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Texas Instruments CC1310F64RSMR
- Part No.:
- CC1310F64RSMR
- Manufacturer:
- Texas Instruments
- Category:
- RF Transceiver ICs
- Package:
- 32-VFQFN Exposed Pad
- Datasheet:
-
CC1310F64RSMR.pdf
- Description:
- IC RF TXRX+MCU ISM<1GHZ 32VQFN
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
CC1310F64RSMR from Texas Instruments is a Sub-1 GHz ultra-low-power wireless microcontroller integrating an Arm® Cortex®-M3 CPU (48 MHz), 64 KB flash, 16 KB SRAM, and a dedicated RF core with -124 dBm sensitivity in long-range mode. It features a 10-pin GPIO count in a 4-mm × 4-mm VQFN32 package and supports IEEE 802.15.4g, Wireless M-Bus, and proprietary protocols for battery-powered sensor nodes.
For engineers reviewing the CC1310F64RSMR datasheet, CC1310F64RSMR pinout, CC1310F64RSMR application, or CC1310F64RSMR equivalent, this page delivers verified technical context, validated pin functions, real-world use cases in smart metering and industrial monitoring, and confirmed alternative parts with documented functional and packaging differences.
Technical Context
The CC1310F64RSMR implements a dual-core architecture: a 48-MHz Arm® Cortex®-M3 main processor and a separate Cortex®-M0 radio controller executing RF protocol stacks from ROM or RAM. Its RF subsystem includes a fully integrated transceiver with single-ended or differential RF interface, programmable output power up to +15 dBm, and compliance with ETSI EN 300 220, FCC Part 15, and ARIB STD-T108.
Power management leverages an on-chip DC/DC converter and multiple low-power modes - standby current is 0.7 µA (RTC + RAM retention), shutdown is 185 nA, and active-mode MCU consumption is 2.5 mA at 48 MHz. The autonomous Sensor Controller (24 MHz, 0.4 mA) handles analog/digital sensing independently, enabling the main CPU to remain in deep sleep.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Processor | Arm® Cortex®-M3 @ 48 MHz - enables real-time protocol stack execution and sensor data processing without external host |
| Memory | 64 KB flash / 16 KB SRAM - sufficient for full IEEE 802.15.4g PHY/MAC + application logic in compact footprint |
| RF Sensitivity | -124 dBm (long-range mode) - supports >1 km outdoor range at 50 kbps in 868/915 MHz bands with minimal external components |
| Supply Voltage | 1.8–3.8 V - compatible with coin-cell (CR2032), Li-SOCl₂, and energy-harvesting sources without external regulators |
| Active Current | 5.4 mA RX / 13.4 mA TX @ +10 dBm - enables multi-year operation on 240 mAh battery in periodic wake-up sensor applications |
| GPIO Count | 10 pins - routed flexibly to peripherals including ADC, UART, I²C, and SSI; 5 support analog sensing (DIO_5–DIO_9) |
| Package | VQFN32 (4 mm × 4 mm) - surface-mount compatible with high-density PCB layouts and automated assembly |
Pinout & Package
CC1310F64RSMR uses a 4-mm × 4-mm, 32-pin VQFN package (RSM) with exposed thermal pad. Pin pitch is 0.4 mm; recommended reflow profile follows JEDEC J-STD-020.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RF_P / RF_N | Differential RF I/O | Direct connection to matching network; supports single-ended operation via internal switch |
| DIO_0–DIO_4 | Digital I/O (high-drive) | Capable of driving LEDs, relays, or level-shifted interfaces without external buffers |
| DIO_5–DIO_9 | Analog/Digital I/O | Support 12-bit ADC inputs, capacitive touch sensing, and comparator functions |
| RESET_N | Active-low reset input | External pull-up required; no internal pullup - ensures deterministic boot under noisy conditions |
| X24M_P / X24M_N | 24-MHz crystal oscillator | Drives main system clock; requires 12 pF load capacitance and low-ESR crystal |
| X32K_Q1 / X32K_Q2 | 32-kHz crystal oscillator | Feeds RTC and low-power timer; enables wake-up intervals from 1 s to years |
| VDDS / VDDS2 | Main & GPIO supply rails | Independent 1.8–3.8 V inputs allow separate filtering for digital noise isolation |
| VDDR / VDDR_RF | RF core supply | 1.7–1.95 V regulated output from internal DC/DC - eliminates need for external LDO |
Key Features
| Feature | Design Value |
|---|---|
| Dual-core RF architecture | Cortex®-M0 radio controller offloads MAC/PHY tasks, freeing Cortex®-M3 for application logic and sensor fusion |
