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Texas Instruments CC2650F128RSMR
- Part No.:
- CC2650F128RSMR
- Manufacturer:
- Texas Instruments
- Category:
- RF Transceiver ICs
- Package:
- 32-VFQFN Exposed Pad
- Datasheet:
-
CC2650F128RSMR.pdf
- Description:
- IC RF TXRX+MCU 802.15.4 32VQFN
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
CC2650F128RSMR from Texas Instruments is a multistandard wireless microcontroller integrating an ARM Cortex-M3 CPU (48 MHz), 128KB flash, 20KB ultralow-leakage SRAM, and dual-band RF transceiver supporting Bluetooth Low Energy 4.2 and IEEE 802.15.4 PHY/MAC. It features an autonomous ultralow-power sensor controller (16-bit, 2KB SRAM), integrated DC-DC converter, and operates from 1.8–3.8 V with 5.9 mA RX current. Used in compact battery-powered IoT nodes like proximity tags and electronic shelf labels.
For engineers reviewing the CC2650F128RSMR datasheet, CC2650F128RSMR pinout, CC2650F128RSMR application, or CC2650F128RSMR equivalent, key selection considerations include its 4-mm × 4-mm VQFN32 package with 10 GPIOs, single-ended RF interface, 24-MHz/32.768-kHz crystal support, and ROM-resident BLE/802.15.4 protocol stacks enabling rapid firmware development for space-constrained wireless sensor endpoints.
Technical Context
The CC2650F128RSMR implements a dual-core architecture: the main ARM Cortex-M3 handles application logic and protocol stack execution, while a dedicated ARM Cortex-M0 core runs the BLE/802.15.4 MAC and RF baseband processing. Its RF section delivers –97 dBm BLE sensitivity and +5 dBm programmable output power using a differential or single-ended 2.4-GHz interface compliant with FCC, ETSI, and ARIB regulations.
Power management leverages an integrated DC-DC converter and multiple low-power modes-standby at 1 µA (RTC + RAM retention) and shutdown at 100 nA-enabling multi-year operation on coin cells. The sensor controller executes analog/digital acquisition autonomously during system sleep, interfacing directly with the 12-bit ADC (200 ks/s, 8-channel MUX), comparators, and programmable current source without waking the main CPU.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M3 @ 48 MHz - enables real-time BLE/ZigBee stack execution and deterministic sensor control |
| Memory | 128KB flash + 20KB ultralow-leakage SRAM - sufficient for full BLE 4.2 stack plus custom application code and data logging |
| RF Performance | –97 dBm BLE RX sensitivity, +5 dBm TX output - achieves >100 dB link budget for robust indoor mesh networking |
| Power Consumption | 5.9 mA RX / 6.1 mA TX @ 0 dBm - minimizes battery drain in periodic advertising/scanning use cases |
| Operating Voltage | 1.8–3.8 V - supports direct connection to alkaline, Li-ion, or coin-cell batteries without external regulation |
| Sensor Controller | 16-bit engine with 2KB SRAM - autonomously samples ADC/comparators while main CPU remains in deep sleep |
| Package | VQFN32 (4 mm × 4 mm, 0.4-mm pitch) - fits high-density PCB layouts in wearables and compact sensors |
Pinout & Package
RoHS-compliant 4-mm × 4-mm VQFN32 package (RSM) with 0.4-mm pitch and exposed ground pad (EGP). Designed for minimal external components: requires only two crystals (24 MHz and 32.768 kHz), decoupling capacitors, and optional RF matching network.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RF_P / RF_N | RF differential I/O | Primary antenna interface; supports single-ended configuration via internal switch |
| X24M_P / X24M_N | High-frequency crystal oscillator | Connects to 24-MHz fundamental-mode crystal for system clock and RF timing |
| X32K_Q1 / X32K_Q2 | Low-frequency crystal oscillator | Drives 32.768-kHz crystal for RTC and low-power sleep timing |
| DIO_0–DIO_9 | Configurable GPIO | 10 general-purpose pins supporting UART, I²C, SPI, I²S, ADC inputs, and capacitive sensing |
| VDDS / VDDS2 | Main power supply | 1.8–3.8 V input for digital core and I/O banks; VDDS2 powers GPIOs independently |
| VDDR / VDDR_RF | Regulated 1.7–1.95 V supply | Output of internal DC-DC converter powering RF and digital domains; eliminates need for external LDO |
| DCDC_SW / DCOUPL | DC-DC switching node | Internal buck converter switch node and 1.27-V decoupling capacitor connection point |
| RESET_N | Active-low reset | Asynchronous reset input with no internal pull-up; requires external pull-up for reliable boot |
