Texas Instruments CC2652R74T0RGZR
- Part No.:
- CC2652R74T0RGZR
- Manufacturer:
- Texas Instruments
- Category:
- RF Transceiver ICs
- Package:
- 48-VFQFN Exposed Pad
- Datasheet:
-
CC2652R74T0RGZR.pdf
- Description:
- IC RF TXRX+MCU 802.15.4 48VQFN
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CC2652R74T0RGZR from Texas Instruments is a multiprotocol 2.4 GHz wireless MCU featuring a 48-MHz Arm® Cortex®-M4F processor, 704KB flash, 144KB ultra-low leakage SRAM with parity, -104 dBm Bluetooth® 5.2 LE receive sensitivity at 125-kbps, and +5 dBm TX output. It enables concurrent Thread/Zigbee®/Matter/BLE operation in building automation gateways and smart sensors.
For engineers reviewing the CC2652R74T0RGZR datasheet, CC2652R74T0RGZR pinout, CC2652R74T0RGZR application, or CC2652R74T0RGZR equivalent, key selection criteria include its 31 GPIOs in VQFN48, dynamic multiprotocol manager (DMM), autonomous sensor controller, 0.9 μA standby current with RTC + full RAM retention, and integrated AES-256/SHA-512/TRNG security accelerators.
Technical Context
The CC2652R74T0RGZR integrates dual CPU cores: an Arm® Cortex®-M4F main processor for protocol stack execution and application logic, and a dedicated Arm® Cortex®-M0 radio core handling PHY layer modulation (2-/4-(G)FSK, MSK, OQPSK) and runtime frequency switching. Its RF front-end supports 2360–2500 MHz operation with temperature-compensated +5 dBm output.
Power management combines on-chip buck DC/DC conversion (1.8–3.8 V), external regulator mode (1.7–1.95 V), and ultra-low leakage SRAM with parity for FIT-rated reliability. The autonomous sensor controller runs at up to 24 MHz with 4KB SRAM, enabling sub-μA wake-up for ADC sampling and capacitive touch without waking the main CPU.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm® Cortex®-M4F @ 48 MHz - delivers deterministic real-time control and floating-point math for complex BLE/Matter stack processing |
| Memory | 704KB flash + 144KB parity-protected SRAM - supports large concurrent protocol stacks and firmware OTA updates without external memory |
| Wireless Performance | -104 dBm RX sensitivity (BLE 125-kbps Coded), +5 dBm TX - achieves robust link budget in dense IoT environments with minimal external RF components |
| Power Consumption | 0.9 μA standby (RTC + 144KB RAM retention) - enables 10+ year battery life in coin-cell-powered sensors |
| Security | AES-256, SHA-512, ECC/RSA hardware accelerators + TRNG - meets Matter certification requirements for secure device onboarding and encrypted communication |
| Operating Range | -40°C to +105°C junction temperature - qualified for industrial-grade deployment in HVAC controllers and fire safety systems |
| ADC | 12-bit, 200 kSamples/s, 8-channel - enables high-fidelity environmental sensing (temperature, humidity, CO₂) with single-chip integration |
Pinout & Package
VQFN48 (RGZ) package, 7.0 mm × 7.0 mm, 0.5-mm pitch, exposed thermal pad (EGP). Supports 31 configurable GPIOs with mixed-signal capability, JTAG debug interface, dual crystal oscillator inputs (32 kHz and 48 MHz), and dedicated RF differential ports (RF_P/RF_N).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RF_P / RF_N | Differential RF I/O | Direct connection to balun or matching network; requires controlled 50-Ω differential impedance routing |
| DIO_23–DIO_30 | Analog-capable GPIO | Support ADC input, DAC output, comparator, or current source functions without external signal conditioning |
| DIO_5–DIO_7, DIO_16–DIO_17 | High-drive GPIO | Capable of driving LEDs, relays, or level-shifted interfaces directly-reduces BOM count |
| X48M_P / X48M_N | 48-MHz crystal oscillator | Provides system clock for M4F core and RF timing; requires ±20 ppm stability for BLE 5.2 compliance |
| X32K_Q1 / X32K_Q2 | 32.768-kHz crystal oscillator | Feeds RTC and low-power timer; enables precise timekeeping during 0.9 μA standby mode |
| RESET_N | Active-low reset input | No internal pullup-requires external 10-kΩ pullup for reliable power-on reset sequencing |
| DCDC_SW / VDDS_DCDC | Integrated buck converter switch node | Tie DCDC_SW to GND for external regulator mode; enables 1.7–1.95 V operation in ultra-low voltage systems |
Key Features
| Feature | Design Value |
|---|---|
| Dynamic Multiprotocol Manager (DMM) | Enables runtime switching between BLE, Zigbee®, Thread, and Matter on a single radio-eliminates need for multiple radios in gateway designs |
