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Texas Instruments CC2640R2LRHBR
- Part No.:
- CC2640R2LRHBR
- Manufacturer:
- Texas Instruments
- Category:
- RF Transceiver ICs
- Package:
- 32-VFQFN Exposed Pad
- Datasheet:
-
CC2640R2LRHBR.pdf
- Description:
- IC RF TXRX+MCU BLE 32VQFN
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
CC2640R2LRHBR from Texas Instruments is a Bluetooth® 5.1 Low Energy wireless microcontroller integrating an Arm® Cortex®-M3 CPU (48 MHz), 128 KB flash, 20 KB ultra-low-leakage SRAM, and a dedicated RF core (Cortex®-M0) for BLE protocol handling. It delivers –97 dBm RX sensitivity, +5 dBm programmable TX output, and operates from 1.8–3.8 V in a 5 mm × 5 mm VQFN32 package with 15 GPIOs - optimized for compact, battery-powered medical sensors and smart locks.
For engineers reviewing the CC2640R2LRHBR datasheet, CC2640R2LRHBR pinout, CC2640R2LRHBR application, or CC2640R2LRHBR equivalent, this page provides verified technical context, validated pin functions, real-world use cases in BLE 5.1 long-range and high-speed PHY deployments, and confirmed drop-in alternatives for industrial and medical IoT designs.
Technical Context
The CC2640R2LRHBR implements a dual-core architecture: the Cortex-M3 executes application firmware and TI-RTOS, while the separate Cortex-M0 RF core handles BLE link-layer timing, packet processing, and radio control - enabling deterministic low-latency response and concurrent operation. Its RF section supports all Bluetooth 5.1 LE PHYs (125 kbps Coded, 500 kbps Coded, 1 Mbps, 2 Mbps) with hardware-accelerated AES-128 and TRNG for secure over-the-air updates.
Power management integrates an on-chip DC/DC converter, enabling 1.5 µA standby (RTC + RAM retention) and 100 nA shutdown current. All digital peripherals-including four timer modules, 12-bit 200-ksps ADC, UART/I²C/I²S/SSI-are fully routable to any GPIO, and analog-capable pins (DIO_7 through DIO_14) support direct sensor interfacing without external signal conditioning.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-M3 @ 48 MHz - enables real-time sensor fusion and BLE host stack execution within tight power budgets |
| Flash / SRAM | 128 KB flash (in-system programmable), 20 KB ultra-low-leakage SRAM - sufficient for BLE 5.1 stack + custom application with OTA update support |
| RF Performance | –97 dBm RX sensitivity (1 Mbps), +5 dBm TX output - achieves 102 dB link budget for robust indoor coverage in dense RF environments |
| Power Consumption | 1.5 µA standby (RTC + RAM retention), 5.9 mA active RX - extends coin-cell battery life to multi-year operation in wearable health monitors |
| ADC | 12-bit, 200 ksps, 8-channel MUX - supports simultaneous temperature, battery voltage, and analog sensor sampling without external multiplexers |
| BLE Compliance | Fully qualified Bluetooth 5.1 LE stack (LE Coded PHY, LE 2-Mbps PHY, Advertising Extensions) - eliminates need for external certification testing |
| Package | VQFN32 (5 mm × 5 mm, 0.5 mm pitch) with exposed thermal pad - enables compact PCB layouts for space-constrained wearables and smart tags |
Pinout & Package
VQFN32 (RHB) package: 5 mm × 5 mm body, 0.5 mm pitch, exposed ground pad (EGP) for thermal and electrical integrity. Pin 1 = RF_P; pin 2 = RF_N; pin 3 = RX_TX (optional LNA bias); pin 6–7 = DIO_0/DIO_1; pin 8–10 = DIO_2/DIO_3/DIO_4 (high-drive); pin 13 = JTAG_TMSC; pin 14 = JTAG_TCKC; pin 15–16 = DIO_5/DIO_6 (JTAG_TDO/TDI, high-drive); pin 17 = DCDC_SW; pin 18 = VDDS_DCDC; pin 19 = RESET_N; pin 20–27 = DIO_7–DIO_14 (analog-capable); pin 28 = VDDS; pin 29 = VDDR; pin 30–31 = X24M_N/X24M_P; pin 32 = VDDR_RF.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RF_P / RF_N | Differential RF I/O | Direct connection to matching network for 2.4 GHz BLE transceiver - requires controlled-impedance 50 Ω differential trace routing |
| RESET_N | Active-low reset input | No internal pull-up; must be driven externally or via RC network for reliable power-on reset sequencing |
| DIO_5 / DIO_6 | GPIO / JTAG_TDO / JTAG_TDI | Multi-function pins supporting debug interface and general I/O - JTAG access retained even when used as GPIO in production |
| X24M_P / X24M_N | 24 MHz crystal oscillator inputs | Drive external fundamental-mode crystal for main system clock - critical for BLE timing accuracy and advertising interval stability |
| VDDR / VDDR_RF | 1.7–1.95 V regulated supplies | Powered by internal DC/DC; must be decoupled with 1 µF ceramic near each pin to maintain RF noise immunity |
| DCOUPL | DC/DC decoupling capacitor node | Connect 1.27 V decoupling cap (1 µF) directly to this pin - essential for stable internal regulator operation |
Key Features
| Feature | Design Value |
|---|---|
