Texas Instruments CC2650F128RHBR

Overview

CC2650F128RHBR from Texas Instruments is a multistandard wireless microcontroller integrating an ARM Cortex-M3 CPU (48 MHz), 128KB flash, 20KB ultralow-leakage SRAM, and dual-mode 2.4-GHz RF transceiver supporting Bluetooth Low Energy 4.2 and IEEE 802.15.4 PHY/MAC. It delivers –97 dBm BLE RX sensitivity, +5 dBm programmable TX output, and operates from 1.8–3.8 V, enabling coin-cell-powered IoT sensor nodes and remote controls.

For engineers reviewing the CC2650F128RHBR datasheet, CC2650F128RHBR pinout, CC2650F128RHBR application, or CC2650F128RHBR equivalent, key selection considerations include its 5-mm × 5-mm RHB VQFN32 package with 15 GPIOs, integrated sensor controller for autonomous analog/digital sensing, DC-DC converter, AES-128 security module, and support for OTA firmware updates in resource-constrained embedded designs.

Technical Context

The CC2650F128RHBR implements a dual-core architecture: the main ARM Cortex-M3 handles application execution and protocol stack processing, while a dedicated ARM Cortex-M0 runs the BLE/802.15.4 MAC and RF baseband in ROM, reducing flash usage and improving real-time determinism. Its RF section features a fully integrated transceiver with single-ended or differential RF interface, digital PLL, and programmable output power up to +5 dBm.

Power management includes three low-power modes-standby (1 µA with RTC and RAM retention) and shutdown (100 nA wake-on-event)-enabled by a configurable DC-DC converter and split supply domains (VDDS, VDDR, VDDR_RF). The ultralow-power sensor controller (8.2 µA/MHz) operates independently with 2KB SRAM to acquire data from ADC, comparators, or capacitive sensors without waking the main CPU.

Key Specifications

Pinout & Package

CC2650F128RHBR uses a 5-mm × 5-mm RHB VQFN32 package with 0.5-mm pitch and exposed thermal pad (EGP). Pin assignment follows TI's standardized RHB layout optimized for RF isolation and mixed-signal routing.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar wireless MCU applications.

Compared with CC2640R2FRGZR and nRF52833-QIAA-R, the CC2650F128RHBR uniquely balances multistandard RF capability, integrated power conversion, and autonomous sensor processing in a compact 5-mm VQFN - making it optimal for cost-sensitive, battery-operated IoT endpoints requiring protocol agility without external PMIC or sensor ASICs.

Availability

CC2650F128RHBR is available at Aetrix Electronics and suitable for smart home sensors, medical wearables, industrial remote controls, and lighting control systems requiring stable component supply across long-lifecycle production programs.

Supply support for CC2650F128RHBR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and wireless connectivity solutions for industrial, automotive, and consumer markets.

The CC2650F128RHBR belongs to the SimpleLink™ CC26xx wireless MCU product line, designed specifically for ultra-low-power, multistandard 2.4-GHz IoT applications where battery lifetime, RF coexistence, and software-defined protocol flexibility are critical.

FAQ

What wireless protocols does the CC2650F128RHBR support?

The CC2650F128RHBR supports Bluetooth Low Energy 4.2 and IEEE 802.15.4 PHY/MAC natively in ROM, enabling ZigBee®, 6LoWPAN, and RF4CE implementations. Its multistandard RF core allows field-upgradable protocol stacks without hardware changes. The CC2650F128RHBR does not support BLE 5.0 features like 2 Mbps or coded PHY, which require newer devices such as CC2640R2F.

What is the package type and pin count of the CC2650F128RHBR?

The CC2650F128RHBR uses a 5-mm × 5-mm RHB VQFN32 package with 32 terminals, including 15 configurable GPIOs, two RF I/O pins (RF_P/RF_N), dual crystal oscillator interfaces (X24M_P/N and X32K_Q1/Q2), and dedicated power domains (VDDS, VDDR, VDDR_RF). This package is pin-compatible with other CC26xx and CC13xx devices in the same footprint.

Does the CC2650F128RHBR include an integrated DC-DC converter?

Yes, the CC2650F128RHBR integrates a buck DC-DC converter that generates regulated 1.7–1.95 V supplies (VDDR and VDDR_RF) from the main 1.8–3.8 V VDDS input. This eliminates the need for external regulators in most battery-powered designs. The DCDC_SW pin connects to the external inductor, and DCOUPL requires a 1.27-V decoupling capacitor.

How many GPIOs are available on the CC2650F128RHBR?

The CC2650F128RHBR provides 15 general-purpose I/O pins (DIO_0 through DIO_14) in its RHB package. These support digital functions, analog sensing (ADC, comparators), capacitive touch, and peripheral interfaces (UART, I²C, SSI). All GPIOs are software-routable to any peripheral function, enhancing layout flexibility and reducing design iterations.

What is the operating temperature range for the CC2650F128RHBR?

The CC2650F128RHBR is rated for continuous operation from –40°C to +85°C ambient temperature, meeting industrial-grade reliability requirements. This range is validated across all electrical specifications including RF performance, ADC accuracy, and power consumption metrics, ensuring consistent behavior in uncontrolled environments like building automation or outdoor sensor deployments.