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Texas Instruments CC2640R2LRGZR
- Part No.:
- CC2640R2LRGZR
- Manufacturer:
- Texas Instruments
- Category:
- RF Transceiver ICs
- Package:
- 48-VFQFN Exposed Pad
- Datasheet:
-
CC2640R2LRGZR.pdf
- Description:
- IC RF TXRX+MCU BLE 48VQFN
- Quantity:
- Payment:
- Shipping:
Inventory:4,990
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Product details
Overview
CC2640R2LRGZR from Texas Instruments is a Bluetooth 5.1 Low Energy wireless microcontroller featuring an Arm® Cortex®-M3 core (48 MHz), 128 KB flash, 20 KB ultra-low-leakage SRAM, -97 dBm RX sensitivity, and integrated DC/DC converter - deployed in smart locks, medical thermometers, and industrial asset trackers.
For engineers reviewing the CC2640R2LRGZR datasheet, CC2640R2LRGZR pinout, CC2640R2LRGZR application, or CC2640R2LRGZR equivalent, this page delivers verified package mapping (VQFN48, 7 mm × 7 mm), confirmed RF performance (BLE 5.1 Coded PHY support), validated low-power operation (1.5 µA standby), and real-world peripheral routing flexibility (all digital pins assignable to any GPIO).
Technical Context
The CC2640R2LRGZR integrates a dual-core architecture: an Arm Cortex-M3 application processor with ROM-resident BLE stack and cryptographic accelerators, and a dedicated Arm Cortex-M0 radio controller managing BLE 5.1 PHY layers (LE Coded, LE 2-Mbps) independently. Its RF subsystem supports both single-ended and differential RF interfaces with programmable +5 dBm output power.
Power management includes an on-chip DC/DC converter enabling 1.7–1.95 V VDDR/VDDR_RF operation, while system-level flexibility is achieved via full GPIO remapping, 12-bit 200-ksps ADC with 8-channel analog MUX, and hardware AES-128/TRNG for secure OTA updates - all within a RoHS-compliant VQFN48 package.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-M3 @ 48 MHz - enables real-time BLE host/controller execution with EEMBC CoreMark® score of 142 |
| Memory | 128 KB flash + 20 KB ultra-low-leakage SRAM - sufficient for BLE 5.1 stack + application code with OTA capability |
| RF Performance | -97 dBm RX sensitivity (1-Mbps GFSK), +5 dBm TX output - achieves 102 dB link budget for robust indoor range |
| Power Consumption | 1.5 µA standby (RTC + RAM retention), 5.9 mA active RX - supports multi-year battery life in coin-cell-powered sensors |
| ADC | 12-bit, 200 ksps, 8-channel analog MUX - supports direct sensor interface without external signal conditioning |
| Security | AES-128 accelerator + TRNG - enables FIPS-compliant encryption and cryptographically secure key generation |
| Regulatory Compliance | Pre-certified for FCC Part 15, ETSI EN 300 328, ARIB STD-T66 - reduces time-to-market for global deployments |
Pinout & Package
VQFN48 package (7.0 mm × 7.0 mm, 0.5 mm pitch) with exposed thermal pad; 31 GPIOs, dual crystal oscillator support (24 MHz XOSC_HF, 32.768 kHz XOSC_LF), and dedicated RF_P/RF_N differential I/O.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RF_P / RF_N | Differential RF I/O | Direct connection to balun or matching network for optimized BLE 5.1 RF performance (-97 dBm RX) |
| X24M_P / X24M_N | HF crystal oscillator | Drives 24 MHz reference for RF PLL and system clock - required for BLE timing accuracy and frequency stability |
| X32K_Q1 / X32K_Q2 | LF crystal oscillator | Provides 32.768 kHz clock for RTC and low-power sleep modes - enables precise wake-up timing at 1.5 µA standby |
| RESET_N | Active-low reset input | Hardware reset trigger with no internal pull-up - requires external pull-up for reliable boot initialization |
| DIO_0–DIO_30 | Configurable GPIO | All digital peripherals (UART, I2C, SSI, timers) can be routed to any of 31 pins - eliminates fixed-function layout constraints |
| VDDR / VDDR_RF | 1.7–1.95 V supply rails | Outputs of internal DC/DC converter - enable efficient low-voltage operation while isolating RF/analog domains |
Key Features
| Feature | Design Value |
|---|---|
| BLE 5.1 protocol stack in ROM | Frees 128 KB flash for application code - eliminates need for external memory in resource-constrained designs |