| Ultra-low-power sensor engine | Autonomous 16-bit Sensor Controller consumes 0.95 µA per second while performing 12-bit ADC sampling |
| Integrated security module | AES-128 engine + TRNG enables secure over-the-air updates and encrypted sensor data transmission |
| Flexible peripheral routing | All digital peripherals (UART, I²C, SSI) assignable to any GPIO - simplifies layout and reduces layer count |
| Regulatory-certified RF design | Pre-validated for ETSI EN 300 220, FCC Part 15, and ARIB STD-T108 - cuts certification time by ≥6 months |
Applications
| Smart Utility Metering | Industrial Wireless Sensor Node |
|---|---|
|
Use Scenario: Battery-powered gas/water meters transmitting hourly consumption data over 868 MHz ISM band in dense urban environments. IC Role / Device Role / Timing Role: Primary wireless MCU handling RF modulation, AES encryption, RTC-based scheduling, and 12-bit ADC interfacing to pressure/flow sensors. Use Value: -124 dBm sensitivity and +15 dBm output enable reliable 500+ m range through concrete walls; 0.7 µA standby extends 10-year battery life. |
Use Scenario: Predictive maintenance node on rotating machinery measuring vibration, temperature, and humidity at 10 Hz sample rate. IC Role / Device Role / Timing Role: Autonomous sensor hub using Sensor Controller for continuous analog acquisition while main CPU sleeps; wakes every 5 s to process and transmit data. Use Value: 0.95 µA per-second wakeup + 10 GPIO flexibility allows direct connection to MEMS accelerometer, thermistor, and capacitive humidity sensor - no external signal conditioning. |
| Electronic Shelf Label (ESL) | Wireless Building Automation |
|
Use Scenario: Retail ESLs updated nightly via 433 MHz broadcast from gateway; powered by printed batteries with <10 µA average current. IC Role / Device Role / Timing Role: Low-duty-cycle receiver with fast wake-up (<100 µs), integrated DC/DC, and optimized RF front-end for burst-mode reception. Use Value: 185 nA shutdown current and 5.4 mA RX current enable >5-year operation on 15 mAh printed battery; RSM package fits 25 mm × 25 mm label PCB. |
Use Scenario: HVAC zone controller collecting temperature/humidity from 4 local sensors and reporting to BACnet/IP gateway via sub-GHz mesh. IC Role / Device Role / Timing Role: Edge node running Wireless M-Bus stack, managing 8 capacitive touch buttons, and supporting OTA firmware updates. Use Value: On-chip AES-128 and TRNG meet EN 13757-4 security requirements; 10 GPIOs route to I²C sensors, pushbuttons, and status LEDs without external logic. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Sub-1 GHz wireless MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CC1312R1F3 | 352 KB flash, 80 KB RAM, 30 GPIOs, RGZ package (7 mm × 7 mm) | Supports concurrent multi-protocol stacks (e.g., IEEE 802.15.4g + BLE); higher memory for complex edge analytics | Select when future-proofing for protocol expansion or adding local decision logic beyond CC1310F64RSMR's 64 KB capacity |
| CC1350F64RSMR | Dual-band (Sub-1 GHz + 2.4 GHz BLE); identical RSM package and pinout; same 64 KB flash/16 KB RAM | Enables Bluetooth provisioning and Sub-1 GHz long-range telemetry in one device - eliminates dual-MCU complexity | Choose when field devices require both smartphone commissioning (BLE) and infrastructure backhaul (Sub-1 GHz) |
Compared with CC1310F64RSMR, CC1312R1F3 offers 5.5× more flash for advanced firmware but requires larger PCB area; CC1350F64RSMR adds BLE without increasing footprint or GPIO count, enabling hybrid connectivity where CC1310F64RSMR is limited to Sub-1 GHz only.
Availability
CC1310F64RSMR is available at Aetrix Electronics and suitable for smart metering, industrial wireless sensor networks, electronic shelf labels, and building automation systems requiring stable component supply across multi-year production cycles.
Supply support for CC1310F64RSMR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with over 90 years of innovation in industrial, automotive, and consumer electronics.
The CC1310F64RSMR belongs to TI's SimpleLink™ wireless MCU platform, designed specifically for ultra-low-power, long-range, battery-operated IoT endpoints in utility, industrial, and commercial applications.
FAQ
What is the maximum RF output power supported by the CC1310F64RSMR?
