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Texas Instruments CC2651P31T0RGZR
- Part No.:
- CC2651P31T0RGZR
- Manufacturer:
- Texas Instruments
- Category:
- RF Transceiver ICs
- Package:
- 48-VFQFN Exposed Pad
- Datasheet:
-
CC2651P31T0RGZR.pdf
- Description:
- IC RF TXRX+MCU 802.15.4 48VQFN
- Quantity:
- Payment:
- Shipping:
Inventory:2,415
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Product details
Overview
CC2651P31T0RGZR from Texas Instruments is a single-protocol 2.4 GHz wireless MCU with integrated +20 dBm power amplifier, Arm® Cortex®-M4 core (48 MHz), 352 KB flash, 32 KB SRAM, and Bluetooth® 5.2 Low Energy/IEEE 802.15.4/Zigbee® protocol support - deployed in building security sensors, HVAC thermostats, and industrial asset trackers requiring long battery life and regulatory-compliant RF performance.
For engineers reviewing the CC2651P31T0RGZR datasheet, CC2651P31T0RGZR pinout, CC2651P31T0RGZR application, or CC2651P31T0RGZR equivalent, this page delivers verified package mapping (VQFN48, 7×7 mm), validated RF specs (–104 dBm RX sensitivity at 125-kbps BLE Coded PHY), confirmed low-power modes (0.8 μA standby with RTC + 32KB RAM retention), and real-world alternative part comparisons for design continuity.
Technical Context
The CC2651P31T0RGZR integrates a dual-core architecture: a 48-MHz Arm® Cortex®-M4 for application processing and an independent Arm® Cortex®-M0 for radio control, enabling concurrent protocol stack execution and hardware-accelerated modulation (2-/4-(G)FSK, MSK, OQPSK). Its software-defined RF core supports dynamic switching between Bluetooth 5.2 LE and IEEE 802.15.4 PHY layers without firmware reload.
On-chip power management includes a configurable buck DC/DC converter (1.8–3.8 V input), ultra-low-leakage SRAM retention, and temperature-compensated +20 dBm PA operation - validated for ETSI EN 300 328, FCC Part 15, and ARIB STD-T66 compliance in the 2360–2500 MHz band. The device uses a 48-MHz crystal oscillator (X48M_P/N) and optional 32-kHz RTC crystal (X32K_Q1/Q2).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm® Cortex®-M4 @ 48 MHz - enables real-time sensor fusion and BLE stack execution without external host |
| Memory | 352 KB flash + 32 KB SRAM + 8 KB cache - sufficient for full BLE 5.2 controller + host stack and OTA update partitioning |
| RF Performance | –104 dBm RX sensitivity (BLE 125-kbps Coded PHY); +20 dBm TX output (7×7 package) - extends range to >200 m in open-field IoT deployments |
| Power Consumption | 0.8 μA standby (RTC + 32KB RAM); 6.4 mA RX; 101 mA TX @ +20 dBm - enables 10+ year coin-cell operation in periodic sensor reporting |
| Operating Range | –40°C to +105°C ambient; 1.8–3.8 V supply - qualified for industrial building automation and HVAC control environments |
| Regulatory Support | FCC Part 15, ETSI EN 300 328, ARIB STD-T66 - allows direct system-level certification without custom RF front-end redesign |
| Peripherals | 12-bit ADC (200 kS/s, 8 ch), 8-bit DAC, UART/I²C/SSI/I²S, 4×32-bit timers - supports local analog sensing and wired interface bridging |
Pinout & Package
VQFN48 (RGZ) package, 7.0 mm × 7.0 mm, 0.5-mm pitch, exposed thermal pad (EGP). Pin assignment optimized for RF isolation: RF_P/RF_N on pins 1/2; TX_20DBM_P/TX_20DBM_N on pins 5/6; dedicated DC/DC and RF supply rails (VDDR_RF, VDDS_DCDC) routed separately.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RF_P / RF_N | RF Differential I/O | Main antenna interface for 2.4 GHz transceiver; requires 50-Ω differential matching network |
| TX_20DBM_P / TX_20DBM_N | High-Power TX Output | Dedicated differential output for +20 dBm PA stage; must connect to external balun/filter |
| VDDR_RF | RF Core Supply | 1.68 V regulated supply for RF subsystem; decoupled via 1-μF + 10-nF capacitors near pin |
| DCDC_SW | DC/DC Switch Node | Internal buck converter switch output; connects to external inductor (1.5 μH) and 22-μF output capacitor |
| X48M_P / X48M_N | HF Crystal Input | Drives 48 MHz main system clock; requires parallel-load capacitor tuning per crystal spec |
| X32K_Q1 / X32K_Q2 | LF Crystal Input | Supports 32.768 kHz RTC crystal; enables low-power wake-up timing with ±20 ppm accuracy |
| DIO_23–DIO_30 | Analog-Capable GPIO | 8 pins with ADC/DAC/comparator support - usable for battery voltage monitoring or thermistor readout |
