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NXP Semiconductors CBTU4411EE,551

Part No.:
CBTU4411EE,551
Manufacturer:
NXP Semiconductors
Category:
Signal Switches, Multiplexers, Decoders
Package:
72-LFBGA
Datasheet:
AetrixCBTU4411EE,551.pdf
Description:
IC BUS SWITCH 11 X 4:1 72LFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,252

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Product details

Overview

CBTU4411EE,551 from NXP Semiconductors is an 11-bit DDR2 SDRAM multiplexer/bus switch optimized for 1.7 V to 1.9 V VDD operation with SSTL_18 select inputs. It provides 1:4 channel selection across 11 host-to-DIMM data paths, features 12 Ω nominal ON-resistance, <30 ps output skew, and supports differential strobe configuration on channel 10 for DDR2 memory subsystems in 2-rank DIMM modules.

For engineers reviewing the CBTU4411EE,551 datasheet, CBTU4411EE,551 pinout, CBTU4411EE,551 application, or CBTU4411EE,551 equivalent, this device serves as a low-skew, low-propagation-delay bus switch for high-speed DDR2 data routing-requiring precise VREF biasing, VBIAS-controlled pull-down termination, and SSTL_18-compatible control timing.

Technical Context

The CBTU4411EE,551 implements a pseudo-differential SSTL_18 decoder using S0/S1 inputs referenced to VREF (0.49–0.51×VDD), enabling accurate switching time control independent of input slew rate. Its EN pin disables all 11 channels simultaneously into high-impedance, while STREN configures channel 10 for strobe-mode pull-up to 0.75×VDD when idle.

Each channel integrates a 400 Ω internal pull-down (Rpd = 280–520 Ω) tied to externally supplied VBIAS, and selectable Sn-input termination (RT = 55–105 Ω) activated by TERM. The design enforces single-active-DIMM-port operation and delivers matched rise/fall edge skew (<30 ps) critical for DDR2 400–800 Mbit/s data buses.

Key Specifications

Parameter Value and Actual Design Meaning
VDD Supply Range1.7 V to 1.9 V - defines strict low-voltage DDR2 interface compliance and limits I/O voltage swing
ON Resistance (RON)10–17 Ω (typ. 12 Ω) - eliminates need for external series termination resistors on DDR2 data lines
Output Skew (tsk(o))≤30 ps - ensures simultaneous switching across all 11 channels for timing-critical DDR2 DQ/DQS routing
Propagation Delay (tPD)50–100 ps - enables sub-nanosecond data path latency in high-frequency DDR2 memory interfaces
Pull-down Resistance (Rpd)280–520 Ω - provides controlled DIMM-port termination to VBIAS during disable state
Input Capacitance (Cin)3 pF - minimizes loading on SSTL_18 select signals to preserve signal integrity and timing margins
Supply Current (IDD)6 mA (active), 5 μA (disabled) - supports low-power standby in memory subsystem power management

Pinout & Package

LFBGA72 package: plastic low-profile fine-pitch ball grid array, 72-ball layout, 7 mm × 7 mm × 1.05 mm body. Ball pitch: 0.5 mm. Moisture Sensitivity Level (MSL): 3 per J-STD-020.

Pin/Terminal Circuit Role Design Meaning
HP0–HP10Host port inputs/outputs11 bidirectional data terminals connecting to memory controller side; routed to selected DIMM port via switch matrix
0DPn–3DPn (n=0–10)DIMM port terminalsFour parallel DIMM-side data paths per channel (0–10); only one active per channel under S0/S1 decode
EN (C2)Enable control inputLVCMOS-level active-LOW global disable - forces all DIMM ports into high-Z and disconnects host paths
S0 (B2), S1 (A1)Select address inputsPseudo-differential SSTL_18 inputs referenced to VREF; determine which of four DIMM ports connects to each HPn
VREF (C1)Reference voltage inputSupplies 0.49–0.51×VDD reference for S0/S1 receiver threshold; critical for stable decode timing
VBIAS (D1)Bias voltage inputExternally supplied voltage (0–0.33×VDD) setting pull-down strength on disabled DIMM ports via internal Rpd
STREN (A2)Strobe enable inputLVCMOS HIGH activates channel 10 as differential strobe: pulls HP10 to 0.75×VDD when idle and unselected
TERM (B1)Termination enableActivates internal 55–105 Ω Thevenin termination on S0/S1 inputs when HIGH; reduces signal reflection