| Autonomous Sensor Controller | Runs independent firmware at 2 MHz consuming only 29.2 μA-enables continuous 1-Hz environmental monitoring while main CPU remains in deep sleep |
| On-chip DC/DC converter | Boosts efficiency to >85% across 1.8–3.8 V input range-reduces heat generation and extends battery life vs. LDO-only solutions |
| SRAM parity protection | Hardware-enforced error detection/correction on all 144KB retention RAM-meets 10–15 year field reliability targets for building infrastructure |
| Programmable digital peripherals | All 31 GPIOs support UART, SSI, I²C, I²S, or timer capture-allows flexible board layout without fixed peripheral pin constraints |
Applications
| Smart Building Gateway | Wireless Fire Safety Sensor |
|---|---|
Use Scenario: Central hub aggregating BLE, Zigbee®, and Matter devices across HVAC, lighting, and security subsystems. IC Role / Device Role / Timing Role: Wireless MCU executing concurrent protocol stacks, managing OTA updates, and synchronizing time-critical sensor reporting via RTC. Use Value: Single-chip solution reduces bill-of-materials cost by 35% versus discrete MCU + transceiver architectures while supporting future-proof Matter certification. | Use Scenario: Battery-powered smoke/heat detector transmitting alerts every 60 seconds with 10-year coin-cell lifetime. IC Role / Device Role / Timing Role: Ultra-low-power wireless node using sensor controller for periodic ADC sampling and M4F core for BLE advertising and encryption. Use Value: 0.9 μA standby current with full RAM retention enables decade-long operation without maintenance-critical for life-safety compliance. |
| Industrial Asset Tracker | Medical Wearable Monitor |
Use Scenario: Ruggedized tag tracking pallets in warehouse environments with intermittent GPS-assisted location reporting. IC Role / Device Role / Timing Role: Dual-core processor running proprietary FSK protocol for long-range telemetry and BLE for local commissioning/debugging. Use Value: +5 dBm TX output with -104 dBm sensitivity provides 120 m indoor range-reducing infrastructure gateway density by 40%. | Use Scenario: Clinical-grade wearable measuring heart rate, skin temperature, and motion for remote patient monitoring. IC Role / Device Role / Timing Role: Secure sensor fusion hub performing on-device ECG preprocessing, AES-256 encryption, and Matter-over-BLE transmission. Use Value: Integrated cryptographic accelerators cut encryption latency by 92% vs. software-only implementations-ensuring real-time data integrity. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar wireless MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CC2652R74T0RGER | VQFN32 package (5 mm × 5 mm), 28 GPIOs, 352KB flash - smaller footprint but reduced memory and I/O count | Suitable for space-constrained end nodes (e.g., door sensors) where protocol concurrency is limited to BLE + one other stack | Select when PCB area is critical and full 704KB flash or 31 GPIOs are unnecessary |
| CC2652RB74T0RGZR | Same RGZ package and pinout, but 352KB flash and no ROM-based TI 15.4-stack - lower cost, reduced protocol flexibility | Targeted at BLE-only or Zigbee®-only deployments where Matter/Thread concurrency is not required | Choose for cost-sensitive volume production where multi-protocol capability is not needed |
Compared with CC2652R74T0RGZR, the CC2652R74T0RGER trades flash capacity and GPIO count for compactness, while the CC2652RB74T0RGZR sacrifices protocol breadth and ROM-resident stacks to reduce unit cost-both retain identical RF performance and power profiles.
Availability
CC2652R74T0RGZR is available at Aetrix Electronics and suitable for building automation gateways, industrial asset trackers, medical wearables, fire safety sensors, and retail ESL systems requiring stable component supply across 10+ year product lifecycles.
Supply support for CC2652R74T0RGZR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader delivering analog and embedded processing solutions with emphasis on energy efficiency, reliability, and long-term product support.
The CC2652R74T0RGZR belongs to the SimpleLink™ multiprotocol wireless MCU platform, designed specifically for secure, low-power, multi-standard IoT edge nodes in building infrastructure, industrial automation, and healthcare applications.
FAQ
What wireless protocols does the CC2652R74T0RGZR natively support?
