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Texas Instruments CC1312R1F3RGZT
- Part No.:
- CC1312R1F3RGZT
- Manufacturer:
- Texas Instruments
- Category:
- RF Transceiver ICs
- Package:
- 48-VFQFN Exposed Pad
- Datasheet:
-
CC1312R1F3RGZT.pdf
- Description:
- IC RF TXRX+MCU 48VQFN
- Quantity:
- Payment:
- Shipping:
Inventory:314
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Product details
Overview
CC1312R1F3RGZT from Texas Instruments is a Sub-1 GHz wireless microcontroller integrating an Arm® Cortex®-M4F CPU (48 MHz), 352 KB flash, 80 KB ultra-low-leakage SRAM with parity, and a dedicated Sub-1 GHz RF transceiver supporting IEEE 802.15.4g, 6LoWPAN, Wi-SUN®, and proprietary protocols. It operates from 1.8 V to 3.8 V and delivers +14 dBm output power at 868 MHz with 24.9 mA current draw, targeting long-life battery-powered smart metering and building security systems.
For engineers reviewing the CC1312R1F3RGZT datasheet, CC1312R1F3RGZT pinout, CC1312R1F3RGZT application, or CC1312R1F3RGZT equivalent, this page provides verified technical context, validated pin functions, real-world low-power operating metrics (0.85 µA standby), confirmed protocol stack support (TI 15.4-Stack, Amazon Sidewalk), and two rigorously cross-checked alternative MCUs for Sub-1 GHz wireless design.
Technical Context
The CC1312R1F3RGZT implements a dual-core architecture: a main Arm® Cortex®-M4F processor for application execution and a separate Arm® Cortex®-M0 radio controller managing RF physical layer operations. Its RF core supports flexible modulation schemes including 2-GFSK, OOK, and WB-DSSS across 143–1054 MHz bands, with documented sensitivity of –121 dBm in SimpleLink long-range mode.
Power management integrates an on-chip buck DC/DC converter, TCXO support, and a programmable ultra-low-power sensor controller (4 KB SRAM) that operates autonomously at 2 MHz (30.1 µA) or 24 MHz (808 µA). Memory protection includes SRAM parity and ROM-resident TI-RTOS, IEEE 802.15.4 MAC, and cryptographic accelerators (AES-256, SHA2-512, ECC/RSA).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm® Cortex®-M4F @ 48 MHz; enables deterministic real-time control and floating-point math for sensor fusion and protocol stack processing. |
| Memory | 352 KB flash (in-system programmable), 80 KB SRAM with parity, 256 KB ROM (TI-RTOS, MAC, drivers); ensures robust firmware storage and runtime data integrity. |
| RF Performance | –121 dBm RX sensitivity (SimpleLink long-range mode), +14 dBm TX output (868 MHz), 5.8 mA RX current; enables multi-kilometer range in sub-GHz ISM bands. |
| Low-Power Modes | 0.85 µA standby (RTC + 80 KB RAM retention), 150 nA shutdown (external wake-up); supports 10+ year battery life in utility meters and environmental sensors. |
| Analog Peripherals | 12-bit ADC (200 kSamples/s, 8 channels), 2× comparators, TRNG, temperature/battery monitor; enables direct sensor interfacing without external signal conditioning. |
| Security | AES-128/256, SHA2 (up to SHA-512), ECC/RSA hardware accelerators, and secure boot; meets requirements for firmware authentication and encrypted over-the-air updates. |
| Package | VQFN48 (7 mm × 7 mm, 0.5 mm pitch); RoHS-compliant, supports automated assembly and thermal management in compact IoT endpoints. |
Pinout & Package
VQFN48 package (7.00 mm × 7.00 mm, 0.5-mm pitch) with exposed ground pad (EGP) for thermal and electrical integrity. All 30 GPIOs are software-routable to digital peripherals; 8 pins support analog functions (DIO_23–DIO_30), and 6 support high-drive capability (DIO_5, DIO_6, DIO_7, JTAG_TMSC, DIO_16, DIO_17).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RF_P / RF_N | Differential RF I/O | Primary antenna interface for sub-1 GHz transceiver; requires matched balun and 50-Ω impedance trace routing. |
| RESET_N | Active-low reset input | Asynchronous system reset; no internal pull-up-requires external pull-up for reliable power-on initialization. |
| X48M_P / X48M_N | 48-MHz crystal oscillator inputs | Drive main system clock; supports TCXO for improved frequency stability in temperature-varying environments. |
| X32K_Q1 / X32K_Q2 | 32.768-kHz crystal oscillator inputs | Enable RTC operation and low-power timer wake-up; critical for time-synchronized mesh networks. |
| DCDC_SW / VDDS_DCDC | DC/DC converter switch node and supply | Enables efficient on-chip voltage conversion; reduces system power consumption by up to 30% vs. LDO-only operation. |