Key Features
| Feature | Design Value |
|---|---|
| ROM-based protocol stacks | BLE 4.2 and IEEE 802.15.4 MAC preloaded in ROM - saves 32+ KB flash and guarantees certified interoperability |
| Autonomous sensor controller | 16-bit RISC engine with 2KB SRAM - acquires sensor data and triggers events without CPU intervention, reducing average system current by >90% |
| Integrated DC-DC converter | On-chip buck regulator - eliminates external PMIC, reduces BOM count, and improves efficiency across 1.8–3.8 V input range |
| Multi-standard RF support | Single die supports BLE, ZigBee, 6LoWPAN, and RF4CE - enables field-upgradable protocol selection via firmware |
| Security modules | AES-128 accelerator + TRNG - hardware-accelerated encryption for secure OTA updates and device authentication |
Applications
| Proximity Tags | Electronic Shelf Labels |
|---|---|
Use Scenario: Small-form-factor Bluetooth beacons attached to retail items or assets for location tracking and NFC-like interaction. IC Role / Device Role / Timing Role: Wireless MCU providing BLE advertising, sensor-triggered broadcast, and ultra-low-power standby with RTC wake-up. Use Value: 10 GPIOs and 4-mm × 4-mm footprint enable integration into <100 mm² PCBs; 1 µA standby extends CR2032 battery life beyond 3 years. | Use Scenario: Battery-powered e-paper displays in supermarkets updating pricing and promotions via 2.4-GHz mesh networks. IC Role / Device Role / Timing Role: Multistandard node executing 802.15.4 mesh routing and BLE commissioning, synchronized via 32.768-kHz RTC. Use Value: Dual RF capability allows seamless migration between BLE provisioning and ZigBee-based backhaul; integrated DC-DC sustains operation down to 1.8 V as battery depletes. |
| Wireless Sensor Networks | Sports & Fitness Wearables |
Use Scenario: Distributed environmental monitoring nodes measuring temperature, humidity, and motion in industrial facilities. IC Role / Device Role / Timing Role: Edge-processing node running sensor controller firmware to filter raw ADC data before BLE transmission. Use Value: Autonomous sensor controller reduces active time per measurement cycle by 70%, achieving sub-10 µA average current in duty-cycled operation. | Use Scenario: Compact wrist-worn devices tracking heart rate, motion, and battery status using optical and inertial sensors. IC Role / Device Role / Timing Role: Central hub managing BLE HID profile, sensor fusion algorithms, and secure OTA firmware updates. Use Value: 128KB flash accommodates complex motion algorithms and BLE HID stack; AES-128 ensures encrypted health data transmission to smartphones. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar multistandard wireless MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CC2640R2FRGZR | BLE-only (no 802.15.4), 128KB flash, same RSM package and pinout | Limited to Bluetooth Low Energy 5.0; lacks ZigBee/6LoWPAN support | Select when BLE-only functionality suffices and protocol flexibility is unnecessary |
| nRF52833-QIAA-R | ARM Cortex-M4F, 512KB flash, 128KB RAM, 2.4-GHz multiprotocol (BLE/Thread/ZigBee) | Higher memory and compute headroom; requires external DC-DC for optimal efficiency | Choose for applications needing larger firmware, floating-point math, or Thread certification |
Compared with CC2650F128RSMR, CC2640R2FRGZR offers identical form factor and lower cost for pure BLE designs, while nRF52833-QIAA-R provides greater memory and processing headroom at the expense of higher power in deep-sleep modes and added BOM complexity.
Availability
CC2650F128RSMR is available at Aetrix Electronics and suitable for wireless sensor networks, electronic shelf labeling, and proximity tag applications requiring stable component supply and long-term industrial availability.
Supply support for CC2650F128RSMR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company delivering analog and embedded processing solutions, with leadership in low-power wireless connectivity and industrial-grade reliability.
The CC2650F128RSMR belongs to the SimpleLink CC26xx wireless MCU product line, designed specifically for battery-operated IoT endpoints requiring multistandard RF support, extreme energy efficiency, and integrated protocol stacks.
FAQ
What wireless protocols does the CC2650F128RSMR support?
