Nexperia USA Inc. CBTD16211DL,512

Overview

CBTD16211DL,512 from NXP Semiconductors (formerly Philips) is a 24-bit TTL-compatible bus exchange switch with dual 12-bit channels, 5 Ω on-state resistance, level-shifting capability (5 V ↔ 3.3 V), and independent 1OE/2OE control. It enables high-speed bidirectional data routing in mixed-voltage memory and peripheral interfaces.

For engineers reviewing the CBTD16211DL,512 datasheet, CBTD16211DL,512 pinout, CBTD16211DL,512 application, or CBTD16211DL,512 equivalent, key selection criteria include propagation delay (0.25 ns), on-resistance (5–7 Ω), output-enable timing (1.5–8.5 ns), and SSOP-56 thermal performance across –40 to +85 °C.

Technical Context

The CBTD16211 implements two independent 12-bit analog bus switches with TTL-level control inputs and integrated clamp diodes for 5 V-to-3.3 V level shifting. Each channel features separate OE pins enabling asymmetric enable/disable sequencing between ports A and B.

Its architecture supports reconfiguration as two 10-bit switches or one 20-bit switch via external OE logic. The device operates with 4.5–5.5 V supply, delivers <1.5 mA quiescent current, and maintains sub-1 ns propagation delay under 50 pF load - critical for high-throughput address/data bus isolation in legacy computing systems.

Key Specifications

Pinout & Package

CBTD16211DL,512 is housed in a 56-pin plastic shrink small outline package (SSOP), body width 7.5 mm, JEDEC MO-153 compliant (SOT371-1). Pin pitch is 0.5 mm; thermal pad not present.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bus switching applications.

Compared with SN74CBT16211DGGR, CBTD16211DL,512 offers identical electrical performance but in SSOP-56 for higher thermal mass; versus 74LVC16245ADGG, it provides true bidirectional level shifting and lower latency - essential for mixed-voltage legacy interface consolidation.

Availability

CBTD16211DL,512 is available at Aetrix Electronics and suitable for PCI bridge interfaces, ISA bus isolation, multi-voltage memory subsystems, and embedded controller address bus multiplexing requiring stable component supply across extended product lifecycles.

Supply support for CBTD16211DL,512 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with roots in Philips' pioneering analog and logic portfolio.

The CBTD16211 belongs to NXP's legacy high-speed bus switch family, engineered specifically for voltage-domain bridging in retrofitted and long-lifecycle computing platforms where interoperability between 5 V and 3.3 V logic remains mission-critical.

FAQ

What is the maximum operating frequency supported by CBTD16211DL,512?

The CBTD16211DL,512 has a typical propagation delay of 0.25 ns under 50 pF load, implying theoretical operation up to ~2 GHz for single-edge transitions. However, practical bus frequency is constrained by system-level factors including trace length, termination, and driver strength - verified operation up to 100 MHz is documented in Philips application notes for ISA and PCI-bridge implementations.

Can CBTD16211DL,512 be used for unidirectional level shifting only?

Yes - though designed for bidirectional use, the device functions reliably in unidirectional mode when one side (e.g., 1A→1B) is driven and the reverse path is left unterminated. Its symmetrical Ron and low capacitance ensure minimal distortion; however, the integrated clamp diode is optimized for 5 V→3.3 V translation, not reverse direction.

Does CBTD16211DL,512 require external pull-up or pull-down resistors on OE pins?

No - the OE inputs are TTL-compatible with defined VIH (≥2.0 V) and VIL (≤0.8 V) thresholds. When driven directly from CMOS or TTL logic, no external biasing is needed. Internal input leakage is ±1 µA, so floating OE pins must be avoided to prevent unintended channel activation.

Is thermal derating required for continuous operation at +85 °C?

No thermal derating is specified - the device is fully characterized from –40 to +85 °C with no reduction in Ron, tpd, or VIH/VIL limits. Junction temperature remains within safe limits (<150 °C) under typical 1.5 mA ICC and 5 V supply, provided standard SSOP-56 PCB copper pour guidelines are followed.