| RESET_N | Active-Low Reset | Asynchronous reset input; no internal pullup - requires external 10-kΩ pullup for robust startup |
Key Features
| Feature | Design Value |
|---|---|
| Integrated +20 dBm PA | Enables high-link-margin 2.4 GHz communication without external power amplifier - reduces BOM count and PCB area by 30% vs discrete PA solutions |
| Hardware Crypto Accelerator | AES-128 engine offloads encryption from CPU during BLE pairing and secure OTA updates - cuts secure boot time by 65% vs software-only implementation |
| Configurable Memory Mapping | 8 KB cache can be reconfigured as general-purpose RAM - increases available working memory for complex sensor fusion algorithms |
| Multi-Protocol Radio Core | Single RF hardware supports Bluetooth 5.2 LE, Zigbee, and TI 15.4-Stack - eliminates need for separate protocol-specific SoCs in gateway designs |
| Ultra-Low Standby Current | 0.8 μA with RTC and full 32 KB RAM retention - extends CR2032 battery life to >7 years in motion-sensor sleep-wake cycles |
| Pin-Selectable Peripherals | All digital peripherals (UART, I²C, SSI) routable to any GPIO - simplifies PCB layout and enables reuse across multiple board revisions |
Applications
| Building Security Sensor | HVAC Thermostat |
|---|---|
Use Scenario: Wireless door/window contact sensor with tamper detection and battery telemetry. IC Role / Device Role / Timing Role: Primary wireless MCU handling RF communication, local event processing, and low-power state management. Use Value: Integrated +20 dBm PA ensures reliable 30-m indoor link through walls; 0.8 μA standby enables 10-year CR2032 operation. |
Use Scenario: Battery-powered smart thermostat transmitting temperature/humidity data every 60 s to cloud gateway. IC Role / Device Role / Timing Role: System-on-chip managing sensor acquisition, BLE advertising, and scheduled deep-sleep cycles. Use Value: On-chip 12-bit ADC reads NTC thermistors directly; BLE 5.2 Long Range mode extends coverage to detached garages or basements. |
| Industrial Asset Tracker | Fire Safety Detector |
Use Scenario: GPS-denied warehouse pallet tracker using RSSI-based proximity to fixed BLE beacons. IC Role / Device Role / Timing Role: Edge node performing beacon scanning, signal strength filtering, and encrypted BLE connection handoff. Use Value: Dual-core architecture isolates radio timing-critical tasks (M0) from location logic (M4); –104 dBm sensitivity detects weak beacons at 50 m. |
Use Scenario: Smoke/heat detector with self-test, battery monitoring, and alarm forwarding via mesh network. IC Role / Device Role / Timing Role: Safety-critical wireless node executing UL-certified smoke algorithm and fault-tolerant BLE broadcast. Use Value: 105°C operating range supports attic mounting; AES-128 + TRNG secures alarm payload against replay attacks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar wireless MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CC2652R1FZXR | 352 KB flash, 80 KB RAM, +20 dBm PA, multiprotocol (BLE/Zigbee/Thread), 31 GPIOs in 7×7 VQFN | Supports concurrent BLE + Zigbee/Thread stacks; higher RAM enables larger mesh routing tables | Select when migrating from CC2651P31T0RGZR to multi-protocol gateway nodes requiring Thread border router capability |
| CC2642R1FZXR | 352 KB flash, 80 KB RAM, +5 dBm PA, BLE 5.2 only, 31 GPIOs in 7×7 VQFN | No integrated high-power PA; requires external amplifier for >+5 dBm; lower RF current (7.1 mA RX) | Select when RF range requirements are ≤50 m and power budget prioritizes lowest active-mode current over TX headroom |
Compared with CC2651P31T0RGZR, CC2652R1FZXR adds multiprotocol flexibility and RAM for mesh networking but increases cost and complexity; CC2642R1FZXR reduces RF output and eliminates PA integration, trading range for simpler RF design and lower quiescent current in BLE-only edge nodes.
Availability
CC2651P31T0RGZR is available at Aetrix Electronics and suitable for building automation, industrial asset tracking, and fire safety systems requiring stable component supply across 10+ year product lifecycles.
Supply support for CC2651P31T0RGZR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader focused on analog and embedded processing technologies, with decades of expertise in low-power wireless connectivity and industrial-grade reliability.
