NXP Semiconductors CBTV4010EE,557
- Part No.:
- CBTV4010EE,557
- Manufacturer:
- NXP Semiconductors
- Category:
- Signal Switches, Multiplexers, Decoders
- Package:
- 64-TFBGA
- Datasheet:
-
CBTV4010EE,557.pdf
- Description:
- IC BUS SWITCH 10 X 1:4 64TFBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,246
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Product details
Overview
CBTV4010EE,557 from Philips Semiconductors is a 10-bit DDR SDRAM multiplexer/bus switch designed for 2.3 V to 2.7 V operation with SSTL_2-compatible enable inputs. It provides 20 Ω nominal on-resistance, 7 pF channel on-capacitance, and <50 ps output skew, enabling high-fidelity signal routing in DDR memory subsystems with dual-bank DIMM support.
For engineers reviewing the CBTV4010EE,557 datasheet, CBTV4010EE,557 pinout, CBTV4010EE,557 application, or CBTV4010EE,557 equivalent, key selection criteria include its 140 ps propagation delay, 100 Ω internal pull-down termination on DIMM ports, latch-up immunity (>500 mA), and TFBGA64 package compatibility with DDR-400 (200 MHz) data buses.
Technical Context
The CBTV4010EE,557 implements four independent 10-bit bidirectional analog switches controlled by S0–S3 select lines, each connecting one Host port (HP0–HP9) to one of four DIMM port groups (0DP0–3DP9). Its low RC time constant (20 Ω × 7 pF) minimizes propagation delay while maintaining signal integrity across DDR data and DQM lines.
Each switch features SSTL_2-compliant control inputs, 100 Ω on-chip pull-down resistors active during disable state, and matched rise/fall slew rates to suppress differential skew. The device supports simultaneous activation of only one DIMM port group, preventing bus contention in multi-DIMM memory configurations.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 2.3 V to 2.7 V - Enables direct integration into DDR SDRAM core voltage domains without level-shifting. |
| On-Resistance | 16–30 Ω (typ. 20 Ω) - Eliminates need for external series termination resistors on DDR data paths. |
| Propagation Delay | 140 ps (max) - Supports 400 Mbps DDR data rates with sub-nanosecond timing margin. |
| Output Skew | <50 ps - Ensures tight timing alignment across all 10 bits for reliable DDR strobe/data capture. |
| Channel Capacitance | 7 pF (max) - Minimizes loading on high-speed DDR traces and preserves signal edge fidelity. |
| Supply Current | 0.7–1.5 mA (ICC) - Low quiescent power enables use in thermally constrained memory modules. |
| ESD Rating | 2000 V HBM - Provides robust handling protection during DIMM assembly and system integration. |
Pinout & Package
CBTV4010EE,557 is housed in a 64-ball Thin Fine-Pitch BGA (TFBGA64) package measuring 7 mm × 7 mm × 0.7 mm (SOT746-1), optimized for high-density DDR memory module layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| HP0–HP9 | Host port I/O | Bidirectional data interface to memory controller; connects to DIMM ports when corresponding Sx = L. |
| 0DP0–3DP9 | DIMM port I/O | 10-bit per-group DDR data/DQM lines routed to up to four DIMM banks; terminated to GND via 100 Ω when inactive. |
| S0–S3 | Select input | SSTL_2-compatible control lines enabling one of four 10-bit switch banks; L = enabled, H = high-Z + termination. |
| VDD | Power supply | 2.3–2.7 V core supply; powers internal logic and switch FETs; requires local decoupling near ball A1/B2. |
| GND | Ground reference | System ground return for switch conduction path and internal bias networks; distributed across 32 balls for low-impedance return. |
Key Features
| Feature | Design Value |
|---|---|
| DDR-optimized on-resistance | 20 Ω nominal eliminates need for external series resistors on DDR data lines, reducing BOM count and layout complexity. |
| Integrated 100 Ω pull-down | Active on DIMM ports during disable state to prevent floating nodes and ensure clean bus termination in multi-DIMM systems. |
