NXP Semiconductors CBTU4411EE,551
- Part No.:
- CBTU4411EE,551
- Manufacturer:
- NXP Semiconductors
- Category:
- Signal Switches, Multiplexers, Decoders
- Package:
- 72-LFBGA
- Datasheet:
-
CBTU4411EE,551.pdf
- Description:
- IC BUS SWITCH 11 X 4:1 72LFBGA
- Quantity:
- Payment:

- Shipping:

Inventory:2,252
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CBTU4411EE,551 from NXP Semiconductors is an 11-bit DDR2 SDRAM multiplexer/bus switch optimized for 1.7 V to 1.9 V VDD operation with SSTL_18 select inputs. It provides 1:4 channel selection across 11 host-to-DIMM data paths, features 12 Ω nominal ON-resistance, <30 ps output skew, and supports differential strobe configuration on channel 10 for DDR2 memory subsystems in 2-rank DIMM modules.
For engineers reviewing the CBTU4411EE,551 datasheet, CBTU4411EE,551 pinout, CBTU4411EE,551 application, or CBTU4411EE,551 equivalent, this device serves as a low-skew, low-propagation-delay bus switch for high-speed DDR2 data routing-requiring precise VREF biasing, VBIAS-controlled pull-down termination, and SSTL_18-compatible control timing.
Technical Context
The CBTU4411EE,551 implements a pseudo-differential SSTL_18 decoder using S0/S1 inputs referenced to VREF (0.49–0.51×VDD), enabling accurate switching time control independent of input slew rate. Its EN pin disables all 11 channels simultaneously into high-impedance, while STREN configures channel 10 for strobe-mode pull-up to 0.75×VDD when idle.
Each channel integrates a 400 Ω internal pull-down (Rpd = 280–520 Ω) tied to externally supplied VBIAS, and selectable Sn-input termination (RT = 55–105 Ω) activated by TERM. The design enforces single-active-DIMM-port operation and delivers matched rise/fall edge skew (<30 ps) critical for DDR2 400–800 Mbit/s data buses.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDD Supply Range | 1.7 V to 1.9 V - defines strict low-voltage DDR2 interface compliance and limits I/O voltage swing |
| ON Resistance (RON) | 10–17 Ω (typ. 12 Ω) - eliminates need for external series termination resistors on DDR2 data lines |
| Output Skew (tsk(o)) | ≤30 ps - ensures simultaneous switching across all 11 channels for timing-critical DDR2 DQ/DQS routing |
| Propagation Delay (tPD) | 50–100 ps - enables sub-nanosecond data path latency in high-frequency DDR2 memory interfaces |
| Pull-down Resistance (Rpd) | 280–520 Ω - provides controlled DIMM-port termination to VBIAS during disable state |
| Input Capacitance (Cin) | 3 pF - minimizes loading on SSTL_18 select signals to preserve signal integrity and timing margins |
| Supply Current (IDD) | 6 mA (active), 5 μA (disabled) - supports low-power standby in memory subsystem power management |
Pinout & Package
LFBGA72 package: plastic low-profile fine-pitch ball grid array, 72-ball layout, 7 mm × 7 mm × 1.05 mm body. Ball pitch: 0.5 mm. Moisture Sensitivity Level (MSL): 3 per J-STD-020.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| HP0–HP10 | Host port inputs/outputs | 11 bidirectional data terminals connecting to memory controller side; routed to selected DIMM port via switch matrix |
| 0DPn–3DPn (n=0–10) | DIMM port terminals | Four parallel DIMM-side data paths per channel (0–10); only one active per channel under S0/S1 decode |
| EN (C2) | Enable control input | LVCMOS-level active-LOW global disable - forces all DIMM ports into high-Z and disconnects host paths |
| S0 (B2), S1 (A1) | Select address inputs | Pseudo-differential SSTL_18 inputs referenced to VREF; determine which of four DIMM ports connects to each HPn |
| VREF (C1) | Reference voltage input | Supplies 0.49–0.51×VDD reference for S0/S1 receiver threshold; critical for stable decode timing |
| VBIAS (D1) | Bias voltage input | Externally supplied voltage (0–0.33×VDD) setting pull-down strength on disabled DIMM ports via internal Rpd |
| STREN (A2) | Strobe enable input | LVCMOS HIGH activates channel 10 as differential strobe: pulls HP10 to 0.75×VDD when idle and unselected |
| TERM (B1) | Termination enable | Activates internal 55–105 Ω Thevenin termination on S0/S1 inputs when HIGH; reduces signal reflection |
Key Features
| Feature | Design Value |
|---|---|
| 1:4 multiplexed DDR2 data routing | 11 independent channels each selecting one of four DIMM data paths via 2-bit S0/S1 encoding |
