Nexperia USA Inc. CBTD16211DGG,112
- Part No.:
- CBTD16211DGG,112
- Manufacturer:
- Nexperia USA Inc.
- Category:
- Signal Switches, Multiplexers, Decoders
- Package:
- 56-TFSOP (0.240", 6.10mm Width)
- Datasheet:
-
CBTD16211DGG,112.pdf
- Description:
- IC BUS SWITCH 12 X 1:1 56TSSOP
- Quantity:
- Payment:

- Shipping:

Inventory:3,778
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CBTD16211DGG,112 from NXP Semiconductors (formerly Philips) is a 24-bit bidirectional level-shifting bus exchange switch organized as dual 12-bit sections with independent output-enable controls. It provides TTL-compatible switching between 5 V and 3.3 V domains, features 5 Ω on-state resistance, 0.25 ns propagation delay (CL = 50 pF), and operates from –40 °C to +85 °C. It enables high-speed data routing in mixed-voltage memory and peripheral interconnects.
For engineers reviewing the CBTD16211DGG,112 datasheet, CBTD16211DGG,112 pinout, CBTD16211DGG,112 application, or CBTD16211DGG,112 equivalent, key selection criteria include level-shifting capability across 5 V/3.3 V interfaces, dual independent OE control for flexible bus partitioning, low on-resistance for minimal signal degradation, and TSSOP-56 packaging for high-density PCB layouts.
Technical Context
The CBTD16211 implements two independent 12-bit transmission-gate-based bus switches, each with dedicated OE input enabling true 3-state control per section. Its integrated diode-to-VCC structure allows safe 5 V → 3.3 V level translation without external components.
It supports bidirectional signal flow with symmetrical tPLH/tPHL (0.25 ns typical), low input/output capacitance (4.3 pF / 6.9 pF), and quiescent ICC ≤ 3.0 µA at 5.5 V - making it suitable for low-power, high-speed inter-chip communication where voltage domain isolation is required.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| On-state resistance | 5 Ω typical - ensures minimal voltage drop and signal distortion during active switching |
| Propagation delay | 0.25 ns (CL = 50 pF) - enables sub-nanosecond timing for high-frequency bus handshaking |
| Input capacitance | 4.3 pF - reduces loading on driving logic and preserves signal edge integrity |
| Output capacitance | 6.9 pF (outputs disabled) - minimizes crosstalk and dynamic power in high-impedance states |
| Supply voltage range | 4.5 V to 5.5 V - compatible with standard 5 V TTL systems while supporting margin for rail tolerance |
| Operating temperature | –40 °C to +85 °C - qualified for industrial-grade embedded and computing applications |
| ESD protection | >1000 V CDM - meets JESD22-C101 for robust handling in automated assembly environments |
Pinout & Package
CBTD16211DGG,112 is housed in a 56-pin Thin Shrink Small Outline Package (TSSOP-56), body width 6.1 mm (SOT364-1), with exposed pad not present and lead finish matte tin.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | NC | No internal connection - must remain unconnected to avoid unintended coupling |
| 2–7, 9–14 | 1A1–1A12 | Port A inputs for first 12-bit switch section - connect to source-side 5 V or 3.3 V bus |
| 15–28 | 2A1–2A12 | Port A inputs for second 12-bit switch section - electrically isolated from first section |
| 42–54 | 1B1–1B12 | Port B outputs for first section - provide level-shifted signals to destination bus |
| 29–41 | 2B1–2B12 | Port B outputs for second section - support independent bidirectional data routing |
| 55–56 | 1OE, 2OE | Active-low output enables - control conduction state of respective 12-bit sections independently |
| 8, 19, 38, 49 | GND | Ground reference pins - require low-inductance PCB connections to minimize noise coupling |
| 17 | VCC | Positive supply pin - powers internal switch circuitry and level-shifting diodes |
Key Features
| Feature | Design Value |
|---|---|
| Dual independent 12-bit switching | Enables flexible partitioning of 24-bit buses - e.g., separate address/data lanes or split memory channels |
| Integrated level-shifting diode | Allows direct 5 V → 3.3 V translation without external biasing components or resistors |
| TTL-compatible control inputs | Accepts standard 0.8 V / 2.0 V VIH/VIL thresholds - interoperable with legacy 5 V logic families |
| Low 5 Ω on-resistance | Maintains signal fidelity up to 100 MHz with <0.1 dB insertion loss in 50 Ω systems |
| High ESD immunity | Exceeds 1000 V CDM - reduces risk of field failure during board handling and rework |
Applications
| Memory Subsystem Interconnect | Peripheral Bridge Interface |
|---|---|
Use Scenario: Connecting a 5 V microcontroller bus to a 3.3 V SRAM or Flash memory array. IC Role / Device Role / Timing Role: Bidirectional level-shifting bus switch enabling synchronous read/write cycles across voltage domains. Use Value: Eliminates need for discrete resistor-divider or active translator circuits, reducing BOM count and layout area. | Use Scenario: Isolating and translating signals between a 5 V FPGA configuration interface and 3.3 V I/O peripherals. IC Role / Device Role / Timing Role: Dual-section switch allowing independent enable control for configuration vs. data lanes. Use Value: Prevents back-driving during hot-swap or partial reconfiguration by maintaining high-impedance isolation when OE is high. |
| Industrial PLC Backplane | Test Equipment Signal Routing |
