm height, cathode marked by bar on top surface.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Zener regulation applications.

Compared with BZX585-B5V1,135, this part trades regulation accuracy for cost; compared with MMSZ5222BT1G, it offers 30 % smaller footprint and better thermal performance on dense PCBs but lower absolute power headroom.

Availability

BZX585-C5V1,135 is available at Aetrix Electronics and suitable for microcontroller I/O protection, low-power sensor biasing, USB port overvoltage clamp, and industrial signal conditioning requiring stable component supply and consistent parametric performance across production lots.

Supply support for BZX585-C5V1,135 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert delivering high-performance logic, discrete, and MOSFET solutions optimized for efficiency, reliability, and miniaturization in consumer, industrial, and automotive electronics.

The BZX585 series targets space-constrained, low-power voltage regulation and transient suppression, emphasizing ultra-small packaging, tight thermal resistance, and robust surge capability for modern portable and embedded systems.

FAQ

What is the maximum continuous reverse current the BZX585-C5V1,135 can sustain?

The device supports a maximum continuous forward current of 200 mA per Absolute Maximum Ratings, but as a Zener diode, its continuous reverse current is limited by power dissipation: at 5.1 V, sustained I_Z must stay ≤59 mA to remain within 300 mW P_tot. Derating applies above 25 °C ambient.

How does the temperature coefficient affect regulation accuracy over −40 °C to +85 °C?

With SZ = −2.7 to −0.5 mV/K, the Zener voltage shifts −13.5 mV to −4.25 mV per 5 °C rise. Over −40 °C to +85 °C (125 K span), total drift is −338 mV to −63 mV - a 6.6 % to 1.2 % change relative to 5.1 V, requiring system-level compensation for high-accuracy references.

Can BZX585-C5V1,135 replace a 5.1 V Zener in a linear regulator feedback network?

Yes, but only where load current remains ≤5 mA and thermal design accommodates 300 mW dissipation. Its 400 Ω r_diff introduces ~2 mV error per 5 µA feedback current variation - acceptable for non-precision regulators but insufficient for <1 % output tolerance designs.

Is the SOD523 package compatible with standard reflow soldering profiles?

Yes - Nexperia specifies compatibility with IPC/JEDEC J-STD-020D reflow profiles. The recommended footprint (Fig. 12) uses 0.5 mm pad width, 1.4 mm pad length, and 0.4 mm solder mask opening; peak temperature must not exceed 260 °C for ≤30 seconds to avoid package delamination.