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Texas Instruments CC1350F128RGZT
- Part No.:
- CC1350F128RGZT
- Manufacturer:
- Texas Instruments
- Category:
- RF Transceiver ICs
- Package:
- 48-VFQFN Exposed Pad
- Datasheet:
-
CC1350F128RGZT.pdf
- Description:
- IC RF TXRX+MCU BLE 48VQFN
- Quantity:
- Payment:
- Shipping:
Inventory:327
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Product details
Overview
CC1350F128RGZT from Texas Instruments is a dual-band ultra-low-power wireless microcontroller integrating an Arm® Cortex®-M3 CPU (48 MHz), 128 KB flash, 20 KB SRAM, and concurrent Sub-1 GHz + 2.4 GHz RF transceivers supporting Bluetooth® low energy 4.2 and IEEE 802.15.4g. It delivers –124 dBm RX sensitivity in long-range Sub-1 GHz mode and operates down to 0.7 µA in standby with RTC active-enabling multi-year battery life in smart metering and industrial sensor nodes.
For engineers reviewing the CC1350F128RGZT datasheet, CC1350F128RGZT pinout, CC1350F128RGZT application, or CC1350F128RGZT equivalent, key selection criteria include dual-band protocol coexistence, autonomous sensor controller operation, integrated DC/DC converter, 30 GPIOs in VQFN48, and regulatory compliance for ETSI EN 300 220, FCC Part 15, and ARIB STD-T66.
Technical Context
The CC1350F128RGZT implements a dual-core architecture: a 48-MHz Arm Cortex-M3 for application processing and a dedicated Cortex-M0 Radio Controller executing RF protocol stacks (Bluetooth LE, IEEE 802.15.4g, Wireless M-Bus) from ROM/RAM-enabling simultaneous Sub-1 GHz and 2.4 GHz operation without host intervention. Its RF section supports programmable output power up to +15 dBm (Sub-1 GHz) and +9 dBm (2.4 GHz), with single-ended or differential RF interface.
Power management is hardware-assisted via multiple low-power modes, including shutdown (185 nA), standby (0.7 µA), and sensor controller wakeups every second performing 12-bit ADC sampling at 0.95 µA. The integrated DC/DC converter enables efficient operation across 1.8–3.8 V supply, while the autonomous 16-bit Sensor Controller (2 KB SRAM, 24 MHz max) offloads analog/digital sensing tasks from the main MCU.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-M3 @ 48 MHz - Enables real-time protocol stack execution and sensor fusion in resource-constrained edge nodes. |
| Memory | 128 KB Flash + 20 KB SRAM - Sufficient for dual-protocol firmware (e.g., BLE + Sub-1 GHz mesh) with OTA update support. |
| RF Bands | Sub-1 GHz (431–1054 MHz) + 2.4 GHz - Supports global ISM/SRD bands (868/915 MHz & BLE) for hybrid infrastructure-to-smartphone connectivity. |
| RX Sensitivity | –124 dBm (Sub-1 GHz, long-range mode) - Enables >1 km outdoor range in 50-kbps proprietary protocols under line-of-sight conditions. |
| TX Power | +15 dBm (Sub-1 GHz), +9 dBm (2.4 GHz) - Meets ETSI/FCC radiated emission limits while maximizing link budget in dense environments. |
| Low-Power Modes | 0.7 µA standby (RTC + RAM retention), 185 nA shutdown - Allows coin-cell (CR2032) operation for >10 years in periodic sensor reporting applications. |
| GPIO Count | 30 configurable pins in RGZ package - Supports full peripheral routing (UART, I²C, SPI, ADC, capacitive touch) without pin conflicts. |
Pinout & Package
VQFN48 (RGZ) package, 7.0 mm × 7.0 mm, 0.5-mm pitch, with exposed thermal pad (EGP). Pinout optimized for RF isolation: RF_P/RF_N on opposite corners, DCDC_SW and VDDR_RF adjacent for decoupling, and dedicated crystal pins (X24M_P/N, X32K_Q1/Q2) grouped for low-noise timing.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RF_P / RF_N | Differential RF I/O | Direct connection to matching network for Sub-1 GHz/2.4 GHz antenna switching; requires 50-Ω layout control. |
| DCDC_SW | DC/DC Switch Node | Connects to external inductor; switching frequency ~3.2 MHz - mandates low-ESR ceramic output capacitor (≥10 µF). |
| VDDR_RF / VDDR | RF & Core Analog Supply | 1.7–1.95 V regulated supplies - must be decoupled separately from digital rails to prevent RX noise coupling. |
| X24M_P / X24M_N | High-Frequency Crystal Input | Drives internal 24-MHz oscillator for RF PLL and system clock - requires load capacitance matching per crystal spec. |
| RESET_N | Active-Low Reset Input | No internal pull-up; requires external RC or supervisor circuit for reliable power-on reset sequencing. |
| DIO_0–DIO_30 | Configurable GPIO | All digital peripherals (SSI, UART, I²C, timers) can be mapped to any GPIO - eliminates fixed-function pin constraints. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-Band RF Coexistence | Hardware-isolated Sub-1 GHz and 2.4 GHz transceivers share memory/CPU but operate independently - enables BLE smartphone commissioning while maintaining long-range Sub-1 GHz network backhaul. |