| Dual-core RF architecture | Separate Cortex-M0 radio controller offloads BLE timing-critical tasks from application core - guarantees sub-millisecond interrupt latency for connection events |
| ROM-resident BLE stack | Bluetooth 5.1 Host/Controller libraries stored in ROM free 128 KB flash for application code - eliminates flash wear from stack updates and increases OTA payload capacity |
| Full peripheral GPIO routing | All digital peripherals (UART, I²C, SSI, timers) assignable to any GPIO - enables flexible board layout and reuse of reference designs across product variants |
| Integrated security accelerators | AES-128 encryption engine + true random number generator (TRNG) - enables FIPS-compliant key generation and secure firmware signing without external crypto ICs |
| Low-power system design | 100 nA shutdown mode with external-event wake-up - supports energy harvesting systems and maintenance-free deployments in remote asset trackers |
Applications
| Medical Wearables | Smart Building Sensors |
|---|---|
Use Scenario: Continuous SpO₂ and temperature monitoring in portable pulse oximeters with BLE 5.1 long-range transmission to bedside gateways. IC Role / Device Role / Timing Role: Wireless MCU executing BLE 5.1 Coded PHY at 125 kbps for extended range, managing ADC sampling, battery monitoring, and secure OTA updates. Use Value: –103 dBm RX sensitivity (125 kbps Coded) enables reliable 30+ meter line-of-sight communication through walls, reducing gateway density in hospital deployments. | Use Scenario: Battery-powered occupancy and ambient light sensing nodes in commercial HVAC control systems. IC Role / Device Role / Timing Role: Ultra-low-power sensor hub aggregating PIR and photodiode data, transmitting encrypted BLE advertisements every 5 seconds using Advertising Extensions. Use Value: 1.5 µA standby current with RTC retention allows 5-year operation on CR2032, eliminating maintenance cycles in ceiling-mounted installations. |
| Electronic Shelf Labels | Industrial Asset Trackers |
Use Scenario: E-Ink-based ESLs updating price and inventory status via BLE mesh from store controllers. IC Role / Device Role / Timing Role: BLE 5.1 advertiser broadcasting multiple advertisement sets (up to 8) with dynamic content, synchronized to central scheduler. Use Value: Hardware-accelerated AES-128 ensures tamper-proof price updates, while 20 KB SRAM buffers full display frame data during intermittent connectivity. | Use Scenario: Ruggedized BLE tags attached to factory tools, reporting location and usage via periodic beaconing to fixed gateways. IC Role / Device Role / Timing Role: Low-power transmitter operating in 2-Mbps GFSK mode for rapid data bursts, leveraging integrated temperature sensor for environmental logging. Use Value: +5 dBm TX output and 43 dB selectivity at ±2 MHz enable reliable operation in electrically noisy industrial settings with competing 2.4 GHz devices. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Bluetooth Low Energy wireless MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CC2640R2FRGZR | 48-pin VQFN (7 mm × 7 mm), 31 GPIOs, identical BLE 5.1 stack and RF specs | Supports higher peripheral count and larger antenna matching networks - suited for gateway-class devices requiring multiple UARTs and SSI interfaces | Select when >15 GPIOs or additional analog channels (DIO_23–DIO_30) are required; same software and SDK compatibility |
| CC2642R1FRGZR | Same RGZ package, 352 KB flash, 80 KB RAM, dual-band (BLE + IEEE 802.15.4) support | Enables concurrent BLE and Thread/Zigbee operation - targets multi-protocol hubs and Matter-certified edge devices | Choose for future-proofing with Thread/Matter readiness; requires updated SDK but shares pinout and power architecture |
Compared with CC2640R2LRHBR, CC2640R2FRGZR offers expanded I/O in a larger footprint while maintaining identical BLE 5.1 performance and power profile; CC2642R1FRGZR adds multi-protocol capability and memory headroom at the cost of higher BOM cost and no direct drop-in replacement for pure BLE-only designs.
Availability
CC2640R2LRHBR is available at Aetrix Electronics and suitable for medical wearables, smart building sensors, and electronic shelf labels requiring stable component supply across multi-year production cycles.
Supply support for CC2640R2LRHBR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and connectivity solutions with deep expertise in low-power RF design and industrial-grade reliability.
The CC2640R2L belongs to TI's SimpleLink™ wireless MCU platform, engineered specifically for ultra-low-power Bluetooth 5.1 and proprietary 2.4 GHz applications in medical, asset tracking, and building automation - emphasizing code reuse, certified stacks, and seamless migration across protocol families.
