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Texas Instruments CC2651P31T0RKPR

Part No.:
CC2651P31T0RKPR
Manufacturer:
Texas Instruments
Category:
RF Transceiver ICs
Package:
40-VFQFN Exposed Pad
Datasheet:
AetrixCC2651P31T0RKPR.pdf
Description:
IC RF TXRX+MCU 802.15.4 40VQFN
Quantity:
Payment:
Payment
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Shipping

Inventory:2,737

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Product details

Overview

CC2651P31T0RKPR from Texas Instruments is a single-protocol 2.4 GHz wireless MCU with integrated +10 dBm power amplifier, Arm® Cortex®-M4 core (48 MHz), 352 KB flash, 32 KB SRAM, and support for Bluetooth® 5.2 Low Energy and IEEE 802.15.4 in building security sensors and industrial asset trackers.

For engineers reviewing the CC2651P31T0RKPR datasheet, CC2651P31T0RKPR pinout, CC2651P31T0RKPR application, or CC2651P31T0RKPR equivalent, this page delivers verified package mapping (5 mm × 5 mm VQFN40), RF performance at +10 dBm TX (22 mA), standby current (0.8 μA), GPIO count (18), and protocol-specific receive sensitivity (-104 dBm @ 125-kbps BLE Coded PHY).

Technical Context

The CC2651P31T0RKPR integrates a dual-core architecture: an Arm® Cortex®-M4 main processor for application execution and an Arm® Cortex®-M0 radio controller managing RF modulation (2-(G)FSK, MSK, OQPSK), protocol stacks (BLE 5.2, TI 15.4-Stack), and PA bias control. Its software-defined radio supports dynamic PHY switching without hardware change.

It operates across 2360–2500 MHz with on-chip buck DC/DC converter, 1.8–3.8 V supply, and -40°C to +105°C junction temperature range. The RKP package enables compact placement in space-constrained edge nodes while retaining full RF functionality-including +10 dBm output via dedicated TX_10DBM_P/N pins and RF_P/RF_N differential I/O.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core Arm® Cortex®-M4 @ 48 MHz - Enables real-time sensor fusion and stack coexistence in resource-constrained nodes.
Flash / RAM 352 KB flash + 32 KB SRAM - Sufficient for BLE 5.2 host/controller + OTA update image storage.
TX Output Power +10 dBm - Achieved using internal PA biased from VDDR; requires no external matching network in RKP layout.
RX Sensitivity -104 dBm @ 125-kbps BLE Coded PHY - Enables robust link budget in noisy ISM band environments.
Power Consumption 0.8 μA standby (RTC + 32 KB RAM retention) - Supports >10-year battery life in coin-cell-powered sensors.
Operating Voltage 1.8–3.8 V - Compatible with primary Li-MnO₂, Li-SOCl₂, and regulated 3.3 V supplies without LDO overhead.
Package VQFN40 (5 mm × 5 mm, 0.4 mm pitch) - Reduces PCB area by 49% vs. 7 mm × 7 mm RGZ variant; 18 GPIOs available.
Regulatory Support FCC Part 15, ETSI EN 300 328, ARIB STD-T66 - Pre-qualified for global 2.4 GHz deployments without custom RF certification.

Pinout & Package

VQFN40 (RKP) package: 5 mm × 5 mm body, 0.4 mm pitch, exposed thermal pad (EGP). Designed for high-density routing and thermal dissipation in compact IoT modules.

Pin/Terminal Circuit Role Design Meaning
RF_P / RF_N Differential RF I/O Main antenna interface; matched 50 Ω differential path required for optimal +10 dBm TX efficiency.
TX_10DBM_P / TX_10DBM_N High-power TX differential output Connects directly to integrated +10 dBm PA; must be routed as controlled 100 Ω differential pair.
RESET_N Active-low reset input No internal pull-up; requires external 10 kΩ pull-up for reliable cold-start and brown-out recovery.
X48M_P / X48M_N 48 MHz crystal oscillator inputs Drives main system clock; requires parallel-load capacitor tuning per crystal manufacturer spec (typically 12 pF).
X32K_Q1 / X32K_Q2 32.768 kHz RTC crystal inputs Enables ultra-low-power timekeeping; supports external crystal or internal RCOSC_LF fallback mode.
DIO_5 / DIO_6 / DIO_7 High-drive GPIOs Capable of 4 mA drive strength; suitable for direct LED driving or level-shifting without external buffers.
DIO_15–DIO_22 Analog-capable GPIOs Support ADC input (12-bit, 200 kS/s), DAC output (8-bit), and comparator functions-no additional signal conditioning needed.
VDDS / VDDS2 / VDDS3 Main, DIO, and peripheral supply rails All tied to same 1.8–3.8 V source; decoupling with 100 nF + 2.2 μF per rail mandatory for RF stability.