| Full GPIO remapping | Enables optimal PCB routing by assigning UART/I2C/SSI to any DIO pin - reduces layer count and EMI risk |
| Dual crystal support | 24 MHz HF + 32.768 kHz LF oscillators allow simultaneous high-speed processing and ultra-low-power RTC operation |
| Integrated DC/DC converter | Reduces system power by >30% vs. LDO-only supply - critical for coin-cell applications requiring >5-year battery life |
| Hardware security modules | AES-128 + TRNG accelerate secure OTA firmware updates - prevents unauthorized firmware injection in field-deployed devices |
Applications
| Smart Locks | Medical Thermometers |
|---|---|
Use Scenario: Battery-powered door lock with BLE provisioning, firmware updates, and tamper alerts. IC Role / Device Role / Timing Role: Wireless MCU handling BLE 5.1 advertising, encrypted command parsing, and low-power wake-on-RF event. Use Value: 1.5 µA standby current extends CR2032 battery life beyond 3 years; -97 dBm RX ensures reliable pairing through doors and walls. |
Use Scenario: Clinical-grade contactless thermometer transmitting temperature readings to smartphones or gateways. IC Role / Device Role / Timing Role: Sensor hub integrating 12-bit ADC, temperature sensor, and BLE 5.1 Long Range PHY for extended transmission distance. Use Value: Integrated temperature sensor + 12-bit ADC eliminates external components; BLE Coded PHY doubles range in hospital environments. |
| Industrial Asset Trackers | Wireless Pointing Devices |
Use Scenario: Ruggedized BLE tag monitoring location, temperature, and shock events on factory equipment. IC Role / Device Role / Timing Role: Ultra-low-power data logger using RTC-triggered ADC sampling and burst BLE transmission. Use Value: 20 KB ultra-low-leakage SRAM retains sensor history during deep sleep; AES-128 secures firmware updates over public networks. |
Use Scenario: Ergonomic wireless mouse with motion sensing, button inputs, and HID-over-GATT reporting. IC Role / Device Role / Timing Role: Real-time HID controller with sub-10 ms latency, leveraging 48 MHz Cortex-M3 for motion algorithm execution. Use Value: 6.1 mA TX current at 0 dBm enables responsive cursor movement; full GPIO remapping simplifies mechanical switch routing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Bluetooth Low Energy wireless MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CC2640R2FRGZR | 128 KB flash + 20 KB SRAM, identical pinout and RF specs, but includes BLE Host/Controller in flash instead of ROM | Requires ~20 KB flash for BLE stack - reduces available space for application logic vs. CC2640R2LRGZR's ROM-based stack | Select CC2640R2FRGZR only if custom BLE stack modifications are needed; otherwise CC2640R2LRGZR maximizes flash headroom. |
| CC2652R1RGZR | Multi-protocol (BLE 5.2, Zigbee, Thread, IEEE 802.15.4), 352 KB flash, 80 KB RAM, same VQFN48 package and pin compatibility | Supports concurrent protocols and larger applications - over-spec for pure BLE 5.1 use cases, with higher BOM cost | Choose CC2652R1RGZR when future protocol expansion (e.g., Matter over Thread) is required; CC2640R2LRGZR is optimal for cost-sensitive BLE-only designs. |
Compared with CC2640R2FRGZR and CC2652R1RGZR, the CC2640R2LRGZR delivers the highest flash efficiency for BLE 5.1 applications due to ROM-hosted protocol stack, while maintaining pin compatibility with both alternatives - enabling design reuse across product tiers without PCB revision.
Availability
CC2640R2LRGZR is available at Aetrix Electronics and suitable for smart locks, medical thermometers, and industrial asset trackers requiring stable component supply, long-lifecycle assurance, and pre-certified RF compliance.
Supply support for CC2640R2LRGZR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and connectivity solutions with emphasis on reliability, energy efficiency, and design enablement.
The CC2640R2LRGZR belongs to TI's SimpleLink™ wireless MCU platform, engineered specifically for ultra-low-power Bluetooth 5.1 applications in medical, building automation, and industrial IoT where secure OTA updates and regulatory certification acceleration are critical.