The CC1310F64RSMR supports programmable RF output power up to +15 dBm. This value is achievable across its operating frequency bands (431–527 MHz and 861–1054 MHz) and is specified under standard test conditions with proper matching network design. The +15 dBm capability enables extended range in challenging RF environments while maintaining regulatory compliance in ETSI, FCC, and ARIB domains. CC1310F64RSMR achieves this using its integrated PA and on-chip DC/DC converter.
Does the CC1310F64RSMR include an integrated DC/DC converter?
Yes, the CC1310F64RSMR integrates a configurable DC/DC converter that generates regulated 1.7–1.95 V supplies for the RF core (VDDR and VDDR_RF). This eliminates the need for external voltage regulators in most designs, reducing BOM cost and PCB area. The converter operates from the main 1.8–3.8 V supply (VDDS_DCDC) and is enabled by default in all active and low-power modes. CC1310F64RSMR's DC/DC efficiency contributes directly to its industry-leading 0.7 µA standby current.
How many analog-capable GPIOs does the CC1310F64RSMR provide?
The CC1310F64RSMR provides five analog-capable GPIOs: DIO_5 through DIO_9. Each supports 12-bit ADC input (200 ksamples/s), analog comparator functions, and capacitive sensing. These pins are explicitly designated as analog/digital I/O in the RSM package signal descriptions and connect directly to the internal ADC multiplexer and sensor controller. CC1310F64RSMR's analog GPIO count is fixed for this package variant and cannot be increased via software configuration.
Is the CC1310F64RSMR pin-compatible with other CC1310 variants in the RSM package?
Yes, all CC1310 RSM-package variants - including CC1310F32RSM, CC1310F64RSM, and CC1310F128RSM - share identical pinout, package dimensions (4 mm × 4 mm VQFN32), and thermal pad layout. Differences are limited to flash size (32/64/128 KB) and SRAM (16/20 KB), with no impact on PCB footprint or interconnect. CC1310F64RSMR can be substituted for CC1310F32RSM or CC1310F128RSM on the same board without hardware changes, provided firmware accommodates memory constraints.
What development tools are officially supported for the CC1310F64RSMR?
Texas Instruments officially supports Code Composer Studio™ (CCS) IDE, IAR Embedded Workbench® for Arm, SmartRF™ Studio, Sensor Controller Studio, and SmartRF Flash Programmer 2 for the CC1310F64RSMR. These tools enable full debugging via cJTAG, RF parameter tuning, low-level sensor controller programming, and over-the-air (OTA) image flashing. CC1310F64RSMR is also compatible with TI's LAUNCHXL-CC1310 and BOOSTXL-SENSORS development kits, which provide pre-characterized RF layouts and reference schematics.
CC1310F64RSMR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- SimpleLink™
- Package/Case:
- 32-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Type:
- TxRx + MCU
- RF Family/Standard:
- General ISM < 1GHz
- Protocol:
- -
- Modulation:
- DSSS, GFSK
- Frequency:
- 300MHz ~ 930MHz
- Data Rate (Max):
- 50kbps
- Power - Output:
- 14dBm
- Sensitivity:
- -124dBm
- Memory Size:
- 64kB Flash, 16kB RAM
- Serial Interfaces:
- I2C, I2S, JTAG, SPI, UART
- GPIO:
- 10
- Voltage - Supply:
- 1.8V ~ 3.8V
- Current - Receiving:
- 5.5mA
- Current - Transmitting:
- 12.9mA ~ 22.6mA
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 32-VQFN (4x4)
CC1310F64RSMR FAQ
1.How can I place an order for CC1310F64RSMR through Aetrix?
Please submit a Request for Quotation (RFQ) for CC1310F64RSMR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CC1310F64RSMR reliable?
The price and inventory of CC1310F64RSMR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CC1310F64RSMR is usually 5 days.
3.What payment methods are accepted for CC1310F64RSMR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CC1310F64RSMR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CC1310F64RSMR?
CC1310F64RSMR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CC1310F64RSMR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CC1310F64RSMR?
For technical support, including CC1310F64RSMR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CC1310F64RSMR requirements.
6.How does Aetrix verify that CC1310F64RSMR is sourced from the original manufacturer or authorized distributors?
All CC1310F64RSMR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CC1310F64RSMR meets industry standards.
7.What is the process for return or replacement of CC1310F64RSMR?
All CC1310F64RSMR units undergo pre-shipment inspection (PSI). If there is an issue with CC1310F64RSMR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CC1310F64RSMR part is unused and in its original packaging.
Return procedure for CC1310F64RSMR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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