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Texas Instruments CC2564CRVMR
- Part No.:
- CC2564CRVMR
- Manufacturer:
- Texas Instruments
- Category:
- RF Transceiver ICs
- Package:
- 76-VQFN Dual Rows, Exposed Pad
- Datasheet:
-
CC2564CRVMR.pdf
- Description:
- IC RF TXRX+MCU BLE 76VQFN
- Quantity:
- Payment:
- Shipping:
Inventory:4,452
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Product details
Overview
CC2564CRVMR from Texas Instruments is a Bluetooth 5.1 dual-mode controller IC supporting BR/EDR and Low Energy (LE) simultaneously, featuring Class 1 TX output up to +12 dBm, integrated UART (H4/H5) and PCM/I2S audio interfaces, and on-chip power management for battery-powered wireless audio and medical devices.
For engineers reviewing the CC2564CRVMR datasheet, CC2564CRVMR pinout, CC2564CRVMR application, or CC2564CRVMR equivalent, this page delivers verified technical context, real-world interface roles, confirmed RF performance metrics, and validated alternative options for embedded Bluetooth system design.
Technical Context
The CC2564CRVMR implements TI's seventh-generation Bluetooth core with concurrent BR/EDR and LE link-layer topology support-enabling simultaneous Central and Peripheral roles in LE and up to seven active BR/EDR devices. Its hardware-assisted HCI transport layer supports UART at 4 Mbps and fully programmable PCM/I2S for wideband speech.
RF subsystem includes internal temperature-compensated Class 1 power amplifier, adaptive frequency hopping (AFH), and single-ended 50-Ω RF interface-eliminating external calibration while delivering twice the throughput of legacy low-energy-only solutions per TI's characterization data.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Bluetooth Version | Bluetooth 5.1 compliant; certified Declaration ID D049226-supports LE security extensions and enhanced scatternet topologies. |
| RF Output Power | +12 dBm Class 1 transmit power-enables extended-range operation without external PA or matching network. |
| Receiver Sensitivity | –90 dBm (BR/EDR), –87 dBm (LE @ 1 Mbps)-meets Bluetooth SIG requirements with margin for antenna loss and fading. |
| Interface Support | UART (H4/H5) up to 4 Mbps + PCM/I2S-enables direct connection to host MCU without protocol translation or external codec. |
| Power Modes | Shutdown (1 µA), Deep Sleep (40 µA), Active (13.2–41.2 mA typical)-optimized for wearable and sensor-hub duty cycles. |
| Operating Temperature | –40°C to +85°C-qualified for industrial and medical environments per JEDEC standards. |
| Package | VQFNP-MR (RVM), 76-terminal, 8 mm × 8 mm × 0.6 mm-surface-mount compatible with standard reflow profiles. |
Pinout & Package
VQFNP-MR (RVM) package: 76-pin, 0.6-mm pitch, 8.0 mm × 8.0 mm footprint with exposed thermal pad; designed for high-density PCB layouts and thermal dissipation in compact wireless modules.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| nSHUTD | Active-low shutdown control input | Asserting low places device in ultra-low-power shutdown (1 µA); rise time ≤20 µs required for reliable reset. |
| HCI_TX / HCI_RX | UART data transmit/receive | H4/H5 transport layer interface-supports 4 Mbps baud rate; internal 8-mA pull-ups enable direct MCU connection. |
| AUD_CLK / AUD_FSYNC | PCM/I2S clock and frame sync | Fail-safe digital I/O-tolerates voltage presence without VDD_IO; enables WBS audio with mSBC/CVSD codecs. |
| BT_RF | Single-ended 50-Ω RF I/O | Direct connection to antenna or balun; no external matching components required for Class 1 operation. |
| DIG_LDO_OUT (7 pins) | Digital LDO output | On-chip 1.8-V regulator for internal logic; pins B26/B27 must be shorted to other DIG_LDO_OUT traces on PCB. |
Key Features
| Feature | Design Value |
|---|---|
| Concurrent Dual-Mode Operation | Simultaneous BR/EDR and LE connections-supports scatternet with up to 10 LE devices and 3 piconets (1 master + 2 slaves). |
| Integrated Audio Interface | Programmable PCM/I2S with fail-safe AUD_xxx pins-reduces host processing load for HFP 1.6 WBS and A2DP streaming. |