| Configurable strobe channel (CH10) | STREN HIGH enables internal 0.75×VDD pull-up on HP10 for DDR2 DQS strobe signaling with reduced crosstalk |
| Controlled termination architecture | VREF-referenced pseudo-differential S0/S1 + selectable Sn-input termination (RT = 55–105 Ω) for jitter-free switching |
| Low-impedance, low-skew switching | 12 Ω RON + <30 ps output/edge skew ensures signal integrity across full DDR2 200–400 MHz clock range |
| VBIAS-programmable pull-down | Internal 400 Ω (280–520 Ω) pull-down on xDPn pins tied to user-supplied VBIAS for optimal DIMM-port DC termination |
Applications
| DDR2 Memory Controller Interface | 2-Rank DIMM Module Routing |
|---|---|
Use Scenario: Interfacing a DDR2 memory controller to multiple DIMM slots with shared data/address buses. IC Role / Device Role / Timing Role: Bidirectional 11-bit bus switch providing dynamic 1:4 channel selection between controller and rank-specific DIMM data paths. Use Value: Enables single-controller support of up to four DIMM ranks without external series resistors or discrete termination networks. |
Use Scenario: Signal routing within a dual-rank DDR2 SO-DIMM module where data lines must be isolated between ranks. IC Role / Device Role / Timing Role: Low-skew, low-capacitance switch isolating DQ/DQS lines between Rank 0 and Rank 1 based on chip-select decoding. Use Value: Eliminates inter-rank crosstalk and maintains <30 ps skew across all 11 data bits for reliable 800 Mbit/s operation. |
| Differential Strobe Distribution | DDR2 Data Bus Multiplexing |
Use Scenario: Generating and distributing complementary DQS strobe signals in DDR2 systems requiring precise timing alignment. IC Role / Device Role / Timing Role: Channel 10 configured as strobe path with programmable 0.75×VDD pull-up and matched propagation delay to data channels. Use Value: Provides internally terminated, low-jitter strobe distribution synchronized to data paths-reducing board-level routing complexity. |
Use Scenario: Sharing a single DDR2 data bus among multiple memory devices or test access points. IC Role / Device Role / Timing Role: High-speed 11-bit analog switch enabling dynamic reconfiguration of data path connectivity during system initialization or debug. Use Value: Supports flexible memory subsystem architecture with <100 ps propagation delay and no added series resistance on data lines. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar DDR2 bus switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NCP4411MNR2G | 12-bit, 1.8 V only, no STREN/strobe mode, higher RON (15 Ω typ.), no VBIAS control | Lacks channel-10 strobe configuration and VBIAS-adjustable pull-down; suited for simpler 1:4 mux without DDR2 strobe requirements | Select when strobe functionality and fine-grained DIMM-port termination are not required. |
| PI3CH4411LEX | 11-bit, 1.8 V, supports LVCMOS/SSTL-18 inputs, no VREF pin, fixed 400 Ω pull-down, no TERM pin | Missing pseudo-differential S0/S1 interface and selectable Sn termination; less precise timing control in high-noise DDR2 environments | Choose for cost-sensitive designs where VREF-referenced switching accuracy is non-critical. |
Compared with NCP4411MNR2G and PI3CH4411LEX, the CBTU4411EE,551 uniquely combines VREF-referenced SSTL_18 decode, VBIAS-programmable pull-down, and configurable strobe capability-making it the only option supporting full DDR2-compliant 2-rank DIMM timing and termination requirements.
Availability
CBTU4411EE,551 is available at Aetrix Electronics and suitable for DDR2 memory subsystems, 2-rank DIMM modules, and high-speed data bus multiplexing applications requiring stable component supply and long-term industrial lifecycle support.
Supply support for CBTU4411EE,551 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and communication infrastructure markets.
The CBTU4411EE,551 belongs to NXP's DDR2 interface IC product line, designed specifically to solve signal integrity and routing challenges in high-density, high-speed memory subsystems operating at 200–400 MHz.
FAQ
What is the function of the VREF pin on the CBTU4411EE,551?
The VREF pin on the CBTU4411EE,551 supplies a precision reference voltage (0.49–0.51×VDD) to the pseudo-differential receivers for S0 and S1 select inputs. This ensures consistent switching thresholds and minimizes skew caused by input signal slew rate variations-critical for reliable 1:4 channel selection in DDR2 timing-critical applications. The CBTU4411EE,551 requires an externally filtered, low-noise VREF source.
