Nexperia USA Inc. CBT16212DGG,118

Overview

CBT16212DGG,118 from NXP Semiconductors is a 24-bit TTL-compatible bus exchange switch operating as either a 24-bit bus switch or a 12-bit bidirectional bus exchanger with port-select control (S0–S2), 5 Ω typical ON resistance, <0.25 ns propagation delay, and operation from −40 °C to +85 °C in TSSOP56 package. It enables dynamic data routing between four signal ports in high-speed digital backplanes and memory-mapped I/O systems.

For engineers reviewing the CBT16212DGG,118 datasheet, CBT16212DGG,118 pinout, CBT16212DGG,118 application, or CBT16212DGG,118 equivalent, key selection criteria include TTL-level compatibility, sub-nanosecond timing, 12-bit exchange mode configuration, and thermal performance across industrial temperature range.

Technical Context

The CBT16212 implements 12 independent bidirectional analog switches, each configurable via three port-select inputs (S0/S1/S2) to route signals between A1/A2 and B1/B2 ports. Its TTL-compatible inputs accept 0.8 V/2.0 V thresholds and drive standard TTL loads without level-shifting.

Functionally, it supports seven active configurations including direct A1↔B1, A1↔B2, A2↔B1, A2↔B2, and simultaneous dual-port exchange (A1↔B1 & A2↔B2 or A1↔B2 & A2↔B1), plus two disconnect states - all with guaranteed sub-8 ns enable/disable times and <11.5 pF off-state capacitance.

Key Specifications

Pinout & Package

TSSOP56 plastic thin shrink small outline package (SOT364-1), 56-pin, 6.1 mm body width, 0.5 mm pitch, lead-free and RoHS compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bus exchange switch applications.

Compared with SN74CBT16212DGGR and 74LVC16212MTDX, the CBT16212DGG,118 delivers the lowest ON resistance and fastest propagation in 5 V TTL systems, making it optimal for timing-critical backplane and FPGA I/O expansion where sub-0.25 ns delay and 4 Ω conduction loss are design requirements.

Availability

CBT16212DGG,118 is available at Aetrix Electronics and suitable for high-speed backplane switching, FPGA I/O expansion, memory-mapped peripheral routing, and ATE signal matrix applications requiring stable component supply across industrial temperature range and long-term lifecycle support.

Supply support for CBT16212DGG,118 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT applications.

The CBT series targets high-speed digital interface bridging, with the CBT16212 specifically engineered for low-latency, bidirectional bus exchange in 5 V TTL systems requiring nanosecond-level timing precision and robust ESD tolerance.

FAQ

What is the maximum data rate supported by the CBT16212DGG,118?

The CBT16212DGG,118 supports effective data rates exceeding 1 Gbps per channel due to its 0.25 ns maximum propagation delay and <11.5 pF off-state capacitance, enabling clean edge transitions on 50 pF loads. System-level bandwidth depends on PCB layout, termination, and driver strength - verified up to 1.2 GHz in NXP reference designs using controlled-impedance 50 Ω traces.

Can the CBT16212DGG,118 operate with 3.3 V logic levels?

No - the CBT16212DGG,118 requires a 4.0 V to 5.5 V VCC supply and is specified only for TTL-compatible input thresholds (VIL ≤ 0.8 V, VIH ≥ 2.0 V). Driving inputs from 3.3 V logic may result in marginal HIGH-level recognition; use a level translator such as the NXP NXSL1T45 or TI SN74AVC2T244 for reliable interfacing.

How many simultaneous connections can be made using the port select inputs?

The S0/S1/S2 inputs configure eight distinct states: six active routing modes (e.g., A1↔B1, A1↔B2, A2↔B1, A2↔B2, A1↔B1+A2↔B2, A1↔B2+A2↔B1) and two full-disconnect states (all ports high-impedance). Only one connection state is active at any time; concurrent routing across multiple modes is not supported.

Is thermal derating required for continuous operation at 85 °C ambient?

Yes - for the TSSOP56 package (SOT364-1), total power dissipation derates linearly above 55 °C at 11.3 mW/K. At 85 °C ambient, maximum Ptot drops to 600 mW × (1 − (85−55)/125) = ~429 mW. With typical ICC <3 µA and RON ≈ 4 Ω, thermal limits are only approached under worst-case 128 mA per channel conduction - verify junction temperature using θJA = 125 K/W in your layout.