Texas Instruments CC1312R1F3RGZR

Overview

CC1312R1F3RGZR from Texas Instruments is a Sub-1 GHz wireless microcontroller integrating an Arm® Cortex®-M4F CPU (48 MHz), 352 KB flash, 80 KB parity-protected SRAM, ultra-low-power sensor controller (4 KB SRAM), and a flexible RF transceiver with -121 dBm sensitivity in long-range mode. It operates from 1.8 V to 3.8 V and supports IEEE 802.15.4g, 6LoWPAN, Wi-SUN®, and proprietary protocols - deployed in smart meters, building security sensors, and industrial telemetry nodes.

For engineers reviewing the CC1312R1F3RGZR datasheet, CC1312R1F3RGZR pinout, CC1312R1F3RGZR application, or CC1312R1F3RGZR equivalent, key selection criteria include sub-GHz RF performance at +14 dBm TX with 24.9 mA draw, 0.85 µA standby current with full RAM retention, 30 GPIOs in 7-mm × 7-mm VQFN48, and autonomous sensor controller operation at 30.1 µA in low-power mode.

Technical Context

The CC1312R1F3RGZR implements a dual-core architecture: a main Arm® Cortex®-M4F for application processing and protocol stack execution, and a dedicated Arm® Cortex®-M0 RF core handling physical-layer modulation, timing-critical radio control, and packet filtering. The sensor controller operates independently with its own 4 KB SRAM, enabling continuous analog sensing (e.g., 1-Hz ADC sampling) without waking the main CPU.

It integrates on-chip power management including a buck DC/DC converter, TCXO support, and multiple clock domains (RCOSC_LF/HF, XOSC_LF/HF). Memory subsystem includes 352 KB flash with 8 KB cache, 256 KB ROM for protocol stacks, and 80 KB ultra-low-leakage SRAM protected by parity - ensuring reliability in industrial environments up to 105°C.

Key Specifications

Pinout & Package

VQFN48 (RGZ) package, 7.00 mm × 7.00 mm, 0.5-mm pitch, exposed thermal pad (EGP). RoHS-compliant, industrial temperature rated (-40°C to +105°C).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Sub-1 GHz wireless MCU applications.

Compared with CC1352R1F3RGZR, CC1312R1F3RGZR provides higher Sub-1 GHz transmit power (+14 dBm vs. +10 dBm) and dedicated sensor controller autonomy, while avoiding 2.4 GHz RF complexity and cost. Against CC1310F128RGZR, it delivers 2.75× more flash, parity-protected RAM, hardware crypto, and 3× lower standby current - enabling secure, feature-rich, decade-long deployments.

Availability

CC1312R1F3RGZR is available at Aetrix Electronics and suitable for smart metering, building automation, industrial telemetry, and medical sensor applications requiring stable component supply, long-term lifecycle support, and industrial-grade reliability.

Supply support for CC1312R1F3RGZR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and connectivity solutions for industrial, automotive, and consumer markets.

The CC1312R1F3RGZR belongs to the SimpleLink™ Sub-1 GHz wireless MCU product line, engineered for ultra-low-power, long-range, secure wireless sensing in harsh environments - targeting smart infrastructure, energy management, and predictive maintenance systems.

FAQ

What is the maximum RF output power supported by the CC1312R1F3RGZR?

The CC1312R1F3RGZR supports up to +14 dBm output power in Sub-1 GHz bands (e.g., 868 MHz), measured at 24.9 mA supply current with DC/DC converter enabled. This is achieved using an integrated power amplifier with temperature compensation, enabling reliable long-range communication in smart metering and industrial telemetry applications where link budget is critical. The CC1312R1F3RGZR maintains this output level across its operating temperature range (-40°C to +105°C).

Does the CC1312R1F3RGZR include hardware cryptographic acceleration?

Yes, the CC1312R1F3RGZR integrates dedicated hardware accelerators for AES-128/256, SHA2 (up to SHA-512), ECC/RSA public-key operations, and a true random number generator (TRNG). These modules operate independently of the main CPU, enabling secure boot, encrypted over-the-air (OTA) updates, and authenticated device-to-cloud communication without compromising real-time application performance. All cryptographic functions are accessible via the TI SimpleLink SDK and validated against FIPS 140-2 Level 1 requirements.

How many GPIOs does the CC1312R1F3RGZR provide, and are they configurable?

The CC1312R1F3RGZR provides 30 GPIOs in its RGZ (VQFN48) package. All digital peripherals - including UART, SSI, I²C, timers, and comparators - can be routed to any GPIO via software configuration, offering exceptional layout flexibility. Eight of these pins (DIO_23 through DIO_30) support analog functions such as ADC input, comparator reference, and capacitive sensing, eliminating the need for external signal conditioning in many sensor interface designs.

What is the lowest power consumption state of the CC1312R1F3RGZR with full memory retention?

The CC1312R1F3RGZR achieves 0.85 µA standby current with RTC active, full 80 KB SRAM retention, and CPU register state preserved - verified at 3.6 V and 25°C with DC/DC enabled. This ultra-low-power state allows decade-long operation on primary batteries in applications like wireless utility meters and security sensors. The SRAM is protected by parity bits to prevent silent corruption, making this retention mode suitable for safety-critical and industrial deployments.

Is the CC1312R1F3RGZR pin-compatible with other SimpleLink CC13x2 devices?

Yes, the CC1312R1F3RGZR shares the identical RGZ (7-mm × 7-mm VQFN48) package, pinout, and footprint with other CC13x2 family members including CC1352R1F3RGZR and CC1352P1F3RGZR. This enables hardware reuse across Sub-1 GHz and multiprotocol variants. However, functional differences exist - e.g., CC1352R1F3RGZR adds 2.4 GHz BLE/Zigbee support and omits the +14 dBm Sub-1 GHz PA boost - so firmware and RF layout must be validated per specific device requirements.