| Autonomous Sensor Controller | 16-bit RISC engine with 2 KB SRAM runs sensor acquisition (ADC, comparators, current source) without waking main CPU - reduces average system current by >90% in duty-cycled sensing. |
| Integrated DC/DC Converter | On-chip buck converter replaces external regulator - simplifies BOM, improves efficiency (up to 90%) at 3.3 V input, and enables direct Li-ion or coin-cell operation. |
| Regulatory Compliance Ready | Firmware and RF design pre-validated for ETSI EN 300 220, FCC Part 15, ARIB STD-T66 - cuts certification time by eliminating RF front-end redesign. |
| Security Hardware Acceleration | AES-128 module + TRNG - enables secure over-the-air updates and encrypted sensor data transmission without software overhead. |
Applications
| Smart Utility Metering | Industrial Wireless Sensor Network |
|---|---|
Use Scenario: Battery-powered gas/water meters transmitting consumption data hourly via Sub-1 GHz mesh to concentrator, with BLE used for field technician setup. IC Role / Device Role / Timing Role: Dual-band wireless MCU handling both physical layer (PHY/MAC) and application logic; RTC provides precise timestamping for billing intervals. Use Value: Single-chip solution eliminates separate BLE and Sub-1 GHz radios, reducing PCB area by 40% and enabling 15-year CR123A battery life via 0.7 µA standby current. |
Use Scenario: Vibration/temperature monitoring nodes on rotating machinery, sampling every 10 seconds and forwarding alerts via Sub-1 GHz to gateway. IC Role / Device Role / Timing Role: Sensor Controller autonomously acquires 12-bit ADC samples and triggers wake-up only on threshold breach; Cortex-M3 processes FFT and transmits compressed data. Use Value: 0.95 µA average current during periodic sensing extends battery life to 7+ years, while –110 dBm RX sensitivity ensures robust reception in electrically noisy factory environments. |
| Electronic Shelf Label (ESL) System | Wireless Building Automation |
Use Scenario: ESL tags updated nightly via 2.4 GHz BLE broadcast from gateway, with Sub-1 GHz fallback for large warehouse zones with metal interference. IC Role / Device Role / Timing Role: Dual-band transceiver switches between BLE advertising mode and Sub-1 GHz listen mode; integrated DC/DC maintains stable voltage during display refresh pulses. Use Value: +15 dBm Sub-1 GHz TX power penetrates steel shelving, achieving 99.5% update success rate across 10,000-tag deployments without repeaters. |
Use Scenario: HVAC zone controllers communicating occupancy, temperature, and CO₂ data via IEEE 802.15.4g to building management system using Sub-1 GHz, with BLE used for local configuration. IC Role / Device Role / Timing Role: Protocol-agnostic RF core executes TI's 15.4g stack in ROM; AES-128 secures all sensor telemetry against replay attacks. Use Value: Regulatory pre-certification (EN 300 440 Class 2) accelerates EU market entry, while 30 GPIOs support direct connection to relays, thermistors, and I²C environmental sensors. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-band wireless MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CC1352R | 352 KB flash, 80 KB RAM, same RGZ package - adds multiprotocol support (Zigbee/Thread) and higher Sub-1 GHz TX power (+20 dBm). | Better suited for large-scale mesh networks requiring Zigbee interoperability or extended range beyond 2 km. | Select CC1352R when future-proofing for multi-standard deployment or needing >15 dBm Sub-1 GHz output. |
| CC2642R | BLE 5.0 only (2.4 GHz), 352 KB flash, 80 KB RAM, DSBGA34 option - no Sub-1 GHz radio, but higher throughput (2 Mbps) and longer BLE range. | Ideal for smartphone-centric applications (beacons, wearables) where Sub-1 GHz infrastructure is absent. | Choose CC2642R if BLE-only operation suffices and smaller footprint (2.7 mm × 2.7 mm) or BLE 5 features (coded PHY, advertising extensions) are required. |
Compared with CC1350F128RGZT, CC1352R offers greater memory and protocol flexibility at higher cost and power, while CC2642R trades dual-band capability for BLE-optimized performance and compact packaging - making CC1350F128RGZT the optimal balance of range, protocol coverage, and cost for hybrid infrastructure deployments.
Availability
CC1350F128RGZT is available at Aetrix Electronics and suitable for smart metering, industrial wireless sensor networks, electronic shelf labeling, and building automation systems requiring stable component supply across multi-year production cycles.