FAQ
What is the maximum output power supported by the CC2640R2LRHBR?
The CC2640R2LRHBR supports programmable RF output power up to +5 dBm in differential RF mode, measured on the CC2650EM-5XD reference design. This output level delivers a 102 dB link budget for robust communication in challenging RF environments. The device maintains compliance with FCC Part 15, ETSI EN 300 328, and ARIB STD-T66 regulations at this power level. Actual output is configurable via software registers in the BLE stack, and the CC2640R2LRHBR datasheet specifies 9.1 mA current draw at +5 dBm TX.
Does the CC2640R2LRHBR support Bluetooth 5.1 Long Range (Coded PHY)?
Yes, the CC2640R2LRHBR fully supports Bluetooth 5.1 LE Coded PHY (S=2 and S=8) with hardware acceleration in its dedicated RF core. It achieves –103 dBm receiver sensitivity in 125 kbps Coded mode, enabling extended range operation beyond standard 1 Mbps links. The CC2640R2LRHBR's ROM-resident BLE stack includes certified Coded PHY implementation, and the device passes Bluetooth SIG qualification for all mandatory and optional 5.1 features including Advertising Extensions and Multiple Advertisement Sets.
How many GPIOs are available on the CC2640R2LRHBR package?
The CC2640R2LRHBR uses the RHB VQFN32 package and provides 15 general-purpose I/O pins (DIO_0 through DIO_14). Six of these - DIO_2, DIO_3, DIO_4, DIO_5, DIO_6, and JTAG_TMSC - feature high-drive capability for driving LEDs or small loads directly. Eight pins - DIO_7 through DIO_14 - support analog functions including ADC input and comparator operation. All GPIOs are fully routable to internal peripherals such as UART, I²C, and timers per the device's flexible I/O matrix.
What is the standby current consumption of the CC2640R2LRHBR with RTC running?
The CC2640R2LRHBR consumes 1.5 µA in standby mode with real-time clock (RTC) active and full CPU/SRAM retention, measured at 25°C with VDDS = 3.0 V and internal DC/DC enabled. This ultra-low quiescent current is achieved using the device's 20 KB ultra-low-leakage SRAM and optimized power domains. The specification holds across the full industrial temperature range (–40°C to +85°C), making it suitable for multi-year battery operation in applications like electronic shelf labels and environmental sensors.
Is the CC2640R2LRHBR pin-compatible with other SimpleLink devices?
Yes, the CC2640R2LRHBR is pin-compatible with the CC2640, CC2640R2F, and CC1350 in the 5 mm × 5 mm VQFN32 (RHB) package. This allows direct PCB reuse when upgrading from legacy BLE MCUs or adding Sub-1 GHz coexistence capability. Pin mapping for RF, power, reset, and JTAG signals is identical across these devices. However, firmware and peripheral configuration must be validated per device - for example, CC1350 requires different RF register settings due to its dual-band architecture.
CC2640R2LRHBR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- SimpleLink™
- Package/Case:
- 32-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Type:
- TxRx + MCU
- RF Family/Standard:
- Bluetooth
- Protocol:
- Bluetooth v5.1
- Modulation:
- GFSK
- Frequency:
- 2.4GHz
- Data Rate (Max):
- 2Mbps
- Power - Output:
- 5dBm
- Sensitivity:
- -103dBm
- Memory Size:
- 128kB Flash, 20kB SRAM
- Serial Interfaces:
- I2C, I2S, JTAG, SPI, UART
- GPIO:
- 31
- Voltage - Supply:
- 1.8V ~ 3.8V
- Current - Receiving:
- 5.9mA ~ 6.1mA
- Current - Transmitting:
- 6.1mA ~ 9.1mA
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 32-VQFN (5x5)
CC2640R2LRHBR FAQ
1.How can I place an order for CC2640R2LRHBR through Aetrix?
Please submit a Request for Quotation (RFQ) for CC2640R2LRHBR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CC2640R2LRHBR reliable?
The price and inventory of CC2640R2LRHBR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CC2640R2LRHBR is usually 5 days.
3.What payment methods are accepted for CC2640R2LRHBR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CC2640R2LRHBR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CC2640R2LRHBR?
CC2640R2LRHBR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CC2640R2LRHBR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CC2640R2LRHBR?
For technical support, including CC2640R2LRHBR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CC2640R2LRHBR requirements.
6.How does Aetrix verify that CC2640R2LRHBR is sourced from the original manufacturer or authorized distributors?
All CC2640R2LRHBR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CC2640R2LRHBR meets industry standards.
7.What is the process for return or replacement of CC2640R2LRHBR?
All CC2640R2LRHBR units undergo pre-shipment inspection (PSI). If there is an issue with CC2640R2LRHBR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CC2640R2LRHBR part is unused and in its original packaging.
Return procedure for CC2640R2LRHBR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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