The CC2650F128RSMR supports Bluetooth Low Energy 4.2 and IEEE 802.15.4 PHY/MAC layers in hardware, enabling ZigBee, 6LoWPAN, and RF4CE implementations. Protocol stacks are provided free from TI and execute from ROM or flash. It does not support Bluetooth Classic, Wi-Fi, or Sub-1 GHz bands. The CC2650F128RSMR's RF core is fixed to 2.4 GHz and cannot be reconfigured for other frequency bands.
Does the CC2650F128RSMR require external RF matching components?
Yes, the CC2650F128RSMR requires external RF matching components for optimal performance. Its RF_P and RF_N pins connect to a balun or matching network to interface with a 50-Ω antenna. TI provides reference designs (e.g., 4XS configuration) specifying discrete inductors/capacitors or integrated passive devices. Omitting matching degrades output power, sensitivity, and regulatory compliance - the CC2650F128RSMR itself contains no integrated balun or PA matching.
How many GPIOs are available on the CC2650F128RSMR package?
The CC2650F128RSMR in the 4-mm × 4-mm VQFN32 (RSM) package provides 10 GPIOs: DIO_0 through DIO_9. These support digital I/O, UART, I²C, SPI, ADC inputs, analog comparators, and capacitive sensing. Unlike larger packages (RHB/RGZ), the RSM variant does not expose all 31 possible GPIOs - pin count is physically constrained by the 32-pin layout and dedicated RF/clock/power functions.
Can the CC2650F128RSMR operate without the internal DC-DC converter?
Yes, the CC2650F128RSMR supports external regulator mode. Tie DCDC_SW to GND and connect VDDS_DCDC to VDDS. In this mode, VDDR and VDDR_RF must be supplied externally at 1.7–1.95 V, and VDDS must remain within 1.7–1.95 V. This configuration bypasses the internal buck converter but maintains full functionality - it is used when system-level power architecture already provides tightly regulated 1.8-V rails, avoiding switching noise coupling into sensitive RF sections.
What development tools are officially supported for the CC2650F128RSMR?
Texas Instruments officially supports Code Composer Studio (CCS) and IAR Embedded Workbench for ARM as IDEs, SmartRF Studio for RF configuration, Sensor Controller Studio for autonomous sensor firmware, and the CC2650 LaunchPad Development Kit (LAUNCHXL-CC2650) for hardware evaluation. TI's BLE-Stack and ZigBee SDKs are validated exclusively with these tools. Third-party IDEs like Keil MDK are community-supported but not officially qualified for CC2650F128RSMR production firmware.
CC2650F128RSMR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- SimpleLink™
- Package/Case:
- 32-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Type:
- TxRx + MCU
- RF Family/Standard:
- 802.15.4, Bluetooth
- Protocol:
- 6LoWPAN, Bluetooth v4.1, Zigbee®
- Modulation:
- DSSS, O-QPSK, GFSK
- Frequency:
- 2.4GHz
- Data Rate (Max):
- 1Mbps
- Power - Output:
- 5dBm
- Sensitivity:
- -100dBm
- Memory Size:
- 128kB Flash, 28kB SRAM
- Serial Interfaces:
- I2C, I2S, JTAG, SPI, UART
- GPIO:
- 10
- Voltage - Supply:
- 1.8V ~ 3.8V
- Current - Receiving:
- 5.9mA ~ 6.1mA
- Current - Transmitting:
- 6.1mA ~ 9.1mA
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 32-VQFN (4x4)
CC2650F128RSMR FAQ
1.How can I place an order for CC2650F128RSMR through Aetrix?
Please submit a Request for Quotation (RFQ) for CC2650F128RSMR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CC2650F128RSMR reliable?
The price and inventory of CC2650F128RSMR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CC2650F128RSMR is usually 5 days.
3.What payment methods are accepted for CC2650F128RSMR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CC2650F128RSMR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CC2650F128RSMR?
CC2650F128RSMR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CC2650F128RSMR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CC2650F128RSMR?
For technical support, including CC2650F128RSMR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CC2650F128RSMR requirements.
6.How does Aetrix verify that CC2650F128RSMR is sourced from the original manufacturer or authorized distributors?
All CC2650F128RSMR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CC2650F128RSMR meets industry standards.
7.What is the process for return or replacement of CC2650F128RSMR?
All CC2650F128RSMR units undergo pre-shipment inspection (PSI). If there is an issue with CC2650F128RSMR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CC2650F128RSMR part is unused and in its original packaging.
Return procedure for CC2650F128RSMR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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