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Texas Instruments CC430F5135IRGZ
- Part No.:
- CC430F5135IRGZ
- Manufacturer:
- Texas Instruments
- Category:
- RF Transceiver ICs
- Package:
- 48-VFQFN Exposed Pad
- Datasheet:
-
CC430F5135IRGZ.pdf
- Description:
- IC RF TXRX+MCU ISM<1GHZ 48VQFN
- Quantity:
- Payment:
- Shipping:
Inventory:168
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Product details
Overview
CC430F5135IRGZ from Texas Instruments is an ultra-low-power System-on-Chip (SoC) microcontroller integrating a sub-1 GHz RF transceiver core (CC1101), 16-bit MSP430 CPUXV2, 16 KB flash, 2 KB RAM, 12-bit ADC with six external inputs plus internal temperature/battery sensors, two 16-bit timers, AES-128 security accelerator, and dual USCI modules (UART/IrDA/SPI + I²C/SPI). It targets battery-powered wireless sensor nodes in smart metering and industrial telemetry.
For engineers reviewing the CC430F5135IRGZ datasheet, CC430F5135IRGZ pinout, CC430F5135IRGZ application, or CC430F5135IRGZ equivalent, key selection considerations include its 48-pin VQFN package, 30 I/O pins, integrated RF transceiver supporting 300–928 MHz bands, programmable data rates up to 500 kBaud, and ultra-low power consumption (1.0 µA in LPM4, 2.0 µA in LPM3 RTC mode).
Technical Context
The CC430F5135IRGZ implements a tightly coupled SoC architecture where the MSP430 CPUXV2 core directly interfaces with the CC1101-derived RF subsystem via dedicated packet handler and digital RSSI/CCA logic - enabling autonomous radio operation without CPU intervention during receive/transmit bursts. Its unified clock system uses an FLL with selectable reference sources (XT1, RF_XIN, or internal REFO) to synchronize MCU timing and RF modulation clocks.
Power management integrates low-dropout regulators (LDO), supply voltage supervisors (SVS), and brownout reset (BOR) across separate DVCC, AVCC, and AVCC_RF domains - ensuring stable analog RF performance while allowing independent digital domain scaling down to 1.8 V. The 12-bit ADC supports autoscan across six external channels plus internal sensors, with configurable sample-and-hold and internal reference.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | MSP430 CPUXV2 16-bit RISC core with 16 registers and constant generators for high code efficiency in embedded firmware. |
| Flash / RAM | 16 KB in-system programmable flash memory and 2 KB RAM - sufficient for protocol stacks (e.g., Wireless M-Bus EN 13757‑4) and sensor processing. |
| RF Transceiver | CC1101-compatible sub-1 GHz transceiver supporting 300–348 MHz, 389–464 MHz, and 779–928 MHz bands with ±12 dBm output power and –117 dBm sensitivity at 0.6 kBaud. |
| ADC | 12-bit SAR ADC with six external analog inputs, internal temperature sensor, internal battery monitor, and autoscan mode - enables simultaneous multi-sensor acquisition without CPU polling. |
| Low-Power Modes | LPM4 (1.0 µA RAM retention), LPM3 (2.0 µA with RTC), AM (160 µA/MHz) - optimized for >10-year battery life in periodic wake-up sensor applications. |
| Peripherals | Dual USCI modules (USCI_A0: UART/IrDA/SPI; USCI_B0: I²C/SPI), two 16-bit Timer_A instances (5+3 capture/compare registers), hardware AES-128, 3-channel DMA, RTC with alarm. |
| Supply Range | 1.8 V to 3.6 V digital/analog supply - compatible with single-cell Li-ion, Li-SOCl₂, or two-cell alkaline battery systems. |
Pinout & Package
CC430F5135IRGZ is housed in a 48-pin VQFN (RGZ) package measuring 7 mm × 7 mm with exposed thermal pad. Pin functions follow TI's default mapping for the CC430F513x series, with all secondary digital functions fully mappable via port configuration registers.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P1.0/PM_RFGDO0 | Radio GDO0 output | General-purpose digital I/O; default function signals radio state (e.g., sync word detected, packet ready) - used for interrupt-driven RX/TX control. |
| P1.1/PM_RFGDO2 | Radio GDO2 output | Configurable radio status indicator (e.g., carrier sense active, TX finished) - enables hardware handshaking with external peripherals. |
| RF_P / RF_N | Differential RF I/O | Direct connection to 50 Ω antenna interface; requires external matching network per band - supports both receive (LNA input) and transmit (PA output) paths. |
| RF_XIN / RF_XOUT | RF crystal oscillator terminals | Drive external 26 MHz crystal for RF synthesizer - critical for frequency stability and regulatory compliance in FCC/EN 300 220 systems. |
| USCI_A0RXD / USCI_A0TXD | UART interface | Full-duplex serial communication with host MCU or debug interface - supports bootloader updates and sensor data streaming at up to 1 Mbps. |
| USCI_B0SCL / USCI_B0SDA | I²C interface | Two-wire bus for connecting external sensors (e.g., temperature, humidity) or EEPROMs - eliminates need for additional level-shifting circuitry. |
