Nexperia USA Inc. CBTD16210DGG,118

Overview

CBTD16210DGG,118 from NXP Semiconductors (formerly Philips) is a 20-bit TTL-compatible bus switch with dual 10-bit output-enable control, 5 Ω on-state resistance, 0.25 ns propagation delay (CL = 50 pF), and integrated 5 V-to-3.3 V level shifting capability. It operates from –40°C to +85°C and is used in mixed-voltage memory and peripheral interconnects between 5 V logic and 3.3 V subsystems.

For engineers reviewing the CBTD16210DGG,118 datasheet, CBTD16210DGG,118 pinout, CBTD16210DGG,118 application, or CBTD16210DGG,118 equivalent, key selection criteria include bidirectional level-shifting tolerance, low-capacitance switching (CIN = 4.3 pF, COUT = 6.9 pF), independent OE control per 10-bit bank, and TSSOP-48 thermal performance under industrial temperature stress.

Technical Context

The CBTD16210 implements two independent 10-bit analog bus switches with TTL-compatible enable inputs (1OE/2OE), each supporting bidirectional signal flow between A- and B-side ports. Its pass-gate architecture integrates clamping diodes to VCC, enabling safe 5 V input to 3.3 V output translation without external components.

Each switch channel exhibits 5 Ω typical on-resistance at VCC = 4.5 V and supports up to 128 mA DC output current in low state. The device maintains high-impedance isolation (ICCZ = 4.0 µA) when disabled and meets AC timing specs including tPZH ≤ 7.5 ns and tPHZ ≤ 4.5 ns across full temperature range.

Key Specifications

Pinout & Package

CBTD16210DGG,118 is housed in a 48-pin TSSOP package (SOT362-1), 6.1 mm body width, with exposed pad not connected. Pin 1 is top-left corner, marked by notch or dot; pins numbered counter-clockwise. Ground (GND) appears on pins 8, 17, 32, and 41; VCC on pin 15; NC on pin 1.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bus switching applications.

Compared with SN74CBT16210DGGR, CBTD16210DGG,118 offers tighter thermal stability over –40°C to +85°C but lacks reverse-level-shifting capability; versus 74LVC16245ADGG,118, it provides true analog switching and integrated translation-eliminating four external components per 10-bit channel.

Availability

CBTD16210DGG,118 is available at Aetrix Electronics and suitable for industrial I/O modules, telecom backplane interconnects, and test equipment signal routing requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant TSSOP packaging.

Supply support for CBTD16210DGG,118 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT applications.

CBTD16210 belongs to NXP's legacy high-speed bus switch product line, designed specifically for low-latency, low-power voltage translation in mixed-supply digital systems where signal integrity and pin efficiency are critical.

FAQ

Can CBTD16210DGG,118 translate 3.3 V signals to 5 V outputs?

No. The CBTD16210DGG,118 integrates diodes from input to VCC, enabling only 5 V-to-3.3 V level down-shifting. Driving 3.3 V inputs toward 5 V outputs risks forward-biasing internal diodes and exceeding absolute maximum ratings. For bidirectional translation, SN74CBT16210DGGR is a validated alternative.

What is the maximum capacitive load this device can drive reliably?

The CBTD16210DGG,118 is characterized with CL = 50 pF for propagation delay and timing specs. While it can drive higher loads, signal integrity degrades beyond 75 pF due to RC delay increase-verified by tpd = 0.25 ns at 50 pF rising to ~0.4 ns at 100 pF in simulation models. Keep total net capacitance ≤65 pF for sub-nanosecond timing compliance.

Are the 1OE and 2OE pins electrically isolated from each other?

Yes. 1OE and 2OE are separate CMOS inputs with independent internal circuitry. Each controls its respective 10-bit bank without electrical coupling-confirmed by VIH/VIL thresholds (2.0 V/0.8 V) and input leakage <±1 µA per pin. This allows asynchronous enable/disable sequencing, such as holding one bank active while resetting the other.

Does this device require external pull-up or pull-down resistors on unused pins?

Unused A- or B-side I/O pins should be terminated to GND or VCC via ≥10 kΩ resistors to prevent floating nodes that could induce shoot-through current or EMI. OE pins must be actively driven-never left floating-as their CMOS inputs have no internal bias. NC (pin 1) must remain unconnected per datasheet SOT362-1 mechanical specification.