Key Features

Feature Design Value
1:4 multiplexed DDR2 data routing11 independent channels each selecting one of four DIMM data paths via 2-bit S0/S1 encoding
Configurable strobe channel (CH10)STREN HIGH enables internal 0.75×VDD pull-up on HP10 for DDR2 DQS strobe signaling with reduced crosstalk
Controlled termination architectureVREF-referenced pseudo-differential S0/S1 + selectable Sn-input termination (RT = 55–105 Ω) for jitter-free switching
Low-impedance, low-skew switching12 Ω RON + <30 ps output/edge skew ensures signal integrity across full DDR2 200–400 MHz clock range
VBIAS-programmable pull-downInternal 400 Ω (280–520 Ω) pull-down on xDPn pins tied to user-supplied VBIAS for optimal DIMM-port DC termination

Applications

DDR2 Memory Controller Interface 2-Rank DIMM Module Routing

Use Scenario: Interfacing a DDR2 memory controller to multiple DIMM slots with shared data/address buses.

IC Role / Device Role / Timing Role: Bidirectional 11-bit bus switch providing dynamic 1:4 channel selection between controller and rank-specific DIMM data paths.

Use Value: Enables single-controller support of up to four DIMM ranks without external series resistors or discrete termination networks.

Use Scenario: Signal routing within a dual-rank DDR2 SO-DIMM module where data lines must be isolated between ranks.

IC Role / Device Role / Timing Role: Low-skew, low-capacitance switch isolating DQ/DQS lines between Rank 0 and Rank 1 based on chip-select decoding.

Use Value: Eliminates inter-rank crosstalk and maintains <30 ps skew across all 11 data bits for reliable 800 Mbit/s operation.

Differential Strobe Distribution DDR2 Data Bus Multiplexing

Use Scenario: Generating and distributing complementary DQS strobe signals in DDR2 systems requiring precise timing alignment.

IC Role / Device Role / Timing Role: Channel 10 configured as strobe path with programmable 0.75×VDD pull-up and matched propagation delay to data channels.

Use Value: Provides internally terminated, low-jitter strobe distribution synchronized to data paths-reducing board-level routing complexity.

Use Scenario: Sharing a single DDR2 data bus among multiple memory devices or test access points.

IC Role / Device Role / Timing Role: High-speed 11-bit analog switch enabling dynamic reconfiguration of data path connectivity during system initialization or debug.

Use Value: Supports flexible memory subsystem architecture with <100 ps propagation delay and no added series resistance on data lines.

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR2 bus switch applications.

Alternative Part Technical Difference Application Difference Selection Advice
NCP4411MNR2G12-bit, 1.8 V only, no STREN/strobe mode, higher RON (15 Ω typ.), no VBIAS controlLacks channel-10 strobe configuration and VBIAS-adjustable pull-down; suited for simpler 1:4 mux without DDR2 strobe requirementsSelect when strobe functionality and fine-grained DIMM-port termination are not required.
PI3CH4411LEX11-bit, 1.8 V, supports LVCMOS/SSTL-18 inputs, no VREF pin, fixed 400 Ω pull-down, no TERM pinMissing pseudo-differential S0/S1 interface and selectable Sn termination; less precise timing control in high-noise DDR2 environmentsChoose for cost-sensitive designs where VREF-referenced switching accuracy is non-critical.

Compared with NCP4411MNR2G and PI3CH4411LEX, the CBTU4411EE,551 uniquely combines VREF-referenced SSTL_18 decode, VBIAS-programmable pull-down, and configurable strobe capability-making it the only option supporting full DDR2-compliant 2-rank DIMM timing and termination requirements.

Availability

CBTU4411EE,551 is available at Aetrix Electronics and suitable for DDR2 memory subsystems, 2-rank DIMM modules, and high-speed data bus multiplexing applications requiring stable component supply and long-term industrial lifecycle support.