| Sub-50 ps output skew | Guarantees simultaneous switching across all 10 bits, critical for meeting DDR setup/hold timing at 200 MHz clock rates. |
| Latch-up immunity | Exceeds 500 mA per JESD78, ensuring robust operation under transient overvoltage conditions common in memory subsystems. |
| Low cross-talk design | Minimizes coupling between adjacent data lines and DQM signals, preserving signal integrity in dense DDR routing environments. |
Applications
| DDR Memory Module Interfacing | Dual-Bank DIMM Selection |
|---|---|
Use Scenario: Routing DDR data and DQM signals between a single memory controller and multiple physically separate DIMM slots on a server motherboard. IC Role / Device Role / Timing Role: Bidirectional 10-bit mux providing selectable connection between host data bus and one of four DIMM port groups, with precise timing alignment. Use Value: Enables flexible memory topology with zero added propagation delay beyond intrinsic 140 ps, supporting DDR-400 operation without timing closure penalties. | Use Scenario: Supporting two independent DDR SDRAM banks on a compact embedded system PCB where space prohibits full DIMM sockets. IC Role / Device Role / Timing Role: 10-bit bus switch isolating and routing data between controller and either bank A or bank B, with 100 Ω on-die termination during idle state. Use Value: Eliminates need for discrete termination resistors and manual bus isolation, reducing component count and improving signal integrity at 200 MHz. |
| DDR Data Bus Multiplexing | Memory Controller Signal Conditioning |
Use Scenario: Sharing a single DDR data bus among multiple controllers in a test or diagnostic platform requiring dynamic reconfiguration. IC Role / Device Role / Timing Role: High-speed analog switch enabling hot-swappable connection of different controllers to the same DIMM, with sub-50 ps inter-bit skew. Use Value: Maintains signal fidelity across all 10 bits during switching events, avoiding data corruption due to timing misalignment in shared-bus architectures. | Use Scenario: Improving signal quality on long DDR traces between controller and DIMM by inserting localized impedance-matched switching near the DIMM connector. IC Role / Device Role / Timing Role: Low-on-resistance (20 Ω), low-capacitance (7 pF) switch acting as a repeaterless signal conditioner to reduce trace-induced distortion. Use Value: Compensates for trace losses without adding propagation delay or jitter, extending usable DDR-400 reach beyond standard PCB length limits. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar DDR SDRAM bus switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CBT3244AD,118 | 8-bit, non-DDR-optimized, 3.3 V only, no integrated pull-downs | Limited to single-bank, non-SSTL_2 systems; lacks DDR-specific timing specs | Use only if operating at 3.3 V with legacy SDR SDRAM and no requirement for on-die termination. |
| SN74CBT3245APW | 8-bit, 5 V tolerant, higher on-resistance (25 Ω), no DDR characterization | Compatible with mixed-voltage systems but not characterized for DDR-400 timing or skew | Acceptable for general-purpose bus switching where DDR timing margins are not critical. |
Compared with CBTV4010EE,557, the CBT3244AD,118 and SN74CBT3245APW lack DDR-specific optimizations-such as SSTL_2 compatibility, 100 Ω pull-downs, and sub-50 ps skew-making them unsuitable for production DDR-400 memory interfaces despite functional similarity in basic bus switching.
Availability
CBTV4010EE,557 is available at Aetrix Electronics and suitable for DDR memory module interfacing, dual-bank DIMM selection, and DDR data bus multiplexing requiring stable component supply and long-term lifecycle support.
Supply support for CBTV4010EE,557 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Philips Semiconductors (now NXP Semiconductors) is a global semiconductor innovator with leadership in analog, logic, and interface solutions for computing and communications infrastructure.