| RST/NMI/SBWTDIO | Reset & Spy-Bi-Wire I/O | Single-pin JTAG-lite interface for programming and debugging - reduces PCB footprint versus full 4-pin JTAG. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated CC1101 RF Core | Enables certified sub-GHz wireless communication without external transceiver - reduces BOM count and layout complexity for EN 300 220/FCC Part 15 systems. |
| Hardware AES-128 Accelerator | Offloads encryption/decryption from CPU - ensures secure over-the-air firmware updates and encrypted sensor payload transmission with deterministic latency. |
| Autonomous Packet Handling | On-chip sync word detection, address filtering, CRC generation/checking, and automatic length decoding - minimizes CPU wake-ups and extends battery life. |
| Multi-Domain Power Management | Independent DVCC, AVCC, and AVCC_RF supplies allow selective shutdown of RF/analog sections while retaining MCU RAM - essential for duty-cycled sensor nodes. |
| Programmable Data Rate | Supports 0.6–500 kBaud - enables trade-off between range (low rate) and throughput (high rate) without changing hardware or antenna design. |
Applications
| Smart Utility Metering | Wireless Sensor Networks |
|---|---|
|
Use Scenario: Battery-powered gas/water meters transmitting consumption data hourly via LPWAN to concentrators. IC Role / Device Role / Timing Role: Primary SoC handling sensor reading, RF packet assembly, AES encryption, and scheduled transmission using RTC-triggered wake-up. Use Value: 2.0 µA LPM3 current enables >15-year battery life; integrated CC1101 meets EN 13757‑4 Wireless M-Bus requirements out-of-box. |
Use Scenario: Industrial condition monitoring nodes measuring vibration, temperature, and humidity in rotating equipment. IC Role / Device Role / Timing Role: Edge-processing node performing local FFT analysis on ADC samples before RF transmission; uses DMA to offload CPU during acquisition. Use Value: 12-bit ADC with six external channels and internal sensors eliminates external signal conditioning; 160 µA/MHz active current keeps processing energy-efficient. |
| Thermostatic Control Systems | Heat Cost Allocators |
|
Use Scenario: Zigbee-adjacent HVAC controllers communicating with room sensors and actuators over proprietary 868 MHz mesh. IC Role / Device Role / Timing Role: Central coordinator managing time-synchronized TDMA slots; uses GDO pins to trigger external RF switches and PA enable. Use Value: Programmable output power (+12 dBm max) and digital RSSI support adaptive link budgeting; dual USCI allows concurrent UART (debug) and I²C (sensor bus). |
Use Scenario: Apartment-level heat consumption measurement units installed on radiators, reporting monthly usage via narrowband ISM band. IC Role / Device Role / Timing Role: Ultra-low-power endpoint collecting temperature differentials and flow pulses; transmits encrypted packets only once per day. Use Value: 1.0 µA LPM4 current with RAM retention enables calendar-based scheduling; internal temperature sensor eliminates external thermistor BOM cost. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar wireless SoC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CC430F5137IRGZ | 32 KB flash, 4 KB RAM, same RF core and peripherals - higher memory capacity for larger protocol stacks or firmware features. | Suitable for applications requiring OTA update capability or extended sensor fusion algorithms. | Select when firmware size exceeds 16 KB or additional RAM is needed for buffering encrypted payloads. |
| CC1310F128RGZR | ARM Cortex-M3 core, 128 KB flash, 20 KB RAM, integrated RF front-end, and advanced Sub-1 GHz PHY (including long-range mode). | Targets higher-performance, future-proof designs needing BLE coexistence, multi-protocol support, or longer range than CC1101 offers. | Choose for new designs prioritizing scalability, ARM ecosystem tooling, or enhanced RF robustness beyond CC430F5135IRGZ capabilities. |
Compared with CC430F5135IRGZ, CC430F5137IRGZ provides double flash/RAM for complex firmware but shares identical RF performance and power profile; CC1310F128RGZR delivers superior RF range and modern ARM architecture but requires redesign due to non-pin-compatible packaging and different peripheral mapping.
Availability
CC430F5135IRGZ is available at Aetrix Electronics and suitable for smart utility metering, industrial wireless sensor networks, and thermostatic control systems requiring stable component supply and long-term lifecycle assurance.
Supply support for CC430F5135IRGZ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company delivering analog and embedded processing solutions for industrial, automotive, and consumer applications.
