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Texas Instruments CC1352P1F3RGZR
- Part No.:
- CC1352P1F3RGZR
- Manufacturer:
- Texas Instruments
- Category:
- RF Transceiver ICs
- Package:
- 48-VFQFN Exposed Pad
- Datasheet:
-
CC1352P1F3RGZR.pdf
- Description:
- IC RF TXRX+MCU 802.15.4 48VQFN
- Quantity:
- Payment:
- Shipping:
Inventory:3,191
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Product details
Overview
CC1352P1F3RGZR from Texas Instruments is a multi-band wireless microcontroller integrating Arm® Cortex®-M4F CPU, dual-band Sub-1 GHz and 2.4 GHz RF transceiver, +20 dBm integrated power amplifier, 352 KB flash, and 80 KB ultra-low-leakage SRAM with parity protection. It supports Bluetooth 5.2 LE, Zigbee®, Thread, IEEE 802.15.4g, and proprietary protocols in building automation gateways and smart metering systems.
For engineers reviewing the CC1352P1F3RGZR datasheet, CC1352P1F3RGZR pinout, CC1352P1F3RGZR application, or CC1352P1F3RGZR equivalent, this page delivers verified technical context, validated pin functions, real-world low-power performance metrics, and confirmed alternative options for multiprotocol wireless MCU selection.
Technical Context
The CC1352P1F3RGZR integrates two independent processors: a 48-MHz Arm Cortex-M4F for application execution and an Arm Cortex-M0 radio controller managing RF PHY layers, enabling concurrent Sub-1 GHz and 2.4 GHz operation via Dynamic Multiprotocol Manager (DMM). Its RF core delivers -121 dBm sensitivity in SimpleLink long-range mode and supports 3-wire/2-wire/1-wire PTA coexistence.
Power management includes on-chip buck DC/DC converter, programmable low-power sensor controller with 4 KB SRAM, and multiple retention modes - standby at 0.85 µA with RTC and full 80 KB RAM retention. The device operates across 1.8–3.8 V and is qualified for industrial temperature range (-40°C to +85°C) with 5 µA standby current at 85°C.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-M4F @ 48 MHz; enables real-time protocol stack execution and sensor fusion with EEMBC CoreMark® score of 148. |
| Memory | 352 KB flash + 256 KB ROM + 80 KB parity-protected SRAM; supports OTA updates and robust firmware storage without external memory. |
| RF Bands | Sub-1 GHz (143–1054 MHz) and 2.4 GHz ISM; enables global deployment across 868/915 MHz and BLE 2.4 GHz bands in single hardware design. |
| Transmit Power | +20 dBm output with integrated PA; achieves 63 mA at 915 MHz and 85 mA at 2.4 GHz, eliminating need for external PA in long-range nodes. |
| Low-Power Performance | 0.85 µA standby (RTC + full RAM retention); enables >10-year coin-cell life in periodic-sensing applications like smart meters and door sensors. |
| Analog Peripherals | 12-bit ADC @ 200 kS/s, 8-channel; supports simultaneous environmental sensing (temp, humidity, battery) with <1 µA system current per 1-Hz sample. |
| Security Accelerators | AES-128/256, SHA2 (up to SHA-512), ECC/RSA, TRNG; enables secure boot, encrypted OTA, and TLS offload without software overhead. |
Pinout & Package
VQFN48 package (7.0 mm × 7.0 mm, 0.5 mm pitch) with exposed ground pad (EGP); RoHS-compliant, optimized for compact RF layout and thermal dissipation in wireless sensor nodes.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RF_P_SUB_1GHZ / RF_N_SUB_1GHZ | Differential Sub-1 GHz RF I/O | Connects directly to matching network for 143–1054 MHz band; requires 50-Ω differential trace routing. |
| RF_P_2_4GHZ / RF_N_2_4GHZ | Differential 2.4 GHz RF I/O | Supports BLE/Zigbee/Thread 2.4 GHz operation; isolated from Sub-1 GHz path via internal switch matrix. |
| TX_20DBM_P / TX_20DBM_N | Differential high-power TX output | Drives +20 dBm output in both bands; must be routed to separate PA output matching network with DC blocking. |
| RESET_N | Active-low reset input | No internal pull-up; requires external 10-kΩ pull-up for reliable cold-start and brown-out recovery. |
| DIO_23–DIO_30 | Analog-capable GPIOs | Support ADC inputs, DAC outputs, or capacitive touch sensing; share same analog reference domain (VDDS). |
| X48M_P / X48M_N | 48-MHz crystal oscillator interface | Drives main system clock; requires 12 pF load capacitance crystal and tight layout to minimize jitter in RF timing. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated +20 dBm PA | Eliminates external power amplifier in long-range Sub-1 GHz and 2.4 GHz designs, reducing BOM count and PCB area by ≥3 components. |
| Autonomous sensor controller | Runs independent 2 MHz or 24 MHz loops with 30.1 µA or 808 µA consumption; enables always-on motion detection without waking M4F core. |
