NXP Semiconductors CBTU4411EE,518
- Part No.:
- CBTU4411EE,518
- Manufacturer:
- NXP Semiconductors
- Category:
- Signal Switches, Multiplexers, Decoders
- Package:
- 72-LFBGA
- Datasheet:
-
CBTU4411EE,518.pdf
- Description:
- CBTU4411 - 11-BIT DDR2 SDRAM MUX
- Quantity:
- Payment:

- Shipping:

Inventory:5,990
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Product details
Overview
CBTU4411EE,518 from NXP Semiconductors is an 11-bit DDR2 SDRAM multiplexer/bus switch optimized for 1.7 V to 1.9 V operation with SSTL_18 select inputs, 12 Ω nominal ON-resistance, <30 ps output skew, and integrated 400 Ω DIMM-port pull-down resistors. It serves as a high-speed, low-skew signal routing device between host controller and 1–2-rank DDR2 DIMMs in memory subsystems.
For engineers reviewing the CBTU4411EE,518 datasheet, CBTU4411EE,518 pinout, CBTU4411EE,518 application, or CBTU4411EE,518 equivalent, this device supports precise timing-critical DDR2 data bus switching at 200–400 MHz, offers configurable strobe channel handling on HP10/DP10, and delivers controlled enable/disable times for fast bus turnaround in server and embedded memory modules.
Technical Context
The CBTU4411EE,518 implements a 1:4 multiplexed architecture per channel using pseudo-differential SSTL_18 select inputs (S0/S1) referenced to VREF = 0.5×VDD, enabling accurate, slew-rate-independent switching control. Its decoder-driven EN/S0/S1 logic ensures only one DIMM port (0DPn–3DPn) connects to each Host port (HP0–HP10) at any time.
In strobe mode (STREN = HIGH), channel 10 provides differential strobe support with internal 3⁄4×VDD pull-up when idle and disables pull-down during disable for current savings. All switches feature matched rise/fall slew rates, <30 ps edge skew, and low crosstalk between data/data and data/DQM lines - critical for DDR2 signal integrity.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDD Range | 1.7 V to 1.9 V - matches DDR2 SSTL_18 I/O voltage standard and eliminates level-shifting requirements. |
| ON Resistance | 12 Ω typical - eliminates need for external series termination resistors on DDR2 data paths. |
| Output Skew | <30 ps - ensures tight timing alignment across all 11 channels for simultaneous DDR2 data capture. |
| Propagation Delay | 50 ps typical - enables sub-1 ns round-trip latency for high-frequency DDR2 bus turnaround. |
| Pull-down Rpd | 400 Ω typical - provides stable, externally biased termination for DIMM ports during disable state. |
| Input Capacitance | 3 pF on S0/S1 - minimizes loading on SSTL_18 select lines and preserves signal integrity. |
| Supply Current | 6 mA typical active, 5 μA typical disabled - supports low-power memory subsystem standby modes. |
Pinout & Package
LFBGA72 package (SOT856-1): plastic low-profile fine-pitch BGA, 7 × 7 × 1.05 mm body, 72 solder balls.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| HP0–HP10 | Host port I/O | 11 bidirectional data lanes connecting to memory controller; routed to selected DIMM port via switch matrix. |
| 0DP0–3DP10 | DIMM port I/O | 44 total DIMM-side terminals (4 per channel × 11 channels); each group of four connects to one rank's DQ/DQS lines. |
| EN | Enable input (active LOW) | Single-pin global disable: drives all switches to high-Z, isolating host from all DIMM ports simultaneously. |
| S0, S1 | Pseudo-differential select inputs | 2-bit encoded control (with VREF reference) selecting one of four DIMM ports per channel; supports SSTL_18 signaling. |
| STREN | Strobe enable (active HIGH) | Configures channel 10 (HP10/DP10) as differential strobe with 3⁄4×VDD pull-up when idle and EN = LOW. |
| VBIAS | Bias voltage input | Sets pull-down strength on xDPn ports; typically 0.3×VDD for optimal DDR2 termination behavior. |
| VREF | Select input reference | Supplies 0.5×VDD reference for SSTL_18-compatible S0/S1 receivers to ensure accurate threshold switching. |
| TERM | Sn termination control | Activates internal 80 Ω Thevenin termination on S0/S1 when HIGH; reduces external component count. |
Key Features