Supply support for CC1350F128RGZT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and wireless connectivity solutions, with decades of expertise in low-power RF design and industrial-grade reliability.
The CC1350F128RGZT belongs to TI's SimpleLink™ wireless MCU platform, engineered specifically for ultra-low-power, dual-band IoT endpoints that demand simultaneous smartphone connectivity and long-range infrastructure communication.
FAQ
What wireless protocols does the CC1350F128RGZT natively support?
The CC1350F128RGZT natively supports Bluetooth® low energy 4.2 and IEEE 802.15.4g PHY in its ROM-based protocol stack, along with proprietary Sub-1 GHz and Wireless M-Bus (EN 13757-4) implementations. All protocol handling is managed by the dedicated Cortex-M0 Radio Controller, freeing the Cortex-M3 for application tasks. The CC1350F128RGZT does not support Zigbee or Thread without external software integration.
Does the CC1350F128RGZT require external RF components for basic operation?
Yes, the CC1350F128RGZT requires external RF matching components: a balun or diplexer for RF_P/RF_N differential interface, a 24-MHz crystal with load capacitors for the high-frequency oscillator, and a 32-kHz crystal for RTC. The integrated DC/DC converter still needs an external inductor and output capacitor. Reference designs (e.g., LAUNCHXL-CC1350) provide validated bill-of-materials for rapid prototyping of the CC1350F128RGZT.
How does the Sensor Controller in the CC1350F128RGZT reduce system power consumption?
The Sensor Controller in the CC1350F128RGZT is a fully autonomous 16-bit RISC processor with 2 KB SRAM that operates independently of the main Cortex-M3. It can perform analog acquisitions (12-bit ADC, comparator thresholds), digital polling, and conditional wake-up triggers - all while the Cortex-M3 remains in deep sleep. This architecture achieves 0.95 µA average current during one-second wakeup intervals, reducing total system power by up to 95% compared to CPU-driven sensing in the CC1350F128RGZT.
Is the CC1350F128RGZT pin-compatible with other devices in the CC13xx family?
The CC1350F128RGZT in the RGZ package shares identical pinout and footprint with CC1310F128RGZ (Sub-1 GHz only) and CC1352R (dual-band, larger memory), enabling drop-in replacement in existing layouts. However, firmware and RF calibration differ - Sub-1 GHz-only variants lack 2.4 GHz transceiver registers, and CC1352R requires updated SDK due to enhanced radio features. Hardware compatibility does not guarantee software equivalence for the CC1350F128RGZT.
What development tools are officially supported for the CC1350F128RGZT?
Texas Instruments officially supports Code Composer Studio™ (CCS) IDE, IAR Embedded Workbench® for Arm, SmartRF Studio for RF configuration, Sensor Controller Studio for autonomous sensor firmware, and the TI SimpleLink™ SDK with royalty-free protocol stacks. Debugging uses cJTAG (2-pin) or JTAG via DIO_3/DIO_4 pins. The LAUNCHXL-CC1350 development kit provides hardware reference, RF validation, and out-of-box examples specifically for the CC1350F128RGZT.
CC1350F128RGZT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- SimpleLink™
- Package/Case:
- 48-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Type:
- TxRx + MCU
- RF Family/Standard:
- Bluetooth
- Protocol:
- Bluetooth v4.2
- Modulation:
- GFSK
- Frequency:
- 2.4GHz
- Data Rate (Max):
- 1Mbps
- Power - Output:
- 9dBm
- Sensitivity:
- -124dBm
- Memory Size:
- 128kB Flash, 28kB SRAM
- Serial Interfaces:
- I2C, I2S, SPI, UART
- GPIO:
- 30
- Voltage - Supply:
- 1.8V ~ 3.8V
- Current - Receiving:
- 5.4mA
- Current - Transmitting:
- 22mA
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 48-VQFN (7x7)
CC1350F128RGZT FAQ
1.How can I place an order for CC1350F128RGZT through Aetrix?
Please submit a Request for Quotation (RFQ) for CC1350F128RGZT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CC1350F128RGZT reliable?
The price and inventory of CC1350F128RGZT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CC1350F128RGZT is usually 5 days.
3.What payment methods are accepted for CC1350F128RGZT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CC1350F128RGZT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CC1350F128RGZT?
CC1350F128RGZT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CC1350F128RGZT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CC1350F128RGZT?
For technical support, including CC1350F128RGZT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CC1350F128RGZT requirements.
6.How does Aetrix verify that CC1350F128RGZT is sourced from the original manufacturer or authorized distributors?
All CC1350F128RGZT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CC1350F128RGZT meets industry standards.
7.What is the process for return or replacement of CC1350F128RGZT?
All CC1350F128RGZT units undergo pre-shipment inspection (PSI). If there is an issue with CC1350F128RGZT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CC1350F128RGZT part is unused and in its original packaging.
Return procedure for CC1350F128RGZT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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