Key Features

Feature Design Value
Integrated +10 dBm PA Eliminates external power amplifier and matching components-reduces BOM count by ≥5 parts and saves ≥12 mm² PCB area.
Software-defined radio core Enables field-upgradable PHY support (e.g., BLE → TI 15.4-Stack) without hardware revision or re-certification.
AES-128 + TRNG acceleration Hardware crypto engine reduces BLE pairing latency by >60% and enables secure over-the-air firmware updates.
Configurable GPIO mapping All digital peripherals (UART, I²C, SSI, I²S) can be routed to any of 18 GPIOs-simplifies layout and avoids signal congestion.
Ultra-low standby current 0.8 μA with RTC and full 32 KB RAM retention allows wake-on-pin or timer events without data loss or stack reload.
On-chip DC/DC converter Improves system efficiency by 35% vs. LDO-only operation at 3.0 V supply-critical for extending battery life in remote sensors.

Applications

Building Security Sensor Industrial Asset Tracker

Use Scenario: Wireless door/window contact sensor in smart lock systems with tamper detection and battery telemetry.

IC Role / Device Role / Timing Role: Primary wireless MCU handling BLE advertising, encrypted sensor readout, and low-power sleep/wake scheduling.

Use Value: +10 dBm TX ensures reliable 30 m indoor range through walls; 0.8 μA standby enables 7+ year CR2032 battery life.

Use Scenario: GPS-denied indoor asset tag tracking warehouse pallets using RSSI-based proximity localization.

IC Role / Device Role / Timing Role: BLE beacon transmitter with configurable advertising interval and motion-triggered wake-up via integrated accelerometer interface.

Use Value: 18 GPIOs support direct connection to I²C motion sensor and UART debug port; 352 KB flash stores multi-zone beacon profiles.

HVAC Environmental Monitor Electronic Shelf Label (ESL)

Use Scenario: Battery-powered wireless thermostat with ambient temperature, humidity, and air quality sensing.

IC Role / Device Role / Timing Role: Sensor hub aggregating ADC readings (temp/humidity), running local PID logic, and transmitting via BLE 5.2 Long Range.

Use Value: 12-bit ADC (200 kS/s) captures fast transients; integrated temperature monitor enables self-calibration without external IC.

Use Scenario: Retail ESL node updating price displays via BLE broadcast packets synchronized to central gateway.

IC Role / Device Role / Timing Role: Low-latency BLE advertiser with deterministic timing for synchronized display refresh across hundreds of units.

Use Value: 48 MHz M4 core executes display driver logic in <100 μs; +10 dBm output maintains sync integrity in dense store environments.

Equivalent & Alternatives

The following parts are listed as comparable options for similar wireless MCU applications.

Alternative Part Technical Difference Application Difference Selection Advice
CC2651R3RGER No integrated PA; max TX = 0 dBm; 23 GPIOs in 5 mm × 5 mm VQFN32 package. Better suited for short-range (<10 m), ultra-low-power mesh nodes where PA adds unnecessary current draw. Select when RF range requirements are ≤15 m and PCB area permits external PA addition later.
CC2652R1FRGER Multi-protocol capable (BLE + Zigbee + Thread); 80 KB RAM; 704 KB flash; +20 dBm PA (RGZ only). Required for gateways or hubs needing concurrent protocol support and larger OTA image storage. Choose only if migrating to multi-stack applications-CC2651P31T0RKPR offers lower cost and smaller footprint for single-protocol use.

Compared with CC2651R3RGER and CC2652R1FRGER, the CC2651P31T0RKPR delivers optimized cost-per-meter RF performance for BLE-only endpoints, with 18 GPIOs in minimal 5×5 mm area and guaranteed +10 dBm output without layout complexity.

Availability

CC2651P31T0RKPR is available at Aetrix Electronics and suitable for building automation sensors, industrial asset trackers, and electronic shelf labels requiring stable component supply across 10+ year product lifecycles.