| DIO_1–DIO_30 | Configurable digital/analog I/O | 30 general-purpose pins; 8 support ADC input, capacitive sensing, or comparator functions-no external ADC or touch controller needed. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-core RF architecture | Separate Arm® Cortex®-M0 radio controller offloads PHY-layer tasks from M4F CPU, enabling concurrent application and radio processing. |
| Autonomous sensor controller | 4 KB SRAM + dedicated CPU runs sensor sampling and preprocessing at 30.1 µA (2 MHz), eliminating MCU wake-ups and extending battery life. |
| Protocol stack integration | IEEE 802.15.4g, 6LoWPAN, Wi-SUN®, MIOTY®, Amazon Sidewalk, and TI 15.4-Stack preloaded in ROM-reduces flash footprint and boot time. |
| Hardware crypto acceleration | AES-256, SHA2-512, ECC, RSA, and TRNG implemented in silicon-enables TLS handshake in <100 ms and secure OTA updates without CPU overhead. |
| Flexible power management | On-chip buck DC/DC, multiple low-power modes (shutdown, standby, idle), and voltage monitoring-supports coin-cell, Li-SOCl₂, and energy-harvesting power sources. |
Applications
| Smart Utility Metering | Building Security Sensors |
|---|---|
|
Use Scenario: Wireless water/gas/electricity meters transmitting hourly consumption data via LPWAN backhaul to concentrators. IC Role / Device Role / Timing Role: Primary wireless MCU handling sensor reading, encryption, packet assembly, and Sub-1 GHz transmission at 868/915 MHz. Use Value: 0.85 µA standby current with full RAM retention enables >15-year battery life; –121 dBm sensitivity ensures reliable reception in buried or shielded meter enclosures. |
Use Scenario: Battery-powered door/window contact sensors and motion detectors reporting tamper events and occupancy to a local gateway. IC Role / Device Role / Timing Role: Edge-node MCU executing local decision logic (e.g., motion dwell time), AES-encrypted payload generation, and scheduled beacon transmissions. Use Value: Integrated 12-bit ADC and capacitive sensing eliminate external components; autonomous sensor controller samples at 1 Hz with only 1 µA system current. |
| HVAC Environmental Monitoring | Industrial Asset Tracking |
|
Use Scenario: Wireless thermostat and ambient air quality nodes measuring temperature, humidity, CO₂, and VOCs in commercial buildings. IC Role / Device Role / Timing Role: Multi-sensor fusion hub with integrated temperature/battery monitor, RTC-based scheduling, and Wi-SUN®-compliant mesh networking. Use Value: On-chip TRNG and SHA2-512 enable secure device onboarding; 80 KB SRAM with parity ensures data integrity during extended network outages. |
Use Scenario: Ruggedized GPS/loggers tracking location, shock, and temperature of shipping containers or heavy equipment across wide geographic areas. IC Role / Device Role / Timing Role: Low-power telemetry controller managing GNSS acquisition bursts, accelerometer wake-up triggers, and long-range Sub-1 GHz uplink. Use Value: +14 dBm TX power and –110 dBm sensitivity at 50 kbps ensure link budget margin in noisy industrial RF environments; 105°C junction rating supports under-hood deployment. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Sub-1 GHz wireless MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CC1352R1F3RGZT | Dual-band: Sub-1 GHz + Bluetooth 5.1 LE; identical 352 KB flash, 80 KB RAM, and VQFN48 package; adds 2.4 GHz radio and BLE stack. | Required when end devices need both long-range Sub-1 GHz backhaul and smartphone commissioning/debugging via BLE. | Select CC1352R1F3RGZT if Bluetooth provisioning or hybrid topology (BLE mesh + Sub-1 GHz star) is mandatory; otherwise, CC1312R1F3RGZT offers lower BOM cost and power. |
| CC1310F128RGZT | Legacy Sub-1 GHz MCU: 128 KB flash, 20 KB RAM, same VQFN48 package; lacks sensor controller, crypto accelerators, and TCXO support. | Suitable for cost-sensitive, low-complexity sensor nodes where firmware size <128 KB and security requirements are minimal. | Choose CC1310F128RGZT only for legacy designs or ultra-low-cost deployments; CC1312R1F3RGZT provides 2.75× more flash, hardware crypto, and 4× more RAM for future-proofing. |
Compared with CC1310F128RGZT, the CC1312R1F3RGZT delivers significantly higher memory capacity, autonomous sensing, and cryptographic acceleration-justifying its use in next-generation secure, feature-rich IoT endpoints. Against CC1352R1F3RGZT, it trades Bluetooth flexibility for optimized Sub-1 GHz performance and lower system power.
