Texas Instruments CC430F5137IRGZT

Overview

CC430F5137IRGZT from Texas Instruments is an ultra-low-power System-on-Chip (SoC) microcontroller integrating a sub-1 GHz RF transceiver core (CC1101), 16-bit MSP430 CPUXV2, 32 KB flash, 4 KB RAM, 12-bit ADC with six external inputs plus internal temperature/battery sensors, and dual USCI modules supporting UART/I²C/SPI. It operates from 1.8 V to 3.6 V and targets battery-powered wireless sensor nodes in smart metering and industrial telemetry.

For engineers reviewing the CC430F5137IRGZT datasheet, CC430F5137IRGZT pinout, CC430F5137IRGZT application, or CC430F5137IRGZT equivalent, key selection considerations include its 48-pin VQFN package, integrated RF transceiver with –117 dBm sensitivity at 0.6 kBaud, AES-128 security coprocessor, RTC with alarm, and support for EN 300 220 and FCC Part 15 compliance.

Technical Context

The CC430F5137IRGZT implements a tightly coupled SoC architecture where the MSP430 CPUXV2 core directly interfaces with the CC1101-compatible RF subsystem via dedicated packet-handling logic and shared memory-mapped registers. Its unified clock system uses an FLL with external 32 kHz crystal (XT1) and internal high-frequency oscillator (up to 26 MHz), enabling precise timing control for both MCU execution and RF modulation.

RF operation is managed through hardware-accelerated features including on-chip sync word detection, address filtering, automatic CRC generation/verification, digital RSSI output, and carrier sense with CCA for listen-before-talk protocols. The analog front end includes programmable output power up to +12 dBm across 300–928 MHz bands and supports 2-FSK, 2-GFSK, MSK, OOK, and ASK shaping.

Key Specifications

Pinout & Package

CC430F5137IRGZT is housed in a 48-pin VQFN (RGZ) package measuring 7 mm × 7 mm with exposed thermal pad. Pin functions are fully mappable across ports P1–P5, with default secondary assignments optimized for RF, timing, and peripheral interfacing.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar wireless SoC applications.

Compared with CC430F5135IRGZT, the CC430F5137IRGZT provides double flash/RAM for complex protocol stacks and secure boot; versus CC430F6137IRGCT, it trades LCD capability and package size for lower power and smaller footprint in embedded sensor applications.

Availability

CC430F5137IRGZT is available at Aetrix Electronics and suitable for wireless sensor networks, smart utility metering, and industrial telemetry requiring stable component supply and long-term manufacturability.

Supply support for CC430F5137IRGZT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies with decades of expertise in ultra-low-power design.

The CC430 family was engineered specifically for battery-operated wireless sensor applications demanding integrated RF, robust security, and multi-year operation - targeting smart grid, building automation, and industrial IoT markets.

FAQ

What is the maximum RF output power supported by the CC430F5137IRGZT?

The CC430F5137IRGZT supports programmable RF output power up to +12 dBm across all supported frequency bands (300–348 MHz, 389–464 MHz, 779–928 MHz). This value is specified in the electrical characteristics section of the SLAS554I datasheet under "RF Output Power" and is achievable with proper external matching network design and AVCC_RF supply regulation.

Does the CC430F5137IRGZT include hardware support for AES encryption?

Yes, the CC430F5137IRGZT integrates a dedicated 128-bit AES security coprocessor that performs encryption and decryption in hardware. This accelerator operates independently of the CPU, reducing latency to under 10 µs per block and freeing the MSP430 core for application tasks - a key feature confirmed in the device overview and functional block diagram of the SLAS554I datasheet.

How many analog input channels does the 12-bit ADC on the CC430F5137IRGZT support?

The CC430F5137IRGZT's 12-bit ADC supports six external analog input channels (A0–A5) plus two internal channels (temperature sensor and supply voltage), as explicitly stated in the device comparison table (Table 3-1) and functional description for the CC430F513x series in the SLAS554I datasheet.

What package type and pin count does the CC430F5137IRGZT use?

The CC430F5137IRGZT uses a 48-pin VQFN package with RGZ designation and body size of 7 mm × 7 mm, as documented in the Device Information table (Section 1.3) and pin diagram (Figure 4-3) of the SLAS554I datasheet. This package includes an exposed thermal pad for enhanced thermal dissipation.

Is the CC430F5137IRGZT compatible with the Wireless M-Bus standard?

Yes, the CC430F5137IRGZT is explicitly suited for systems targeting compliance with EN 13757‑4:2005 (Wireless M-Bus), as stated in the "High-Performance Sub-1 GHz RF Transceiver Core" feature list of the SLAS554I datasheet. Its RF core (CC1101 derivative), packet handling engine, and configurable modulation schemes meet the physical and link-layer requirements of mode S/T/R.