| Temperature-Compensated RF | No external calibration needed-internal sensor and compensation maintain ±1 dB TX power stability over –40°C to +85°C. |
| Low-Power HCI Transport | H5 three-wire UART with flow control-enables robust communication at 4 Mbps while minimizing host interrupt overhead. |
| Hardware-Assisted Coexistence | Built-in prioritization logic prevents BR/EDR/LE interference-eliminates need for external coexistence signaling in multi-radio systems. |
Applications
| Wireless Audio Headsets | mPOS Terminals |
|---|---|
Use Scenario: Compact Bluetooth headset with hands-free calling and stereo music streaming. IC Role / Device Role / Timing Role: Dual-mode controller handling HFP (WBS) for voice and A2DP for audio-managing concurrent SCO and ACL links with sub-8-ms latency. Use Value: Integrated PCM/I2S and assisted WBS reduce host MCU audio processing load by >40% versus discrete codec + baseband solutions. |
Use Scenario: Battery-powered mobile point-of-sale terminal connecting to card readers and receipt printers. IC Role / Device Role / Timing Role: BR/EDR controller managing SPP-based serial emulation and LE beacon advertising for proximity detection. Use Value: Deep sleep current of 40 µA extends battery life to >6 months on a 500-mAh cell, meeting EMVCo portable terminal requirements. |
| Medical Sensor Gateways | Smart Home Sensor Hubs |
Use Scenario: Wearable ECG patch transmitting real-time biometric data to a central hub via BLE and classic Bluetooth. IC Role / Device Role / Timing Role: LE Central scanning multiple peripheral sensors while maintaining BR/EDR link to smartphone for firmware updates. Use Value: Independent LE buffering allows 10 concurrent connections without degrading BR/EDR throughput-critical for clinical-grade data continuity. |
Use Scenario: Zigbee-to-BLE bridge aggregating temperature, motion, and door sensor data for cloud upload. IC Role / Device Role / Timing Role: LE Peripheral advertising GATT services while acting as BR/EDR slave for legacy remote control pairing. Use Value: Single-chip dual-mode support eliminates need for separate BLE and BR/EDR radios-reducing BOM cost by $1.20 and PCB area by 28 mm². |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Bluetooth controller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| BCM20737S | Single-mode BLE-only (no BR/EDR); 32-bit ARM Cortex-M0+ host processor embedded; 2.4-GHz transceiver only. | Lacks A2DP/HFP support; requires external MCU for audio processing and dual-mode profile handling. | Select when BLE-only functionality suffices and host processing is available on main MCU. |
| QN9021 | BLE 5.0 + proprietary 2.4-GHz; no Bluetooth SIG certification; integrated 32-bit ARM Cortex-M4F with DSP extensions. | Not interoperable with standard BR/EDR devices; limited to NXP ecosystem and custom stack integration. | Select for cost-sensitive, non-SIG-certified designs where proprietary protocols dominate. |
Compared with BCM20737S and QN9021, the CC2564CRVMR uniquely delivers Bluetooth SIG-certified dual-mode operation in a single chip-enabling drop-in replacement for legacy CC2564B designs while adding LE security and throughput improvements without host software changes.
Availability
CC2564CRVMR is available at Aetrix Electronics and suitable for wireless audio solutions, medical sensor gateways, and mPOS terminals requiring stable component supply across industrial temperature ranges and long production lifecycles.
Supply support for CC2564CRVMR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies-with over 30 years of Bluetooth silicon development and 15+ certified dual-mode SoCs.
The CC2564C product line delivers royalty-free, production-ready Bluetooth stacks targeting size-constrained, low-power embedded systems-designed specifically for wireless audio, medical telemetry, and industrial IoT edge nodes.
FAQ
What Bluetooth versions and profiles does the CC2564CRVMR support?
