Nexperia USA Inc. CBTD16211DL,518

Overview

CBTD16211DL,518 from NXP Semiconductors (formerly Philips) is a 24-bit TTL-compatible bus exchange switch with dual 12-bit channels, 5 Ω on-state resistance, level-shifting capability (5 V ↔ 3.3 V), and independent output-enable control per channel. It operates from –40 °C to +85 °C and is used in high-speed interconnects between mixed-voltage subsystems in industrial backplanes and embedded computing.

For engineers reviewing the CBTD16211DL,518 datasheet, CBTD16211DL,518 pinout, CBTD16211DL,518 application, or CBTD16211DL,518 equivalent, key selection criteria include propagation delay (0.25 ns), on-resistance (5–7 Ω), input/output capacitance (4.3 pF / 6.9 pF), quiescent current (3.0 µA), and dual OE-controlled 12-bit channel isolation.

Technical Context

The CBTD16211DL implements two independent 12-bit bidirectional analog switches with TTL-level control inputs and integrated diode-based level shifting from 5 V inputs to 3.3 V outputs. Each channel features separate OE pins enabling selective activation without affecting the other path.

Its architecture supports reconfiguration as two 10-bit switches or one 20-bit switch via external OE logic. The device uses CMOS transmission-gate topology with low-impedance pass transistors, delivering sub-nanosecond propagation delay under 50 pF load and maintaining high-impedance isolation when disabled.

Key Specifications

Pinout & Package

CBTD16211DL,518 is housed in a 56-pin plastic shrink small outline package (SSOP), body width 7.5 mm, drawing code SOT371-1. Pin 1 is NC; pins 55–56 are OE controls; ports A/B are organized across four 12-bit groups with dedicated GND (pins 8, 19, 38, 49) and VCC (pin 17).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bus exchange switch applications.

Compared with SN74CBT16211DGGR and 74LVC16245ADGG, CBTD16211DL,518 uniquely integrates diode-based level shifting in a single SSOP-56 package, eliminating external components for 5 V ↔ 3.3 V bus bridging while maintaining sub-ns timing and dual independent channel control - critical for space-constrained industrial and automotive modules.

Availability

CBTD16211DL,518 is available at Aetrix Electronics and suitable for industrial backplane interconnects, embedded memory subsystem bridging, automotive diagnostic interface hubs, and test equipment signal routing matrices requiring stable component supply across extended temperature ranges.

Supply support for CBTD16211DL,518 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with roots in Philips' pioneering analog and logic portfolio.

The CBTD16211 belongs to NXP's legacy high-speed bus switch family, designed specifically for low-latency, mixed-voltage domain bridging in resource-constrained embedded systems where passive switching and integrated level translation are mandatory.

FAQ

What is the maximum recommended operating voltage for CBTD16211DL,518?

The absolute maximum DC supply voltage is +7.0 V, but the recommended operating range is strictly 4.5 V to 5.5 V per the datasheet. Operation above 5.5 V risks exceeding the 150 °C junction temperature limit and may cause permanent damage due to increased leakage and thermal runaway in the switch transistors.

Can CBTD16211DL,518 be used for 3.3 V to 5 V level shifting?

No - the internal diode structure is optimized for 5 V → 3.3 V translation only. Driving 3.3 V inputs will not forward-bias the diode toward VCC, resulting in undefined output levels and potential latch-up. For bidirectional or reverse-level shifting, external circuitry or a different device such as the TXB0108 is required.

How does the dual OE architecture affect timing in synchronous bus applications?

Each OE pin controls its associated 12-bit channel independently, allowing staggered enable/disable sequencing. This enables precise bus turnaround timing - e.g., disabling one channel before enabling the other - to prevent bus contention in half-duplex protocols like certain memory interfaces or legacy ISA-style expansions.

Is CBTD16211DL,518 pin-compatible with the TSSOP variant CBTD16211DGG?

No - although functionally identical, the SSOP-56 (SOT371-1) and TSSOP-56 (SOT364-1) packages have different pinouts and mechanical footprints. The SSOP variant has wider lead pitch (0.5 mm vs. 0.4 mm) and larger body dimensions (7.5 mm vs. 6.1 mm width), making them non-interchangeable without PCB redesign.