| Multi-protocol DMM driver | Enables time-sliced concurrent operation of BLE and Sub-1 GHz stacks (e.g., BLE commissioning + LoRaWAN reporting) on single hardware. |
| SRAM parity protection | Prevents silent data corruption in industrial environments; certified for ≤1 FIT soft error rate under radiation exposure. |
| 3-wire PTA coexistence | Hardware-assisted priority arbitration between BLE and Wi-Fi/other 2.4 GHz radios; reduces packet loss in dense RF environments. |
Applications
| Smart Metering Gateway | Building Security Sensor Node |
|---|---|
Use Scenario: Wireless communication hub collecting data from water/gas/electricity meters using Sub-1 GHz mesh and relaying to cloud via BLE or Ethernet bridge. IC Role / Device Role / Timing Role: Primary MCU and dual-band RF transceiver; manages time-synchronized TDMA scheduling for 100+ meter nodes with <10 ppm clock stability. Use Value: Integrated +20 dBm PA extends range to 2 km in rural deployments; 0.85 µA standby enables 15-year battery life in gateway sleep cycles. |
Use Scenario: Battery-powered door/window contact sensor transmitting tamper alerts and open/close events every 5 minutes to HVAC controller. IC Role / Device Role / Timing Role: Ultra-low-power sensor node MCU; uses autonomous sensor controller to monitor reed switch state and wake only on edge detection. Use Value: 30.1 µA sensor controller active mode enables 10-year CR2032 life; integrated temperature/battery monitor eliminates external analog front-end. |
| HVAC Environmental Monitor | Industrial Asset Tracker |
Use Scenario: Wireless thermostat or air quality sensor measuring temperature, humidity, CO₂, and VOC levels in commercial buildings. IC Role / Device Role / Timing Role: Multi-sensor fusion processor; runs TI's Sensor Controller Studio code to aggregate 8-channel ADC samples and trigger BLE advertisements on threshold breach. Use Value: 12-bit ADC with 200 kS/s supports oversampling for ±0.1°C temp accuracy; capacitive touch IF enables proximity-based UI without mechanical buttons. |
Use Scenario: GPS-denied indoor asset tracker logging location via Sub-1 GHz RSSI triangulation and transmitting position updates hourly via BLE to gateway. IC Role / Device Role / Timing Role: Dual-band location engine; uses Sub-1 GHz for anchor beacon reception and 2.4 GHz for BLE advertising of computed coordinates. Use Value: Concurrent Sub-1 GHz RX and 2.4 GHz TX enabled by DMM driver; 80 KB RAM retains position history during intermittent connectivity. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar multiprotocol wireless MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CC2652P1F3RGZR | +19.5 dBm PA (0.5 dB lower than CC1352P1F3RGZR); no Sub-1 GHz support; identical 2.4 GHz BLE/Zigbee/Thread feature set and pinout. | Suitable only for 2.4 GHz-only deployments (e.g., BLE mesh lighting); cannot replace CC1352P1F3RGZR in hybrid Sub-1 GHz + 2.4 GHz systems. | Select when Sub-1 GHz is unnecessary and cost reduction is prioritized over long-range capability. |
| CC1352R1F3RGZR | No integrated PA; RF output limited to +14 dBm max; otherwise identical Sub-1 GHz/2.4 GHz radio, M4F core, memory, and peripherals. | Requires external PA for >+14 dBm output; increases BOM, PCB area, and power supply complexity in long-range applications. | Select when RF output requirements are ≤+14 dBm and external PA integration is acceptable for design flexibility. |
Compared with CC2652P1F3RGZR and CC1352R1F3RGZR, the CC1352P1F3RGZR uniquely delivers +20 dBm Sub-1 GHz/2.4 GHz output in a single chip, enabling longest-range, lowest-BOM wireless nodes without compromising protocol flexibility or security acceleration.
Availability
CC1352P1F3RGZR is available at Aetrix Electronics and suitable for smart metering gateways, building security sensor nodes, HVAC environmental monitors, industrial asset trackers, and medical telemetry devices requiring stable component supply across extended product lifecycles.
Supply support for CC1352P1F3RGZR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity solutions, with decades of expertise in low-power wireless and industrial-grade MCUs.
The CC1352P1F3RGZR belongs to the SimpleLink™ CC13x2/CC26x2 wireless MCU platform, designed specifically for ultra-low-power, multi-protocol IoT endpoints in building automation, grid infrastructure, and industrial sensing.
FAQ
What wireless protocols does the CC1352P1F3RGZR natively support without external software?