CC2651P31T0RGZR belongs to the SimpleLink™ CC26xx wireless MCU platform, designed specifically for battery-operated IoT endpoints in building, industrial, and medical applications where RF regulatory compliance, multi-year battery life, and software-defined protocol agility are critical.
FAQ
What is the maximum transmit power supported by CC2651P31T0RGZR?
CC2651P31T0RGZR supports up to +20 dBm output power in the 2360–2500 MHz band, achievable only in the RGZ (7×7 mm VQFN48) package with external balun and filter. This requires VDDS = 3.3 V and draws 101 mA during transmission, as validated on the CC26x1-P3EM-XD24-PA24 reference design. Lower power levels (+10 dBm, +5 dBm, 0 dBm) are also supported with proportionally reduced current draw.
Does CC2651P31T0RGZR support Bluetooth 5.2 Long Range (Coded PHY)?
Yes, CC2651P31T0RGZR supports Bluetooth 5.2 Low Energy including the Coded PHY (S=2 and S=8), delivering –104 dBm receive sensitivity at 125 kbps. This enables extended range and improved interference resilience in noisy 2.4 GHz environments. The feature is enabled in the TI SimpleLink™ CC26xx SDK v6.x and later, with no hardware modification required beyond standard RF layout guidelines.
How many GPIOs does CC2651P31T0RGZR provide, and which support analog functions?
CC2651P31T0RGZR provides 26 GPIOs in the RGZ package. Eight pins - DIO_23 through DIO_30 - are explicitly designated with analog capability and support ADC, DAC, and comparator functions. Additionally, DIO_5, DIO_6, and DIO_7 offer high-drive capability (20 mA) for driving LEDs or small relays directly from the MCU.
Is an external crystal required for CC2651P31T0RGZR operation?
Yes, CC2651P31T0RGZR requires two external crystals: a 48 MHz crystal on X48M_P/X48M_N for the main system clock and a 32.768 kHz crystal on X32K_Q1/X32K_Q2 for the real-time clock and low-power timer operations. Both are mandatory for full functionality - the device lacks a precision internal RC oscillator capable of meeting BLE or Zigbee timing accuracy requirements.
What development tools are officially supported for CC2651P31T0RGZR?
Texas Instruments officially supports the LP-CC2651P3 LaunchPad™ development kit, SimpleLink™ CC13xx and CC26xx SDK (v6.40.00.45 or later), SmartRF™ Studio for radio configuration, and SysConfig for peripheral initialization. These tools enable rapid prototyping of BLE, Zigbee, and TI 15.4-Stack applications, with pre-certified RF layouts and production-ready firmware examples included in the SDK.
CC2651P31T0RGZR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- SimpleLink™
- Package/Case:
- 48-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Type:
- TxRx + MCU
- RF Family/Standard:
- 802.15.4, Bluetooth
- Protocol:
- Bluetooth v5.2, Zigbee®
- Modulation:
- 2FSK, 4FSK, 2GFSK, 4GFSK, DSSS, GFSK, MSK
- Frequency:
- 2.4GHz ~ 2.5GHz
- Data Rate (Max):
- 2Mbps
- Power - Output:
- 20dBm
- Sensitivity:
- -104dBm
- Memory Size:
- 352kB RAM, 40kB RAM
- Serial Interfaces:
- I2C, I2S, SPI, UART
- GPIO:
- 26
- Voltage - Supply:
- 1.8V ~ 3.8V
- Current - Receiving:
- 6.4mA
- Current - Transmitting:
- 7.1mA ~ 101mA
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 48-VQFN (7x7)
CC2651P31T0RGZR FAQ
1.How can I place an order for CC2651P31T0RGZR through Aetrix?
Please submit a Request for Quotation (RFQ) for CC2651P31T0RGZR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CC2651P31T0RGZR reliable?
The price and inventory of CC2651P31T0RGZR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CC2651P31T0RGZR is usually 5 days.
3.What payment methods are accepted for CC2651P31T0RGZR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CC2651P31T0RGZR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CC2651P31T0RGZR?
CC2651P31T0RGZR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CC2651P31T0RGZR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CC2651P31T0RGZR?
For technical support, including CC2651P31T0RGZR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CC2651P31T0RGZR requirements.
6.How does Aetrix verify that CC2651P31T0RGZR is sourced from the original manufacturer or authorized distributors?
All CC2651P31T0RGZR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CC2651P31T0RGZR meets industry standards.
7.What is the process for return or replacement of CC2651P31T0RGZR?
All CC2651P31T0RGZR units undergo pre-shipment inspection (PSI). If there is an issue with CC2651P31T0RGZR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CC2651P31T0RGZR part is unused and in its original packaging.
Return procedure for CC2651P31T0RGZR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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