FAQ
What is the maximum output power supported by the CC2640R2LRGZR?
The CC2640R2LRGZR supports programmable RF output power up to +5 dBm in differential mode, measured per Bluetooth 5.1 specifications. This level delivers a 102 dB link budget and meets ETSI/FCC/ARIB regulatory limits without external PA - enabling robust communication in dense RF environments while maintaining 9.1 mA TX current consumption.
Does the CC2640R2LRGZR include a built-in DC/DC converter?
Yes, the CC2640R2LRGZR integrates an on-chip DC/DC converter that generates regulated 1.7–1.95 V supplies (VDDR and VDDR_RF) from a 1.8–3.8 V main input (VDDS). This reduces system power by >30% compared to LDO-only designs and is essential for achieving 1.5 µA standby current with RTC and RAM retention - a key requirement for battery-operated CC2640R2LRGZR applications.
How many GPIOs does the CC2640R2LRGZR provide, and are they fully configurable?
The CC2640R2LRGZR provides 31 GPIOs in its RGZ package, and all digital peripheral functions (UART, I2C, SSI, timers, etc.) can be routed to any GPIO pin via software configuration. This full remapping capability eliminates fixed-function pin constraints, simplifies PCB layout, and allows optimal signal integrity routing - a verified feature confirmed in the device's Technical Reference Manual and functional block diagram.
Is the CC2640R2LRGZR pin-compatible with other SimpleLink devices?
Yes, the CC2640R2LRGZR is pin-compatible with the CC2640, CC2640R2F, CC2642R, CC2652R, and CC1350 in the 7-mm × 7-mm VQFN48 (RGZ) package. This compatibility enables hardware reuse across Bluetooth 4.x, BLE 5.x, and multi-protocol designs - verified in TI's Device Comparison table and Pin Diagram documentation for the RGZ footprint.
What development tools are officially supported for the CC2640R2LRGZR?
Texas Instruments officially supports Code Composer Studio™ IDE, IAR Embedded Workbench® for Arm®, SmartRF™ Studio, and the SimpleLink™ CC2640R2 Software Development Kit (SDK) for the CC2640R2LRGZR. These tools include BLE 5.1 protocol stack libraries, driver APIs, reference examples, and cloud IDE access - all validated against the CC2640R2LRGZR silicon revision and documented in SWRS250A.
CC2640R2LRGZR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- SimpleLink™
- Package/Case:
- 48-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Type:
- TxRx + MCU
- RF Family/Standard:
- Bluetooth
- Protocol:
- Bluetooth v5.1
- Modulation:
- GFSK
- Frequency:
- 2.4GHz
- Data Rate (Max):
- 2Mbps
- Power - Output:
- 5dBm
- Sensitivity:
- -103dBm
- Memory Size:
- 128kB Flash, 20kB SRAM
- Serial Interfaces:
- I2C, I2S, JTAG, SPI, UART
- GPIO:
- 31
- Voltage - Supply:
- 1.8V ~ 3.8V
- Current - Receiving:
- 5.9mA ~ 6.1mA
- Current - Transmitting:
- 6.1mA ~ 9.1mA
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 48-VQFN (7x7)
CC2640R2LRGZR FAQ
1.How can I place an order for CC2640R2LRGZR through Aetrix?
Please submit a Request for Quotation (RFQ) for CC2640R2LRGZR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CC2640R2LRGZR reliable?
The price and inventory of CC2640R2LRGZR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CC2640R2LRGZR is usually 5 days.
3.What payment methods are accepted for CC2640R2LRGZR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CC2640R2LRGZR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CC2640R2LRGZR?
CC2640R2LRGZR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CC2640R2LRGZR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CC2640R2LRGZR?
For technical support, including CC2640R2LRGZR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CC2640R2LRGZR requirements.
6.How does Aetrix verify that CC2640R2LRGZR is sourced from the original manufacturer or authorized distributors?
All CC2640R2LRGZR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CC2640R2LRGZR meets industry standards.
7.What is the process for return or replacement of CC2640R2LRGZR?
All CC2640R2LRGZR units undergo pre-shipment inspection (PSI). If there is an issue with CC2640R2LRGZR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CC2640R2LRGZR part is unused and in its original packaging.
Return procedure for CC2640R2LRGZR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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