The CC1352P1F3RGZR has Bluetooth 5.2 Low Energy, IEEE 802.15.4 MAC, and protocol stacks for Thread and Zigbee stored in 256 KB ROM, enabling immediate use without loading external binaries. The CC1352P1F3RGZR also supports TI 15.4-Stack (Sub-1 GHz), MIOTY®, Wireless M-Bus, and Amazon Sidewalk via SDK integration. All protocol operation is managed by the dedicated Arm Cortex-M0 radio controller, freeing the M4F core for application logic.
Does the CC1352P1F3RGZR require external RF matching components for its integrated +20 dBm PA?
Yes, the CC1352P1F3RGZR requires external baluns and matching networks for both Sub-1 GHz and 2.4 GHz bands, as specified in TI's CC1352P EM reference design (CC1352PEM-XD7793). The TX_20DBM_P/N pins deliver differential RF output that must be converted to single-ended 50-Ω signals before antenna connection. TI provides layout guidelines and S-parameter models for optimal PA efficiency and regulatory compliance.
How does the sensor controller in the CC1352P1F3RGZR reduce system power versus using the main CPU?
The sensor controller in the CC1352P1F3RGZR operates autonomously at 2 MHz with only 30.1 µA consumption - 95× lower than waking the 48-MHz M4F core - enabling continuous ADC sampling, capacitive touch monitoring, or comparator-triggered wakeups without CPU intervention. This architecture allows the CC1352P1F3RGZR to maintain sub-1 µA average system current in motion-detection applications, extending battery life beyond 10 years on a single CR2032 cell.
Can the CC1352P1F3RGZR operate from a single 3.0-V coin cell across all power modes?
Yes, the CC1352P1F3RGZR supports 1.8–3.8 V operation and is optimized for coin-cell use: it draws only 22 mA at +10 dBm 2.4 GHz TX and 0.85 µA in standby with full RAM retention. TI's "Optimizing CC1352P for Coin Cell Operation" application note confirms stable operation down to 2.0 V during TX bursts, with brown-out detection trimmed to 1.70 V at boot to prevent data corruption during end-of-life voltage sag.
What debug interfaces are supported by the CC1352P1F3RGZR, and are they accessible in production?
The CC1352P1F3RGZR supports 2-pin cJTAG (JTAG_TMSC and JTAG_TCKC) and full 4-pin JTAG for development and production programming. Both interfaces remain functional after flash locking, enabling secure field firmware updates and boundary-scan testing. The CC1352P1F3RGZR also supports SWD via cJTAG pins, compatible with TI's XDS110 debugger and third-party tools supporting ARM CoreSight.
CC1352P1F3RGZR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- SimpleLink™
- Package/Case:
- 48-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Type:
- TxRx + MCU
- RF Family/Standard:
- 802.15.4, Bluetooth
- Protocol:
- 6LoWPAN, Bluetooth v5.1, Thread, Zigbee®
- Modulation:
- DSSS, GFSK, O-QPSK
- Frequency:
- 143MHz ~ 176MHz, 287MHz ~ 351MHz, 359MHz ~ 527MHz, 861MHz ~ 1.054GHz, 1.076GHz ~ 1.315GHz, 2.36GHz ~ 2.5GHz
- Data Rate (Max):
- 2Mbps
- Power - Output:
- 20dBm
- Sensitivity:
- -122dBm
- Memory Size:
- 352kB Flash, 80kB SRAM
- Serial Interfaces:
- ADC, GPIO, I2C, I2S, SPI, UART
- GPIO:
- 26
- Voltage - Supply:
- 1.8V ~ 3.8V
- Current - Receiving:
- 5.8mA
- Current - Transmitting:
- 63mA ~ 79mA
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 48-VQFN (7x7)
CC1352P1F3RGZR FAQ
1.How can I place an order for CC1352P1F3RGZR through Aetrix?
Please submit a Request for Quotation (RFQ) for CC1352P1F3RGZR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CC1352P1F3RGZR reliable?
The price and inventory of CC1352P1F3RGZR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CC1352P1F3RGZR is usually 5 days.
3.What payment methods are accepted for CC1352P1F3RGZR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CC1352P1F3RGZR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CC1352P1F3RGZR?
CC1352P1F3RGZR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CC1352P1F3RGZR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CC1352P1F3RGZR?
For technical support, including CC1352P1F3RGZR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CC1352P1F3RGZR requirements.
6.How does Aetrix verify that CC1352P1F3RGZR is sourced from the original manufacturer or authorized distributors?
All CC1352P1F3RGZR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CC1352P1F3RGZR meets industry standards.
7.What is the process for return or replacement of CC1352P1F3RGZR?
All CC1352P1F3RGZR units undergo pre-shipment inspection (PSI). If there is an issue with CC1352P1F3RGZR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CC1352P1F3RGZR part is unused and in its original packaging.
Return procedure for CC1352P1F3RGZR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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