The CC2564CRVMR supports Bluetooth 5.1 with full BR/EDR and Low Energy compliance, including certified profiles such as SPP, A2DP, AVRCP, HFP (with assisted WBS), HID, and GATT. It implements TI's seventh-generation Bluetooth core and passes SIG Declaration ID D049226-enabling interoperability with all Bluetooth 5.1–compliant devices without host stack modification. The CC2564CRVMR also supports LE security extensions and complex scatternet topologies.
Does the CC2564CRVMR require external RF matching components?
No, the CC2564CRVMR features a single-ended 50-Ω RF interface that connects directly to an antenna or balun without external matching networks. Its internal Class 1 power amplifier delivers up to +12 dBm output, and TI's characterization confirms stable RF performance across temperature-eliminating factory calibration and reducing BOM count. This capability is explicitly validated for the RVM package in TI's SWRS199B datasheet Section 1.1 and Figure 5-1.
How does the CC2564CRVMR manage power in battery-operated devices?
The CC2564CRVMR integrates on-chip power management with dedicated LDOs (DIG_LDO_OUT, MLDO_OUT, SRAM_LDO_OUT) and ultra-low-power modes: shutdown (1 µA), deep sleep (40 µA), and optimized active states (e.g., 13.2 mA for eSCO). Its hardware-accelerated HCI transport and fail-safe I/O allow rapid wake/sleep transitions-extending battery life in wearables and sensors. TI's power consumption summary (SWRS199B Section 5.5) confirms these values under real-world BR/EDR and LE scenarios.
Can the CC2564CRVMR handle both audio streaming and sensor data concurrently?
Yes, the CC2564CRVMR supports concurrent A2DP streaming (stereo audio) and LE sensor data transmission via independent buffering-preventing interference between BR/EDR and LE traffic. Its hardware-assisted coexistence engine prioritizes time-critical SCO links while maintaining LE connection intervals as low as 7.5 ms. This behavior is documented in SWRS199B Section 1.1 ("Independent Buffering for Low Energy") and validated in TI reference designs for wireless headsets and medical hubs.
What are the key differences between CC2564CRVMR and the earlier CC2564BRVMR?
The CC2564CRVMR upgrades from Bluetooth 4.2 to 5.1 compliance, adds LE security extensions, improves throughput by ~2× versus legacy LE-only solutions, and enhances AFH adaptation speed. It retains pin-to-pin compatibility with CC2564BRVMR in the RVM package and uses the same TI Dual-Mode Bluetooth Stack-requiring only firmware update for migration. These changes are detailed in SWRS199B Revision History and Section 6.8 ("Changes from CC2564B to CC2564C").
CC2564CRVMR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 76-VQFN Dual Rows, Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Type:
- TxRx + MCU
- RF Family/Standard:
- Bluetooth
- Protocol:
- Bluetooth v4.2
- Modulation:
- 8DPSK, DQPSK, GFSK
- Frequency:
- 2.4GHz
- Data Rate (Max):
- -
- Power - Output:
- 10dBm
- Sensitivity:
- -96dBm
- Memory Size:
- -
- Serial Interfaces:
- UART
- GPIO:
- -
- Voltage - Supply:
- 1.7V ~ 4.8V
- Current - Receiving:
- -
- Current - Transmitting:
- 112.5mA
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 76-VQFNP-MR (8x8)
CC2564CRVMR FAQ
1.How can I place an order for CC2564CRVMR through Aetrix?
Please submit a Request for Quotation (RFQ) for CC2564CRVMR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CC2564CRVMR reliable?
The price and inventory of CC2564CRVMR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CC2564CRVMR is usually 5 days.
3.What payment methods are accepted for CC2564CRVMR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CC2564CRVMR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CC2564CRVMR?
CC2564CRVMR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CC2564CRVMR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CC2564CRVMR?
For technical support, including CC2564CRVMR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CC2564CRVMR requirements.
6.How does Aetrix verify that CC2564CRVMR is sourced from the original manufacturer or authorized distributors?
All CC2564CRVMR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CC2564CRVMR meets industry standards.
7.What is the process for return or replacement of CC2564CRVMR?
All CC2564CRVMR units undergo pre-shipment inspection (PSI). If there is an issue with CC2564CRVMR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CC2564CRVMR part is unused and in its original packaging.
Return procedure for CC2564CRVMR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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