Nexperia USA Inc. CBT16212DL,518

Overview

CBT16212DL,518 from NXP Semiconductors is a 24-bit TTL-compatible bus exchange switch operating as either a 24-bit bus switch or a 12-bit bidirectional bus exchanger across four signal ports. It features 5 Ω typical ON resistance, 0.25 ns max propagation delay, and supports −40 °C to +85 °C industrial temperature range. Used in high-speed data routing between memory banks and peripheral controllers in telecom backplanes.

For engineers reviewing the CBT16212DL,518 datasheet, CBT16212DL,518 pinout, CBT16212DL,518 application, or CBT16212DL,518 equivalent, key selection criteria include port-select logic behavior (S0–S2), 12-bit output enable capability, SSOP56 package compatibility, and TTL-level input compatibility with 4.0–5.5 V supply operation.

Technical Context

The CBT16212DL implements 12 independent bidirectional analog switches controlled by three port-select inputs (S0, S1, S2), enabling eight distinct routing configurations including disconnect, A↔B1, A↔B2, and full B1↔B2 exchange. Each switch path exhibits sub-7 Ω ON resistance at 4.5 V VCC and 30 mA current, ensuring minimal signal degradation.

Its TTL-compatible inputs accept 0.8 V VIL and 2.0 V VIH thresholds, while dynamic performance is defined by 2.4–8.0 ns enable/disable times and guaranteed 0.25 ns max propagation delay under 50 pF load. The device uses no internal logic latching-switch state follows port-select inputs in real time without clocking.

Key Specifications

Pinout & Package

CBT16212DL,518 is housed in an SSOP56 plastic shrink small outline package (SOT371-1) with 56 leads and 7.5 mm body width. Pin pitch is 0.635 mm; thermal pad not present. Package meets JEDEC MO-118 standards.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bus exchange switch applications.

Compared with SN74CBT16212DGGR, CBT16212DL,518 offers higher thermal power handling in SSOP56; versus 74LVC16245ADGG, it delivers true bidirectional analog switching without direction pins or voltage translation overhead.

Availability

CBT16212DL,518 is available at Aetrix Electronics and suitable for telecom infrastructure, industrial PLC backplanes, and FPGA-based memory expansion requiring stable component supply across extended product lifecycles.

Supply support for CBT16212DL,518 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT applications.

The CBT16212 belongs to NXP's high-speed bus switch product line, designed specifically for low-latency, TTL-compatible signal routing in memory subsystems and programmable logic interconnects.

FAQ

What is the maximum capacitive load the CBT16212DL,518 can drive while maintaining 0.25 ns propagation delay?

The 0.25 ns propagation delay specification is guaranteed with a 50 pF load capacitance, as defined in the test circuit (Figure 6) using 500 Ω termination and 4.5–5.5 V supply. Driving >50 pF increases RC delay linearly; at 100 pF, measured tpd rises to ~0.45 ns. Layout parasitics must be included in total load calculation.

Can the CBT16212DL,518 operate reliably at 3.3 V supply?

No. The CBT16212DL,518 is specified only for 4.0–5.5 V operation per Table 5. At 3.3 V, ON resistance exceeds 15 Ω, VIH threshold is no longer met, and propagation delay degrades beyond spec. For 3.3 V systems, consider NXP's 74LVC series or TI's SN74CBT3245.

How does the latch-up immunity of 100 mA per JESD78 impact PCB design?

The 100 mA latch-up immunity means the device withstands transient overcurrent events up to that level without destructive latch-up. Designers must still limit steady-state current per switch to ≤30 mA (per RON derating) and ensure power supply rise/fall times exceed 100 µs to avoid triggering SCR-like conduction during power sequencing.

Is the SSOP56 footprint of CBT16212DL,518 compatible with the TSSOP56 variant CBT16212DGG?

No. Although both have 56 pins and similar pin numbering, SSOP56 (SOT371-1) has 7.5 mm body width and 0.635 mm pitch, while TSSOP56 (SOT364-1) is 6.1 mm wide with same pitch. Footprints are mechanically incompatible; separate land patterns are required for each package.