| Feature | Design Value |
|---|---|
| 1:4 MUX per channel | Reduces host-to-DIMM routing complexity by consolidating four rank-select paths into two control bits (S0/S1). |
| Configurable strobe channel | Enables dedicated DQS handling on HP10/DP10 with programmable pull-up/pull-down behavior for DDR2 strobe timing compliance. |
| Integrated 400 Ω pull-down | Eliminates need for external bias resistors on DIMM ports, simplifying PCB layout and improving termination consistency. |
| Low crosstalk design | Minimizes interference between adjacent data lines and DQM signals - essential for maintaining DDR2 eye margin at 400 MHz. |
| Latch-up & ESD robustness | Exceeds 500 mA latch-up immunity (JESD78) and 1500 V HBM ESD protection (JESD22-A114), ensuring reliability in production environments. |
Applications
| DDR2 Memory Module Interfacing | Server Memory Subsystem |
|---|---|
Use Scenario: Routing data/address/control signals between memory controller and dual-rank DDR2 DIMMs in desktop or workstation motherboards. IC Role / Device Role / Timing Role: 11-bit bidirectional bus switch providing rank-select multiplexing with sub-30 ps skew for synchronized DQ capture. Use Value: Enables single-controller support of multiple DIMM ranks without timing degradation or added board area for discrete termination. |
Use Scenario: High-density memory buffering in 1U/2U rack servers requiring low-latency, low-power DDR2 signal routing. IC Role / Device Role / Timing Role: Host-to-DIMM interface switch with fast enable/disable (≤1.75 ns) supporting rapid memory bank switching during burst transfers. Use Value: Reduces memory access latency and power consumption versus discrete FET solutions while maintaining JEDEC-compliant signal integrity. |
| Embedded DDR2 Memory Expansion | Industrial Control Memory Interface |
Use Scenario: Adding expandable DDR2 memory to ARM-based industrial controllers or FPGA-based vision systems. IC Role / Device Role / Timing Role: Low-voltage (1.8 V) bus switch enabling compatibility with 1.8 V I/O domains and minimizing level-shifter count. Use Value: Simplifies memory interface design for space-constrained embedded boards while meeting DDR2 tAC and tDQSS timing budgets. |
Use Scenario: Reliable memory interfacing in harsh-environment PLCs and motion controllers operating across 0 °C to +85 °C. IC Role / Device Role / Timing Role: Temperature-stable DDR2 switch with guaranteed 12 Ω RON and 400 Ω Rpd over full industrial temperature range. Use Value: Ensures consistent signal termination and propagation delay across thermal cycles, preventing intermittent memory errors. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar DDR2 bus switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NB7L14M | 4-channel LVDS multiplexer with 2.5 V supply; no SSTL_18 inputs or DIMM-port pull-downs. | Designed for serial link clock/data distribution, not parallel DDR2 bus routing. | Use only if migrating to LVDS-based memory interfaces; requires redesign of control logic and termination. |
| PI3CH4411 | 11-bit 3.3 V CMOS bus switch with 5 Ω RON but no SSTL_18 compatibility or strobe-mode configuration. | Targets legacy SDR/DDR1 systems; lacks VREF-referenced select inputs and VBIAS-controlled pull-down. | Acceptable for non-DDR2 designs where 3.3 V operation and simpler control suffice; not drop-in for DDR2. |
Compared with NB7L14M and PI3CH4411, the CBTU4411EE,518 uniquely integrates SSTL_18 select inputs, programmable strobe channel behavior, and 400 Ω VBIAS-controlled pull-downs - making it the only option qualified for JEDEC-compliant DDR2 DIMM rank selection without external components.
Availability
CBTU4411EE,518 is available at Aetrix Electronics and suitable for DDR2 memory module interfacing, server memory subsystems, embedded DDR2 expansion, and industrial control memory interfaces requiring stable component supply and long-term lifecycle support.
Supply support for CBTU4411EE,518 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and communication applications.