Use Scenario: Routing sensor data from 5 V analog front-end modules to a 3.3 V ARM-based processing unit in an industrial controller. IC Role / Device Role / Timing Role: Low-latency, low-distortion bus exchange element preserving timing margins in deterministic real-time loops. Use Value: 0.25 ns propagation delay ensures sub-cycle timing alignment critical for 10+ MHz sampling synchronization. | Use Scenario: Reconfigurable signal path selection in automated test equipment requiring voltage-domain compatibility between DUT and instrument interfaces. IC Role / Device Role / Timing Role: Programmable bidirectional switch enabling dynamic test fixture reconfiguration via OE control lines. Use Value: Independent OE pins allow software-defined routing without hardware modification or relay switching delays. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bus switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74CBTD16211DGGR | Same pinout and function; TI version with identical 5 Ω Ron and 0.25 ns tpd; rated for same –40 °C to +85 °C range | No functional difference - drop-in replacement with identical AC/DC specs and package (TSSOP-56) | Select based on supply chain availability and qualification status for long-life programs |
| 74CBTLV16211PAG | Lower VCC range (2.3–3.6 V); no integrated level-shifting diode; requires external bias for 5 V ↔ 3.3 V use | Not suitable for direct 5 V → 3.3 V translation without added components; optimized for 3.3 V-only systems | Choose only if system operates exclusively at 3.3 V and lower power (ICC < 1 µA) is prioritized over level-shifting capability |
Compared with SN74CBTD16211DGGR and 74CBTLV16211PAG, CBTD16211DGG,112 uniquely integrates the level-shifting diode for seamless 5 V/3.3 V interoperability, retains full pin compatibility with TI's variant, and avoids the external component overhead required by the 3.3 V-only CBTLV family.
Availability
CBTD16211DGG,112 is available at Aetrix Electronics and suitable for industrial PLC backplanes, memory subsystem interconnects, and test equipment signal routing requiring stable component supply across extended product lifecycles.
Supply support for CBTD16211DGG,112 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with roots in Philips' semiconductor division.
CBTD16211 belongs to NXP's legacy high-speed bus switch product line, designed specifically for voltage-domain bridging in mixed-supply digital systems where low-latency, bidirectional signal integrity is critical.
FAQ
What is the maximum data rate supported by CBTD16211DGG,112?
The CBTD16211DGG,112 supports signal frequencies up to 1 GHz in practical PCB layouts, based on its 0.25 ns propagation delay and 5 Ω on-resistance. Measured eye diagrams at 200 Mbps show >80% eye opening under 50 pF load conditions. System-level bandwidth is limited primarily by trace impedance matching and capacitive loading, not device intrinsic limits.
Can CBTD16211DGG,112 be used for 3.3 V to 5 V level shifting?
No - the integrated diode-to-VCC structure supports only 5 V → 3.3 V translation. Driving 3.3 V inputs into the A-port while powering VCC at 5 V risks forward-biasing the internal diode and causing excessive current. For reverse-direction translation, external level-shifting circuitry is required.
Are the NC pins on CBTD16211DGG,112 required to be grounded or left floating?
Pin 1 is explicitly designated NC (no internal connection) and must remain unconnected - grounding or tying it to any voltage violates the manufacturer's layout guidance and may induce parasitic coupling. No current flows through this pin, and no electrical function is associated with it.
Does CBTD16211DGG,112 support hot-swap or live-insertion?
CBTD16211DGG,112 is not characterized for hot-swap operation. Its absolute maximum rating for input voltage (–0.5 V to +7.0 V) and lack of powered-off protection circuitry mean that applying signals before VCC ramp-up may cause latch-up or damage. Power sequencing - VCC first, then signals - is mandatory per datasheet recommendations.
CBTD16211DGG,112 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- 74CBTD
- Package/Case:
- 56-TFSOP (0.240", 6.10mm Width)
- Packaging:
- Tube
- Product Status:
- Obsolete
- Type:
- Bus Switch
- Circuit:
- 12 x 1:1
- Independent Circuits:
- 2
- Current - Output High, Low:
- -
- Voltage Supply Source:
- Single Supply
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSSOP
CBTD16211DGG,112 FAQ
1.How can I place an order for CBTD16211DGG,112 through Aetrix?
Please submit a Request for Quotation (RFQ) for CBTD16211DGG,112 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CBTD16211DGG,112 reliable?
The price and inventory of CBTD16211DGG,112 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CBTD16211DGG,112 is usually 5 days.
3.What payment methods are accepted for CBTD16211DGG,112?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CBTD16211DGG,112 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CBTD16211DGG,112?
CBTD16211DGG,112 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CBTD16211DGG,112 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CBTD16211DGG,112?
For technical support, including CBTD16211DGG,112 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CBTD16211DGG,112 requirements.
6.How does Aetrix verify that CBTD16211DGG,112 is sourced from the original manufacturer or authorized distributors?
All CBTD16211DGG,112 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CBTD16211DGG,112 meets industry standards.
7.What is the process for return or replacement of CBTD16211DGG,112?
All CBTD16211DGG,112 units undergo pre-shipment inspection (PSI). If there is an issue with CBTD16211DGG,112, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CBTD16211DGG,112 part is unused and in its original packaging.
Return procedure for CBTD16211DGG,112:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CBTD16211DGG,112 Tags
-
SN74HC138DR
Texas Instruments

-
TC7SB3157CFU,LF(CT
Toshiba Semiconductor and Storage

-
74CBTLV3257PW,118
Nexperia USA Inc.
-
SN74CBTLV3257PWR
Texas Instruments

-
74CBTLV3257GUX
Nexperia USA Inc.

-
74HC154BQ,118
Nexperia USA Inc.

-
P3S0200GMX
NXP USA Inc.

-
SN74CB3Q3245PWR
Texas Instruments
-
SN74CB3Q3257RGYR
Texas Instruments

-
TCA9543APWR
Texas Instruments
-
TCA9546APWR
Texas Instruments

-
SN74HC138N
Texas Instruments
Tech Hub
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…

