Texas Instruments CC1310F128RSMR

Overview

CC1310F128RSMR from Texas Instruments is a Sub-1 GHz ultra-low-power wireless microcontroller integrating an Arm® Cortex®-M3 CPU (48 MHz), 128 KB flash, 20 KB SRAM, and a dedicated Cortex®-M0 radio controller. It delivers –124 dBm RX sensitivity in long-range mode, supports IEEE 802.15.4g and Wireless M-Bus, and operates from 1.8–3.8 V. It enables battery-powered sensor nodes in smart metering and industrial monitoring.

For engineers reviewing the CC1310F128RSMR datasheet, CC1310F128RSMR pinout, CC1310F128RSMR application, or CC1310F128RSMR equivalent, key selection factors include its 4 mm × 4 mm RSM VQFN32 package with 10 GPIOs, sub-µA standby current (0.7 µA), integrated DC/DC converter, and autonomous sensor controller for energy-harvesting systems.

Technical Context

The CC1310F128RSMR implements a dual-core architecture: the Cortex®-M3 handles application logic and protocol stacks, while the dedicated Cortex®-M0 radio controller offloads RF protocol execution from ROM/RAM-enabling deterministic low-power operation. Its RF subsystem includes a fully integrated transceiver with single-ended/differential RF interface, programmable output power up to +15 dBm, and compliance with ETSI EN 300 220, FCC Part 15, and ARIB STD-T108.

Power management is hardware- and firmware-coordinated via TI-RTOS, supporting multiple low-power modes including shutdown (185 nA), standby (0.7 µA with RTC + RAM retention), and sensor-controller-only wakeups (0.95 µA at 1 Hz ADC sampling). The on-chip DC/DC converter and flexible clock system (24 MHz crystal + 32 kHz RTC oscillator) enable robust operation across voltage and temperature ranges.

Key Specifications

Pinout & Package

CC1310F128RSMR uses a 4 mm × 4 mm RSM VQFN32 package with 0.4-mm pitch and exposed thermal pad (EGP). All digital peripherals are software-routed to any GPIO, enabling flexible PCB layout.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Sub-1 GHz wireless MCU applications.

Compared with CC1310F128RSMR, CC1312R1F3 offers greater memory headroom and improved RF robustness for complex mesh deployments, while CC1352P1F3 adds 2.4 GHz connectivity at the expense of higher active current and bill-of-materials complexity - making CC1310F128RSMR optimal for cost-sensitive, single-band, ultra-low-power sensor endpoints.

Availability

CC1310F128RSMR is available at Aetrix Electronics and suitable for smart utility metering, industrial wireless sensor networks, and electronic shelf label systems requiring stable component supply and long-term lifecycle assurance.

Supply support for CC1310F128RSMR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and connectivity solutions with emphasis on reliability, longevity, and industrial-grade qualification.

The CC1310F128RSMR belongs to TI's SimpleLink™ Sub-1 GHz wireless MCU product line, designed specifically for ultra-low-power, long-range IoT sensor nodes operating on coin cells or energy harvesters in harsh environments.

FAQ

What is the maximum RF output power supported by the CC1310F128RSMR?

The CC1310F128RSMR supports programmable RF output power up to +15 dBm across its operating frequency bands (431–527 MHz and 861–1054 MHz). This level is achieved without external power amplifiers and complies with ETSI EN 300 220, FCC Part 15, and ARIB STD-T108 regulations when used with appropriate matching networks and antenna design. The CC1310F128RSMR's integrated PA eliminates the need for discrete RF components in most LPWAN endpoint designs.

Does the CC1310F128RSMR support IEEE 802.15.4g PHY?

Yes, the CC1310F128RSMR natively supports the IEEE 802.15.4g PHY standard, including SUN FSK and O-QPSK modulation schemes, as confirmed in TI's official device family documentation and RF specifications table. This capability is implemented in ROM-based firmware executed by the dedicated Cortex®-M0 radio controller, ensuring deterministic timing and low-power operation. The CC1310F128RSMR also supports Wireless M-Bus Mode N and proprietary protocols.

How many GPIOs does the CC1310F128RSMR provide in its RSM package?

The CC1310F128RSMR in the RSM VQFN32 package provides 10 configurable GPIOs (DIO_0 through DIO_9), as specified in TI's device comparison table and pinout documentation. Among these, DIO_0–DIO_2 and DIO_3–DIO_4 support high-drive capability, while DIO_5–DIO_9 support analog functions including ADC input and comparator interfaces - all software-routable to peripheral functions per application needs.

What is the standby current consumption of the CC1310F128RSMR with RTC and RAM retention?

The CC1310F128RSMR consumes 0.7 µA in standby mode with real-time clock (RTC) running and both CPU and SRAM retention enabled, as measured under recommended operating conditions (VDDS = 3.0 V, T_A = 25°C). This ultra-low quiescent current enables decade-long operation on standard CR2032 batteries in applications with infrequent wake-ups, such as monthly utility meter reads or daily environmental logging.

Is the CC1310F128RSMR pin-compatible with other CC1310 variants like CC1310F128RHB or CC1310F128RGZ?

No, the CC1310F128RSMR is not pin-compatible with CC1310F128RHB or CC1310F128RGZ - each uses a different package (RSM VQFN32, RHB VQFN32, RGZ VQFN48) with distinct pin counts, layouts, and GPIO allocations. While they share identical functional blocks and software compatibility, PCB redesign is required when migrating between packages due to mechanical and electrical interface differences. The CC1310F128RSMR's 10-GPIO RSM variant targets space-constrained designs where the 15-GPIO RHB or 30-GPIO RGZ packages would be oversized.