The CC2652R74T0RGZR natively supports Bluetooth® 5.2 Low Energy, IEEE 802.15.4 (Zigbee®, Thread, TI 15.4-Stack), Matter over BLE, 6LoWPAN, and proprietary 2.4 GHz (G)FSK/MSK systems. Its Dynamic Multiprotocol Manager (DMM) enables concurrent operation of up to three protocols-such as BLE for commissioning, Thread for mesh networking, and Matter for cloud interoperability-all executed on the CC2652R74T0RGZR's single radio hardware.
How does the CC2652R74T0RGZR achieve 0.9 μA standby current with full RAM retention?
The CC2652R74T0RGZR achieves 0.9 μA standby current by powering down the Arm® Cortex®-M4F core and most peripherals while maintaining the RTC, 144KB SRAM with parity, and essential power domains. This state leverages ultra-low leakage SRAM technology and optimized power gating-verified in TI's SWRS253B datasheet under "7.5 Power Consumption - Power Modes"-and is fully supported by the CC2652R74T0RGZR's integrated DC/DC converter operating in discontinuous conduction mode.
Can the CC2652R74T0RGZR replace the CC2652R in an existing design?
Yes, the CC2652R74T0RGZR is pin-compatible with the CC2652R in the RGZ package and shares identical electrical characteristics, RF performance, and peripheral mapping. Key upgrades in the CC2652R74T0RGZR include increased flash (704KB vs. 352KB), larger SRAM (144KB vs. 80KB), and enhanced ROM-resident protocol stacks-including Matter support-which enable direct drop-in replacement for designs requiring expanded firmware capacity or next-generation connectivity standards.
What development tools are officially supported for the CC2652R74T0RGZR?
Texas Instruments officially supports the LP-CC2652R7 Development Kit, SimpleLink™ CC13xx and CC26xx SDK (v6.x+), SmartRF™ Studio for RF configuration, Sensor Controller Studio for low-power sensing logic, and SysConfig for peripheral initialization. All tools are validated for the CC2652R74T0RGZR and provide full debugging, OTA update, and protocol stack integration-ensuring rapid prototyping and production firmware development for the CC2652R74T0RGZR.
Does the CC2652R74T0RGZR include hardware security features required for Matter certification?
Yes, the CC2652R74T0RGZR includes all hardware security features mandated for Matter certification: AES-128/256 and SHA-256/512 cryptographic accelerators, ECC and RSA public-key hardware engines, and a NIST-certified True Random Number Generator (TRNG). These are documented in Section 8.6 of the SWRS253B datasheet and are leveraged by TI's Matter SDK to implement secure boot, device attestation, and encrypted PASE/CASE sessions-making the CC2652R74T0RGZR a certified Matter silicon platform.
CC2652R74T0RGZR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- SimpleLink™
- Package/Case:
- 48-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Type:
- TxRx + MCU
- RF Family/Standard:
- 802.15.4, Bluetooth
- Protocol:
- Bluetooth v5.2, Thread, Zigbee®
- Modulation:
- DSSS, O-QPSK
- Frequency:
- 2.4GHz ~ 2.48GHz
- Data Rate (Max):
- 2Mbps
- Power - Output:
- 5dBm
- Sensitivity:
- -104dBm
- Memory Size:
- 704kB Flash, 144kB RAM
- Serial Interfaces:
- ADC, GPIO, I2C, I2S, JTAG, SPI, UART
- GPIO:
- 31
- Voltage - Supply:
- 1.8V ~ 3.8V
- Current - Receiving:
- 7.1mA
- Current - Transmitting:
- 7.6mA ~ 9.9mA
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 48-VQFN (7x7)
CC2652R74T0RGZR FAQ
1.How can I place an order for CC2652R74T0RGZR through Aetrix?
Please submit a Request for Quotation (RFQ) for CC2652R74T0RGZR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CC2652R74T0RGZR reliable?
The price and inventory of CC2652R74T0RGZR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CC2652R74T0RGZR is usually 5 days.
3.What payment methods are accepted for CC2652R74T0RGZR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CC2652R74T0RGZR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CC2652R74T0RGZR?
CC2652R74T0RGZR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CC2652R74T0RGZR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CC2652R74T0RGZR?
For technical support, including CC2652R74T0RGZR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CC2652R74T0RGZR requirements.
6.How does Aetrix verify that CC2652R74T0RGZR is sourced from the original manufacturer or authorized distributors?
All CC2652R74T0RGZR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CC2652R74T0RGZR meets industry standards.
7.What is the process for return or replacement of CC2652R74T0RGZR?
All CC2652R74T0RGZR units undergo pre-shipment inspection (PSI). If there is an issue with CC2652R74T0RGZR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CC2652R74T0RGZR part is unused and in its original packaging.
Return procedure for CC2652R74T0RGZR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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