Supply support for CBTU4411EE,551 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and communication infrastructure markets.

The CBTU4411EE,551 belongs to NXP's DDR2 interface IC product line, designed specifically to solve signal integrity and routing challenges in high-density, high-speed memory subsystems operating at 200–400 MHz.

FAQ

What is the function of the VREF pin on the CBTU4411EE,551?

The VREF pin on the CBTU4411EE,551 supplies a precision reference voltage (0.49–0.51×VDD) to the pseudo-differential receivers for S0 and S1 select inputs. This ensures consistent switching thresholds and minimizes skew caused by input signal slew rate variations-critical for reliable 1:4 channel selection in DDR2 timing-critical applications. The CBTU4411EE,551 requires an externally filtered, low-noise VREF source.

How does the STREN pin affect channel 10 behavior in the CBTU4411EE,551?

When STREN is HIGH, channel 10 (HP10 and associated DIMM ports) operates in strobe mode: the unselected HP10 terminal is pulled up to 0.75×VDD via an internal resistor network, enabling differential DQS signaling. When STREN is LOW, channel 10 behaves identically to channels 0–9. This feature allows the CBTU4411EE,551 to serve both standard data and strobe routing functions without external components.

What is the purpose of the VBIAS pin on the CBTU4411EE,551?

The VBIAS pin on the CBTU4411EE,551 sets the effective resistance value of the internal 400 Ω pull-down (Rpd = 280–520 Ω) on all DIMM-port terminals (xDPn) when the switch is disabled. By applying a voltage between 0 V and 0.33×VDD to VBIAS, designers control termination strength to match DDR2 DIMM impedance requirements-ensuring clean signal decay during high-Z states without external resistors.

Can the CBTU4411EE,551 support 2-rank DDR2 SO-DIMMs?

Yes-the CBTU4411EE,551 is explicitly optimized for 1- or 2-rank DIMMs. Its 11-bit width matches DDR2 data bus requirements, its <30 ps output skew maintains timing alignment across ranks, and its VBIAS-controlled pull-down ensures proper termination when isolating Rank 0 and Rank 1 data paths. The CBTU4411EE,551 enables clean rank switching without signal integrity degradation.

What is the maximum data rate supported by the CBTU4411EE,551?

The CBTU4411EE,551 is characterized for use in DDR2 data buses operating from 400 Mbit/s to 800 Mbit/s (200 MHz to 400 MHz clock rates). Its 12 Ω ON-resistance, 50–100 ps propagation delay, and <30 ps skew meet JEDEC DDR2 timing specifications across the full commercial temperature range (0 °C to +85 °C). The CBTU4411EE,551 delivers deterministic performance at these speeds without external tuning.

CBTU4411EE,551 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
CBT
Package/Case:
72-LFBGA
Packaging:
Tray
Product Status:
Obsolete
Type:
Bus Switch
Circuit:
11 x 4:1
Independent Circuits:
1
Current - Output High, Low:
-
Voltage Supply Source:
Single Supply
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
-40°C ~ 85°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
72-LFBGA (7x7)

CBTU4411EE,551 FAQ

1.How can I place an order for CBTU4411EE,551 through Aetrix?

Please submit a Request for Quotation (RFQ) for CBTU4411EE,551 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CBTU4411EE,551 reliable?

The price and inventory of CBTU4411EE,551 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CBTU4411EE,551 is usually 5 days.

3.What payment methods are accepted for CBTU4411EE,551?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CBTU4411EE,551 transactions.

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4.How is shipping managed for CBTU4411EE,551?

CBTU4411EE,551 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CBTU4411EE,551 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CBTU4411EE,551?

For technical support, including CBTU4411EE,551 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CBTU4411EE,551 requirements.

6.How does Aetrix verify that CBTU4411EE,551 is sourced from the original manufacturer or authorized distributors?

All CBTU4411EE,551 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CBTU4411EE,551 meets industry standards.

7.What is the process for return or replacement of CBTU4411EE,551?

All CBTU4411EE,551 units undergo pre-shipment inspection (PSI). If there is an issue with CBTU4411EE,551, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CBTU4411EE,551 part is unused and in its original packaging.

Return procedure for CBTU4411EE,551:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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