Nexperia USA Inc. CBTD16210DGG/S400,

Overview

CBTD16210DGG/S400 from NXP Semiconductors (formerly Philips) is a 20-bit TTL-compatible bus switch with dual 10-bit output-enable control, 5 Ω on-state resistance, and integrated 5.5 V-to-3.3 V level shifting capability. It operates from –40°C to +85°C and supports high-speed data routing in mixed-voltage memory and peripheral interfaces.

For engineers reviewing the CBTD16210DGG/S400 datasheet, CBTD16210DGG/S400 pinout, CBTD16210DGG/S400 application, or CBTD16210DGG/S400 equivalent, key selection criteria include propagation delay (250 ps), output-enable timing (tPZH = 1.5–7.5 ns), on-resistance tolerance (5–7 Ω), and dual OE-controlled 10-bit channel isolation for flexible bus segmentation.

Technical Context

The CBTD16210 implements two independent 10-bit bidirectional analog switches with TTL-level control inputs and internal diode-based level translation from 5 V-domain A-side signals to 3.3 V-domain B-side outputs. Each channel features separate OE pins enabling asymmetric enable/disable sequencing.

Its architecture avoids active logic-functioning as passive FET-based transmission gates-delivering minimal propagation delay (250 ps typical) and low capacitive loading (CIN = 4.3 pF, COUT = 6.9 pF). The device is not a logic gate or buffer but a voltage-tolerant signal path selector optimized for hot-swap-capable backplane and memory expansion interfaces.

Key Specifications

Pinout & Package

CBTD16210DGG/S400 is housed in a 48-pin TSSOP package (SOT362-1), 6.1 mm body width, lead pitch 0.5 mm, with exposed pad not connected. Pin 1 is NC; pins 47–48 are OE inputs; ground pins are at positions 8, 17, 32, and 41; VCC is at pin 15.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bus switching applications.

Compared with SN74CBT16210DGGR, CBTD16210DGG/S400 offers extended temperature support critical for base station and motor drive applications; versus 74LVC16245ADGG, it eliminates external level-shifting components and associated timing uncertainty, reducing BOM count and layout complexity.

Availability

CBTD16210DGG/S400 is available at Aetrix Electronics and suitable for memory expansion interfaces, PCI add-in cards, legacy peripheral bridges, and multi-voltage backplanes requiring stable component supply across industrial, telecom, and embedded computing programs.

Supply support for CBTD16210DGG/S400 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with roots in Philips' pioneering analog and logic portfolio.

CBTD16210 belongs to NXP's legacy high-speed bus switch product line, designed specifically for voltage-domain bridging in mixed-supply systems where signal integrity, timing predictability, and component count reduction are critical design objectives.

FAQ

What is the maximum allowable input voltage on the A-side pins?

The absolute maximum rating for A-side input voltage is +7.0 V, but continuous operation above VCC + 0.5 V risks forward-biasing internal clamp diodes and increasing ICCZ. For reliable 5 V-to-3.3 V level shifting, inputs must be limited to VCC (4.5–5.5 V) with VIH ≥ 2.0 V and VIL ≤ 0.8 V per recommended operating conditions.

Can CBTD16210DGG/S400 be used for unidirectional signal translation only?

Yes - though bidirectional by design, the device functions reliably as a unidirectional translator when one side (e.g., A-port) is driven and the other (B-port) is loaded, provided OE is asserted and signal swing remains within 0–3.3 V on B-side. No direction-control pin is required, unlike true direction-aware transceivers.

Does the device require external pull-up or pull-down resistors on OE pins?

No - OE inputs are TTL-compatible with defined VIH (≥2.0 V) and VIL (≤0.8 V) thresholds and exhibit ±1 µA leakage current. Driving OE directly from a 3.3 V or 5 V GPIO or logic gate is sufficient; no external biasing resistors are needed for proper high-impedance state control.

How does thermal performance differ between TSSOP and SSOP packages?

The TSSOP package (SOT362-1) has lower thermal resistance than SSOP (SOT370-1) due to thinner mold compound and improved heat spreading across the 6.1 mm body. At 100 Mbps switching with 10 mA per channel, TSSOP junction temperature rise is ~8°C lower - critical for sustained operation in enclosed industrial enclosures above 60°C ambient.