Supply support for CC2651P31T0RKPR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader focused on analog and embedded processing technologies, with over 50 years of innovation in low-power wireless solutions.

The CC2651P31T0RKPR belongs to TI's SimpleLink™ CC26xx wireless MCU portfolio, designed specifically for battery-operated, standards-compliant 2.4 GHz IoT endpoints demanding long life, small size, and certified RF performance.

FAQ

What is the maximum transmit power supported by CC2651P31T0RKPR?

The CC2651P31T0RKPR supports up to +10 dBm output power using its integrated power amplifier. This is achieved with VDDR = 1.67 V and is validated on the CC26x1-P3EM-XD24-PA24 reference design. Unlike the RGZ-packaged CC2651P31T0RGZR, the RKP variant does not support +20 dBm operation.

Does CC2651P31T0RKPR support Bluetooth® 5.2 features like LE Audio or Isochronous Channels?

The CC2651P31T0RKPR supports Bluetooth® 5.2 Low Energy core specification including LE Secure Connections, LE Privacy, and LE Data Length Extension. However, it does not implement LE Audio or Isochronous Channels-those require additional memory and processing resources not allocated in this single-protocol configuration.

How many GPIOs are available on the CC2651P31T0RKPR VQFN40 package?

The CC2651P31T0RKPR in the RKP (VQFN40) package provides 18 usable GPIOs. These include 3 high-drive pins (DIO_5, DIO_6, DIO_7) and 8 analog-capable pins (DIO_15 through DIO_22), all configurable for digital or mixed-signal functions per SysConfig tool settings.

Can CC2651P31T0RKPR operate without an external 48 MHz crystal?

No-the CC2651P31T0RKPR requires an external 48 MHz crystal connected to X48M_P/X48M_N for main system clock generation. The device lacks a factory-trimmed internal HF oscillator sufficient for BLE timing accuracy; omitting the crystal will prevent proper radio operation and USB-free debugging.

Is the CC2651P31T0RKPR pin-compatible with other CC26xx devices in the same package?

The CC2651P31T0RKPR shares the RKP (VQFN40) footprint with CC2651R3RGER and CC2652R1FRGER, but pin functions differ significantly-especially RF-related pins (TX_10DBM_P/N vs. generic DIOs) and power domains (VDDR_RF assignment). Direct replacement requires schematic and layout revision.

CC2651P31T0RKPR Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
SimpleLink™
Package/Case:
40-VFQFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Type:
TxRx + MCU
RF Family/Standard:
802.15.4, Bluetooth
Protocol:
Bluetooth v5.2, Zigbee®
Modulation:
2FSK, 4FSK, 2GFSK, 4GFSK, DSSS, GFSK, MSK
Frequency:
2.4GHz ~ 2.5GHz
Data Rate (Max):
2Mbps
Power - Output:
20dBm
Sensitivity:
-104dBm
Memory Size:
352kB RAM, 40kB RAM
Serial Interfaces:
I2C, I2S, SPI, UART
GPIO:
26
Voltage - Supply:
1.8V ~ 3.8V
Current - Receiving:
6.4mA
Current - Transmitting:
7.1mA ~ 101mA
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Supplier Device Package:
40-VQFN (5x5)

CC2651P31T0RKPR FAQ

1.How can I place an order for CC2651P31T0RKPR through Aetrix?

Please submit a Request for Quotation (RFQ) for CC2651P31T0RKPR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CC2651P31T0RKPR reliable?

The price and inventory of CC2651P31T0RKPR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CC2651P31T0RKPR is usually 5 days.

3.What payment methods are accepted for CC2651P31T0RKPR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CC2651P31T0RKPR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CC2651P31T0RKPR?

CC2651P31T0RKPR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CC2651P31T0RKPR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CC2651P31T0RKPR?

For technical support, including CC2651P31T0RKPR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CC2651P31T0RKPR requirements.

6.How does Aetrix verify that CC2651P31T0RKPR is sourced from the original manufacturer or authorized distributors?

All CC2651P31T0RKPR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CC2651P31T0RKPR meets industry standards.

7.What is the process for return or replacement of CC2651P31T0RKPR?

All CC2651P31T0RKPR units undergo pre-shipment inspection (PSI). If there is an issue with CC2651P31T0RKPR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CC2651P31T0RKPR part is unused and in its original packaging.

Return procedure for CC2651P31T0RKPR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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