Texas Instruments CC2640R2FYFVR

Overview

CC2640R2FYFVR from Texas Instruments is a Bluetooth 5.1 Low Energy wireless microcontroller featuring an Arm® Cortex®-M3 CPU (48 MHz), 128 KB Flash, 20 KB SRAM, integrated RF transceiver with –97 dBm RX sensitivity, and autonomous ultra-low-power sensor controller. It operates from 1.8–3.8 V and achieves 1.1 µA standby current with full RAM retention, targeting compact battery-powered IoT endpoints such as smart locks and medical sensors.

For engineers reviewing the CC2640R2FYFVR datasheet, CC2640R2FYFVR pinout, CC2640R2FYFVR application, or CC2640R2FYFVR equivalent, key selection criteria include its 2.7-mm × 2.7-mm DSBGA34 package with 14 GPIOs, Bluetooth 5.1 LE Coded PHY support, integrated DC/DC converter, and sensor controller runtime at 1 µA for 1-Hz ADC sampling - all validated for ETSI EN 300 328 and FCC Part 15 compliance.

Technical Context

The CC2640R2FYFVR implements a dual-core architecture: an Arm Cortex-M3 main CPU handles protocol stack execution and application logic, while a dedicated Arm Cortex-M0 radio controller manages RF PHY layer operations including Bluetooth 5.1 LE Coded and 2-Mbps GFSK modulation. The sensor controller-a separate 16-bit autonomous engine-executes analog sensing tasks (e.g., ADC, comparator) without waking the main CPU.

Its RF subsystem supports single-ended or differential 2.4-GHz interface, programmable output power up to +5 dBm, and achieves 102 dB link budget. Power management includes on-chip DC/DC conversion, multiple low-power modes (shutdown: 100 nA), and voltage domains segregated for RF (VDDR_RF), digital core (VDDR), and I/O (VDDS/VDDS2).

Key Specifications

Pinout & Package

CC2640R2FYFVR uses a 2.7-mm × 2.7-mm DSBGA34 package with 0.4-mm ball pitch and 34 solder balls. Pin assignment follows TI's YFV footprint, supporting high-density routing in miniature designs.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Bluetooth Low Energy wireless MCU applications.

Compared with CC2642R1FRGZR, CC2640R2FYFVR offers superior size efficiency and lower BOM cost for simple BLE endpoints, while nRF52833 DK provides higher compute headroom at the expense of board area and software rework.

Availability

CC2640R2FYFVR is available at Aetrix Electronics and suitable for smart lock systems, wireless medical sensors, industrial asset trackers, and electronic shelf labels requiring stable component supply across multi-year production cycles.

Supply support for CC2640R2FYFVR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company delivering analog and embedded processing solutions, with leadership in low-power wireless connectivity and industrial-grade reliability.

The CC2640R2F product line delivers Bluetooth 5.1 Low Energy wireless MCUs optimized for ultra-low-power, space-constrained IoT endpoints - emphasizing long battery life, regulatory-certified RF performance, and seamless integration into the SimpleLink™ MCU platform.

FAQ

What Bluetooth 5.1 features does the CC2640R2FYFVR support?

The CC2640R2FYFVR supports all mandatory and key optional Bluetooth 5.1 Low Energy features, including LE Coded PHY (S=2/S=8 for Long Range), LE 2-Mbps PHY (High Speed), Advertising Extensions, and Multiple Advertisement Sets. It maintains full backward compatibility with Bluetooth 4.x and earlier specifications. These capabilities are enabled by the ROM-resident BLE stack and dual-core architecture - the CC2640R2FYFVR executes them without consuming application Flash or SRAM resources.

Does the CC2640R2FYFVR require external RF components for regulatory compliance?

No, the CC2640R2FYFVR is pre-certified for FCC Part 15 (US), ETSI EN 300 328 (Europe), and ARIB STD-T66 (Japan) when used with reference matching networks and antenna layouts documented in TI's design guides. Its integrated RF front-end, calibrated PA/LNA, and built-in DC/DC converter eliminate the need for external RF certification testing - significantly reducing time-to-market for end products.

How many GPIOs are available on the CC2640R2FYFVR, and what peripheral functions do they support?

The CC2640R2FYFVR provides 14 configurable GPIOs in its DSBGA34 package. Each pin supports multiple functions including UART, I²C, SPI, I²S, ADC input, analog comparator, capacitive sensing, and PWM output. Four pins (DIO_2, DIO_3, DIO_4, DIO_5) feature high-drive capability (up to 20 mA), and eight (DIO_7–DIO_13, DIO_9–DIO_10) support analog sensing - enabling direct connection to thermistors, photodiodes, or battery monitors without external signal conditioning.

What is the lowest power state achievable with full RAM retention on the CC2640R2FYFVR?

The CC2640R2FYFVR achieves 1.1 µA standby current with full 20 KB SRAM retention and Real-Time Clock (RTC) running - verified under 3.0 V supply and 25°C conditions. This state preserves application context and enables sub-10 µs wake-up to active mode, making it ideal for infrequent sensor polling or BLE advertising intervals. The value is measured with internal DC/DC enabled and all clocks gated except RTC and LFXO.

Can the CC2640R2FYFVR be programmed and debugged using standard JTAG tools?

Yes, the CC2640R2FYFVR supports 2-pin cJTAG (JTAG_TMSC and JTAG_TCKC) for programming and debugging, compatible with TI's XDS110 debug probe and Code Composer Studio™ IDE. It also supports full 4-pin JTAG for legacy toolchains. Debug access remains functional even in low-power modes, and flash programming is supported over SWD or cJTAG - no external bootloader is required. The CC2640R2FYFVR retains full debug visibility throughout development and field firmware updates.