Diodes Incorporated BZX84C30S-7-F

Overview

BZX84C30S-7-F from Diodes Incorporated is a dual 200 mW surface-mount Zener diode with nominal zener voltage 30 V (28.0–32.0 V at 2 mA), 80 Ω maximum zener impedance at test current, and −29.4 to +24.4 mV/°C temperature coefficient. It operates from −65 °C to +150 °C and is used for precision voltage regulation and overvoltage protection in low-power analog sensor interfaces.

For engineers reviewing the BZX84C30S-7-F datasheet, BZX84C30S-7-F pinout, BZX84C30S-7-F application, or BZX84C30S-7-F equivalent, key selection criteria include zener voltage tolerance at 2 mA, thermal resistance (625 °C/W), SOT-363 package footprint compatibility, reverse leakage (<0.1 µA at 21 V), and RoHS-compliant lead-free plating.

Technical Context

This dual-element Zener diode integrates two independent 30 V zener junctions in a single SOT-363 package, enabling compact dual-rail reference or redundancy schemes. Each element features planar die construction and is characterized at 2 mA test current per JEDEC standards.

Its thermal resistance of 625 °C/W reflects operation on FR4 PCB with recommended pad layout; derating begins above 25 °C ambient, reaching zero power dissipation at 150 °C. The device exhibits no forward conduction specification beyond VF = 0.9 V at 10 mA - confirming its dedicated zener (reverse-biased) use case.

Key Specifications

Pinout & Package

SOT-363 package: 6-pin, dual-row, plastic-molded surface-mount case with UL 94V-0 flammability rating and moisture sensitivity level 1. Dimensions: 2.20 × 1.35 × 0.95 mm (L × W × H).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual Zener voltage regulation applications.

Compared with MMBZ5260BS-7-F and BZX84C30LT1G, BZX84C30S-7-F uniquely delivers two matched 30 V Zeners in one SOT-363, reducing component count and inter-device parameter mismatch - critical for differential reference and fault-tolerant designs.

Availability

BZX84C30S-7-F is available at Aetrix Electronics and suitable for industrial sensor signal conditioning, USB-C power delivery clamp circuits, medical pulse oximeter front-ends, and automotive cabin ambient light sensors requiring stable component supply and long-term lifecycle support.

Supply support for BZX84C30S-7-F includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design centers across Asia and manufacturing in China, Taiwan, and the U.S.

The BZX84C series belongs to Diodes' precision Zener diode product line, engineered for low-power voltage regulation and clamping in space-constrained, thermally demanding applications such as portable instrumentation and automotive subsystems.

FAQ

What is the maximum reverse voltage this device can withstand before breakdown?

The BZX84C30S-7-F has a nominal zener voltage of 30 V with a guaranteed range of 28.0–32.0 V at 2 mA test current. Its absolute maximum reverse voltage is defined by the zener knee - it begins regulating at ~28 V and maintains stable breakdown up to its 200 mW power limit. No separate "breakdown threshold" exists beyond the specified V_Z range.

Can both Zener elements be used simultaneously with independent bias networks?

Yes - pins 2/C1–3/A1 and 5/C2–4/A2 form two fully independent zener junctions. Each pair can be biased separately with distinct current sources and loads. The NC pins (1 and 6) are internally unconnected, ensuring no electrical or thermal crosstalk between elements.

Is this device suitable for use in automotive under-hood applications?

Yes - its −65 °C to +150 °C operating temperature range, qualified SOT-363 package, and AEC-Q200-untested (but process-aligned) construction make it suitable for non-safety-critical under-hood functions like cabin sensor biasing. It is not AEC-Q200 certified, so system-level validation is required for deployment.

How does the 625 °C/W thermal resistance impact PCB layout?

A 625 °C/W R_θJA means each 100 mW dissipated raises junction temperature by 62.5 °C above ambient. To stay within 150 °C max T_J, keep ambient ≤87.5 °C at full 200 mW - achievable only with optimized copper pour and the pad layout specified in Diodes AP02001. Derating is mandatory above 25 °C ambient.