How does the STREN pin affect channel 10 behavior in the CBTU4411EE,551?
When STREN is HIGH, channel 10 (HP10 and associated DIMM ports) operates in strobe mode: the unselected HP10 terminal is pulled up to 0.75×VDD via an internal resistor network, enabling differential DQS signaling. When STREN is LOW, channel 10 behaves identically to channels 0–9. This feature allows the CBTU4411EE,551 to serve both standard data and strobe routing functions without external components.
What is the purpose of the VBIAS pin on the CBTU4411EE,551?
The VBIAS pin on the CBTU4411EE,551 sets the effective resistance value of the internal 400 Ω pull-down (Rpd = 280–520 Ω) on all DIMM-port terminals (xDPn) when the switch is disabled. By applying a voltage between 0 V and 0.33×VDD to VBIAS, designers control termination strength to match DDR2 DIMM impedance requirements-ensuring clean signal decay during high-Z states without external resistors.
Can the CBTU4411EE,551 support 2-rank DDR2 SO-DIMMs?
Yes-the CBTU4411EE,551 is explicitly optimized for 1- or 2-rank DIMMs. Its 11-bit width matches DDR2 data bus requirements, its <30 ps output skew maintains timing alignment across ranks, and its VBIAS-controlled pull-down ensures proper termination when isolating Rank 0 and Rank 1 data paths. The CBTU4411EE,551 enables clean rank switching without signal integrity degradation.
What is the maximum data rate supported by the CBTU4411EE,551?
The CBTU4411EE,551 is characterized for use in DDR2 data buses operating from 400 Mbit/s to 800 Mbit/s (200 MHz to 400 MHz clock rates). Its 12 Ω ON-resistance, 50–100 ps propagation delay, and <30 ps skew meet JEDEC DDR2 timing specifications across the full commercial temperature range (0 °C to +85 °C). The CBTU4411EE,551 delivers deterministic performance at these speeds without external tuning.
CBTU4411EE,551 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- CBT
- Package/Case:
- 72-LFBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Type:
- Bus Switch
- Circuit:
- 11 x 4:1
- Independent Circuits:
- 1
- Current - Output High, Low:
- -
- Voltage Supply Source:
- Single Supply
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 72-LFBGA (7x7)
CBTU4411EE,551 FAQ
1.How can I place an order for CBTU4411EE,551 through Aetrix?
Please submit a Request for Quotation (RFQ) for CBTU4411EE,551 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CBTU4411EE,551 reliable?
The price and inventory of CBTU4411EE,551 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CBTU4411EE,551 is usually 5 days.
3.What payment methods are accepted for CBTU4411EE,551?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CBTU4411EE,551 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CBTU4411EE,551?
CBTU4411EE,551 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CBTU4411EE,551 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CBTU4411EE,551?
For technical support, including CBTU4411EE,551 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CBTU4411EE,551 requirements.
6.How does Aetrix verify that CBTU4411EE,551 is sourced from the original manufacturer or authorized distributors?
All CBTU4411EE,551 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CBTU4411EE,551 meets industry standards.
7.What is the process for return or replacement of CBTU4411EE,551?
All CBTU4411EE,551 units undergo pre-shipment inspection (PSI). If there is an issue with CBTU4411EE,551, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CBTU4411EE,551 part is unused and in its original packaging.
Return procedure for CBTU4411EE,551:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CBTU4411EE,551 Tags
-
SN74HC138DR
Texas Instruments

-
TC7SB3157CFU,LF(CT
Toshiba Semiconductor and Storage

-
74CBTLV3257PW,118
Nexperia USA Inc.
-
SN74CBTLV3257PWR
Texas Instruments

-
74CBTLV3257GUX
Nexperia USA Inc.

-
74HC154BQ,118
Nexperia USA Inc.

-
P3S0200GMX
NXP USA Inc.

-
SN74CB3Q3245PWR
Texas Instruments
-
SN74CB3Q3257RGYR
Texas Instruments

-
TCA9543APWR
Texas Instruments
-
TCA9546APWR
Texas Instruments

-
SN74HC138N
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