Availability
CC1312R1F3RGZT is available at Aetrix Electronics and suitable for smart metering, building automation, industrial asset tracking, and environmental monitoring requiring stable component supply across multi-year production cycles.
Supply support for CC1312R1F3RGZT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity solutions, with decades of expertise in low-power wireless and industrial-grade IC design.
The CC1312R1F3RGZT belongs to the SimpleLink™ Sub-1 GHz MCU product line, engineered specifically for battery-operated, long-range wireless sensing and control in utility, building, and industrial applications demanding robust RF performance and ultra-low power.
FAQ
What is the maximum RF output power supported by the CC1312R1F3RGZT?
The CC1312R1F3RGZT supports up to +14 dBm output power in Sub-1 GHz bands (e.g., 868 MHz), measured at 24.9 mA supply current with boost mode enabled. This specification is validated per TI's SWRS210H datasheet Section 8.6 and applies across 143–1054 MHz with temperature compensation.
Does the CC1312R1F3RGZT include hardware cryptographic acceleration?
Yes, the CC1312R1F3RGZT integrates dedicated hardware accelerators for AES-128/256, SHA2 (up to SHA-512), ECC, RSA, and a true random number generator (TRNG). These units operate independently of the Cortex-M4F CPU and are documented in Section 9.6 of the SWRS210H datasheet.
What package type and pin count does the CC1312R1F3RGZT use?
The CC1312R1F3RGZT uses a 48-pin VQFN package (RGZ) with 7.00 mm × 7.00 mm body size and 0.5-mm pitch. It exposes 30 GPIOs, two differential RF pins (RF_P/RF_N), dual crystal oscillator interfaces (X48M_P/N and X32K_Q1/Q2), and dedicated power domains (VDDS, VDDR, VDDR_RF).
Can the CC1312R1F3RGZT operate in industrial temperature ranges?
Yes, the CC1312R1F3RGZT is rated for operation from –40°C to +105°C junction temperature. Its standby current remains at 11 µA at 105°C (Section 3 of SWRS210H), and SRAM parity protection ensures reliability against soft errors in harsh thermal environments.
Which wireless protocols are natively supported by the CC1312R1F3RGZT?
The CC1312R1F3RGZT natively supports IEEE 802.15.4g, IPv6-enabled smart objects (6LoWPAN), MIOTY®, Wi-SUN®, KNX RF, Amazon Sidewalk, Wireless M-Bus, and the TI 15.4-Stack (Sub-1 GHz), all with ROM-resident MAC layers and protocol stacks per Section 1 and Section 3 of SWRS210H.
CC1312R1F3RGZT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- SimpleLink™
- Package/Case:
- 48-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Type:
- TxRx + MCU
- RF Family/Standard:
- -
- Protocol:
- -
- Modulation:
- 2FSK, 4FSK, GFSK
- Frequency:
- 431MHz ~ 527MHz, 861MHz ~ 1.054GHz, 1.069GHz ~ 1.329GHz
- Data Rate (Max):
- 4Mbps
- Power - Output:
- 14dBm
- Sensitivity:
- -125dBm
- Memory Size:
- 352kB Flash, 80kB RAM
- Serial Interfaces:
- I2C, I2S, SPI, UART
- GPIO:
- 30
- Voltage - Supply:
- 1.8V ~ 3.8V
- Current - Receiving:
- 5.8mA
- Current - Transmitting:
- 8mA ~ 24.9mA
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 48-VQFN (7x7)
CC1312R1F3RGZT FAQ
1.How can I place an order for CC1312R1F3RGZT through Aetrix?
Please submit a Request for Quotation (RFQ) for CC1312R1F3RGZT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CC1312R1F3RGZT reliable?
The price and inventory of CC1312R1F3RGZT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CC1312R1F3RGZT is usually 5 days.
3.What payment methods are accepted for CC1312R1F3RGZT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CC1312R1F3RGZT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CC1312R1F3RGZT?
CC1312R1F3RGZT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CC1312R1F3RGZT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CC1312R1F3RGZT?
For technical support, including CC1312R1F3RGZT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CC1312R1F3RGZT requirements.
6.How does Aetrix verify that CC1312R1F3RGZT is sourced from the original manufacturer or authorized distributors?
All CC1312R1F3RGZT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CC1312R1F3RGZT meets industry standards.
7.What is the process for return or replacement of CC1312R1F3RGZT?
All CC1312R1F3RGZT units undergo pre-shipment inspection (PSI). If there is an issue with CC1312R1F3RGZT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CC1312R1F3RGZT part is unused and in its original packaging.
Return procedure for CC1312R1F3RGZT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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