The CC430 family was designed as ultra-low-power wireless SoCs targeting battery-operated sensor endpoints in smart grid, building automation, and industrial telemetry - integrating RF, MCU, security, and analog sensing in one die.
FAQ
What is the maximum RF output power supported by the CC430F5135IRGZ?
The CC430F5135IRGZ supports programmable RF output power up to +12 dBm across all supported frequency bands (300–348 MHz, 389–464 MHz, and 779–928 MHz). This value is specified in the device's electrical characteristics table under "Output Power" and is achievable with proper external matching network design and AVCC_RF supply regulation. The CC430F5135IRGZ maintains this output level while meeting EN 300 220 and FCC Part 15 spectral mask requirements.
Does the CC430F5135IRGZ include an integrated temperature sensor?
Yes, the CC430F5135IRGZ includes an internal temperature sensor connected to the 12-bit ADC - documented as "internal temperature sensor" in the ADC12_A channel listing. It provides factory-calibrated readings usable for ambient temperature monitoring or system thermal compensation without external components. This sensor is accessible via ADC channel A6 or through dedicated register reads in the CC430F5135IRGZ's system module.
Can the CC430F5135IRGZ operate from a single 1.8 V supply?
Yes, the CC430F5135IRGZ operates across a wide supply range of 1.8 V to 3.6 V for both DVCC and AVCC domains. At 1.8 V, it maintains full functionality including 16-MHz CPU operation, RF transceiver operation, and ADC conversions - verified in the "Electrical Characteristics" section of the SLAS554I datasheet. This enables direct compatibility with single-cell lithium-thionyl chloride batteries.
How many general-purpose I/O pins does the CC430F5135IRGZ provide?
The CC430F5135IRGZ provides 30 general-purpose I/O pins in its 48-pin VQFN (RGZ) package. These include P1.x (8 pins), P2.x (8 pins), P3.x (8 pins), P4.x (4 pins), P5.x (2 pins), and PJ.x (3 pins), all configurable with interrupt capability and mappable secondary functions. This count is confirmed in Table 3-1 ("Device Comparison") of the SLAS554I datasheet.
Is the CC430F5135IRGZ pin-compatible with other devices in the CC430F513x family?
Yes, the CC430F5135IRGZ is pin-compatible with CC430F5137IRGZ and CC430F5133IRGZ within the same 48-pin RGZ package. All share identical pin numbering, electrical characteristics, and peripheral mappings - differing only in flash (16 KB vs. 32 KB vs. 8 KB) and RAM (2 KB) sizes. This allows hardware reuse across firmware variants without PCB revision.
CC430F5135IRGZ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 48-VFQFN Exposed Pad
- Packaging:
- Tube
- Product Status:
- Active
- Programmable:
- Not Verified
- Type:
- TxRx + MCU
- RF Family/Standard:
- General ISM < 1GHz
- Protocol:
- -
- Modulation:
- 2FSK, 2GFSK, ASK, MSK, OOK
- Frequency:
- 300MHz ~ 348MHz, 389MHz ~ 464MHz, 779MHz ~ 928MHz
- Data Rate (Max):
- 500kBaud
- Power - Output:
- 13dBm
- Sensitivity:
- -117dBm
- Memory Size:
- 16kB Flash, 2kB SRAM
- Serial Interfaces:
- I2C, IrDA, JTAG, SPI, UART
- GPIO:
- 30
- Voltage - Supply:
- 2V ~ 3.6V
- Current - Receiving:
- 15mA ~ 18.5mA
- Current - Transmitting:
- 15mA ~ 36mA
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 48-VQFN (7x7)
CC430F5135IRGZ FAQ
1.How can I place an order for CC430F5135IRGZ through Aetrix?
Please submit a Request for Quotation (RFQ) for CC430F5135IRGZ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CC430F5135IRGZ reliable?
The price and inventory of CC430F5135IRGZ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CC430F5135IRGZ is usually 5 days.
3.What payment methods are accepted for CC430F5135IRGZ?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CC430F5135IRGZ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CC430F5135IRGZ?
CC430F5135IRGZ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CC430F5135IRGZ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CC430F5135IRGZ?
For technical support, including CC430F5135IRGZ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CC430F5135IRGZ requirements.
6.How does Aetrix verify that CC430F5135IRGZ is sourced from the original manufacturer or authorized distributors?
All CC430F5135IRGZ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CC430F5135IRGZ meets industry standards.
7.What is the process for return or replacement of CC430F5135IRGZ?
All CC430F5135IRGZ units undergo pre-shipment inspection (PSI). If there is an issue with CC430F5135IRGZ, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CC430F5135IRGZ part is unused and in its original packaging.
Return procedure for CC430F5135IRGZ:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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