The CBTU4411EE,518 belongs to NXP's DDR2 interface IC product line, designed specifically to simplify high-speed memory routing in cost-sensitive, space-constrained DDR2 systems while meeting JEDEC timing and signal integrity requirements.
FAQ
What is the function of the STREN pin on the CBTU4411EE,518?
The STREN (strobe enable) pin configures channel 10 (HP10 and associated DIMM ports) as a differential strobe channel when driven HIGH. In this mode, the unselected DIMM port is pulled up to 3⁄4×VDD internally, and pull-down is disabled during disable states to reduce current. When STREN is LOW, channel 10 behaves identically to channels 0–9. This functionality is integral to DDR2 DQS signal handling in the CBTU4411EE,518.
Does the CBTU4411EE,518 support 1-rank and 2-rank DIMMs?
Yes, the CBTU4411EE,518 is explicitly optimized for connection to both 1-rank and 2-rank DDR2 DIMMs. Its 1:4 multiplexing per channel, low ON-resistance (12 Ω), and controlled skew (<30 ps) ensure signal integrity across rank-switching scenarios. Each of the 11 channels independently selects among four DIMM ports, accommodating dual-rank topologies without performance compromise in the CBTU4411EE,518.
What is the purpose of the VBIAS pin on the CBTU4411EE,518?
The VBIAS pin sets the bias voltage for the internal 400 Ω pull-down resistors on all DIMM ports (xDPn). When the switch is disabled (EN = HIGH), VBIAS determines termination strength - typically set to 0.3×VDD per datasheet guidance. This allows precise control of termination impedance to match DDR2 DIMM electrical requirements, eliminating need for external bias networks in the CBTU4411EE,518.
Can the CBTU4411EE,518 operate outside the 1.7 V to 1.9 V supply range?
No - the CBTU4411EE,518 is characterized and specified only for VDD = 1.7 V to 1.9 V operation. Absolute maximum ratings allow up to 2.5 V, but functional operation, SSTL_18 input compatibility, ON-resistance, and timing parameters are guaranteed solely within the 1.7–1.9 V window. Operating outside this range may cause undefined behavior or failure to meet DDR2 timing specs in the CBTU4411EE,518.
How does the TERM pin affect S0 and S1 inputs on the CBTU4411EE,518?
When TERM = HIGH, the CBTU4411EE,518 activates internal 80 Ω Thevenin termination on S0 and S1 inputs, referenced to VREF, to match SSTL_18 bus impedance and reduce stub reflections. When TERM = LOW, termination is disconnected (high-impedance). During disable (EN = HIGH), S0/S1 are pulled LOW regardless of TERM state - a power-saving feature confirmed in the CBTU4411EE,518 datasheet.
CBTU4411EE,518 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- CBT
- Package/Case:
- 72-LFBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Type:
- Bus Switch
- Circuit:
- 11 x 4:1
- Independent Circuits:
- 1
- Current - Output High, Low:
- -
- Voltage Supply Source:
- Single Supply
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 72-LFBGA (7x7)
CBTU4411EE,518 FAQ
1.How can I place an order for CBTU4411EE,518 through Aetrix?
Please submit a Request for Quotation (RFQ) for CBTU4411EE,518 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CBTU4411EE,518 reliable?
The price and inventory of CBTU4411EE,518 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CBTU4411EE,518 is usually 5 days.
3.What payment methods are accepted for CBTU4411EE,518?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CBTU4411EE,518 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CBTU4411EE,518?
CBTU4411EE,518 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CBTU4411EE,518 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CBTU4411EE,518?
For technical support, including CBTU4411EE,518 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CBTU4411EE,518 requirements.
6.How does Aetrix verify that CBTU4411EE,518 is sourced from the original manufacturer or authorized distributors?
All CBTU4411EE,518 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CBTU4411EE,518 meets industry standards.
7.What is the process for return or replacement of CBTU4411EE,518?
All CBTU4411EE,518 units undergo pre-shipment inspection (PSI). If there is an issue with CBTU4411EE,518, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CBTU4411EE,518 part is unused and in its original packaging.
Return procedure for CBTU4411EE,518:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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