The CBTV4010EE,557 belongs to Philips' DDR interface logic product line, engineered specifically to solve signal integrity and routing challenges in high-speed DDR memory subsystems with multi-DIMM support.
FAQ
What is the operating voltage range for CBTV4010EE,557?
The CBTV4010EE,557 operates from 2.3 V to 2.7 V on VCC, aligning precisely with DDR SDRAM core voltage specifications. This narrow range ensures compatibility with SSTL_2 signaling levels and avoids overvoltage stress on internal FETs. Operation outside this window may compromise on-resistance stability or timing performance. The CBTV4010EE,557 is not rated for 3.3 V or 1.8 V operation.
Does CBTV4010EE,557 support true bidirectional signal flow?
Yes, the CBTV4010EE,557 supports fully bidirectional operation between HPx and nDPx terminals without direction control pins. Signal flow direction depends solely on which side drives the line-host or DIMM-enabling seamless DDR read/write cycles. The CBTV4010EE,557 maintains identical 20 Ω on-resistance and 7 pF capacitance in both directions, verified per AC characteristics table.
How does the 100 Ω internal pull-down function in CBTV4010EE,557?
The CBTV4010EE,557 activates 100 Ω pull-down resistors on all DIMM port pins (0DP0–3DP9) whenever the corresponding Sx select line is high, placing the switch in high-impedance mode. This prevents floating nodes during DIMM bank deselection and ensures clean bus termination without external components. The CBTV4010EE,557 does not provide pull-ups or configurable termination.
Is CBTV4010EE,557 compatible with DDR2 or DDR3 memory standards?
No, the CBTV4010EE,557 is characterized exclusively for DDR (DDR1) applications at 200 MHz/400 Mbps. Its timing specs-including 140 ps propagation delay and <50 ps skew-are validated only for DDR-400 waveforms and SSTL_2 voltage levels. The CBTV4010EE,557 lacks DDR2/DDR3-specific features like ODT control or fly-by topology support.
What is the thermal performance rating of CBTV4010EE,557?
The CBTV4010EE,557 is rated for operation from 0 °C to +85 °C ambient temperature, with thermal characteristics defined per JESD51. Its TFBGA64 package (SOT746-1) has a specified thermal impedance that supports continuous operation at full speed within this range when mounted per recommended PCB layout guidelines. The CBTV4010EE,557 does not include thermal shutdown or junction temperature monitoring.
CBTV4010EE,557 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- CBT
- Package/Case:
- 64-TFBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Type:
- Bus Switch
- Circuit:
- 10 x 1:4
- Independent Circuits:
- 1
- Current - Output High, Low:
- -
- Voltage Supply Source:
- Single Supply
- Voltage - Supply:
- 2.3V ~ 2.7V
- Operating Temperature:
- 0°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-TFBGA (7x7)
CBTV4010EE,557 FAQ
1.How can I place an order for CBTV4010EE,557 through Aetrix?
Please submit a Request for Quotation (RFQ) for CBTV4010EE,557 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CBTV4010EE,557 reliable?
The price and inventory of CBTV4010EE,557 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CBTV4010EE,557 is usually 5 days.
3.What payment methods are accepted for CBTV4010EE,557?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CBTV4010EE,557 transactions.
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4.How is shipping managed for CBTV4010EE,557?
CBTV4010EE,557 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CBTV4010EE,557 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CBTV4010EE,557?
For technical support, including CBTV4010EE,557 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CBTV4010EE,557 requirements.
6.How does Aetrix verify that CBTV4010EE,557 is sourced from the original manufacturer or authorized distributors?
All CBTV4010EE,557 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CBTV4010EE,557 meets industry standards.
7.What is the process for return or replacement of CBTV4010EE,557?
All CBTV4010EE,557 units undergo pre-shipment inspection (PSI). If there is an issue with CBTV4010EE,557, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CBTV4010EE,557 part is unused and in its original packaging.
Return procedure for CBTV4010EE,557:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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