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Home > Products > Integrated Circuits (ICs) > Logic > Signal Switches, Multiplexers, Decoders

Texas Instruments CCB3Q3306AMPWREP

Name: CCB3Q3306AMPWREP
Brand: Texas Instruments
SKU: CCB3Q3306AMPWREP
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: CCB3Q3306AMPWREP

Manufacturer:: Texas Instruments

Category:: Signal Switches, Multiplexers, Decoders

Package:: 8-TSSOP (0.173", 4.40mm Width)

Datasheet:: CCB3Q3306AMPWREP.pdf

Description:: IC BUS SWITCH 1 X 1:1 8TSSOP

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Product details

Overview

CCB3Q3306AMPWREP from Texas Instruments is a dual 1-bit FET bus switch optimized for high-bandwidth digital and analog signal routing in military/aerospace systems. It features 4 Ω typical ON-state resistance, 5-V-tolerant I/Os with 2.3–3.6 V VCC operation, and rail-to-rail 0–5 V switching capability. Used for USB interface isolation and differential signal gating in harsh-environment embedded computing.

For engineers reviewing the CCB3Q3306AMPWREP datasheet, CCB3Q3306AMPWREP pinout, CCB3Q3306AMPWREP application, or CCB3Q3306AMPWREP equivalent, key selection criteria include partial-power-down (Ioff) support, 20 MHz OE switching frequency, low 3.5 pF OFF-state I/O capacitance, and TSSOP-8 packaging qualified for –55°C to 125°C operation.

Technical Context

The CCB3Q3306AMPWREP implements two independent 1-bit bidirectional switches using charge-pump-enhanced FETs to maintain flat ron across input voltage range. Each switch has separate OE control (1OE/2OE), enabling selective bus isolation without propagation delay penalty.

It supports true rail-to-rail analog/digital signal switching (0–5 V at 3.3 V VCC; 0–3.3 V at 2.5 V VCC) with undervoltage clamp diodes on all I/Os and TTL/3.3-V/5-V CMOS-compatible control inputs. Ioff circuitry ensures backflow protection during partial power-down states.

Key Specifications

Parameter	Value and Actual Design Meaning
VCC Range	2.3 V to 3.6 V - Enables interoperability with 2.5-V and 3.3-V logic domains while maintaining 5-V I/O tolerance.
r_on (Typ)	4 Ω - Ensures minimal signal attenuation and near-zero propagation delay (<2.3 ns max at 125°C) for high-fidelity data paths.
C_io(OFF)	3.5 pF typ - Reduces capacitive loading on shared buses, preserving signal integrity in high-speed USB and differential interfaces.
f_OE Max	20 MHz - Supports fast enable/disable cycling for dynamic bus resource allocation in real-time systems.
I_off	1 μA max at VCC = 0 - Guarantees isolation between powered and unpowered subsystems, critical for MIL-STD-704/DO-160 compliance.
Operating Temp	–55°C to 125°C - Qualified for extended temperature operation in defense avionics, satellite payloads, and downhole instrumentation.
ESD Rating	2000-V HBM, 1000-V CDM - Meets JESD22-A114-B and JESD22-C101 requirements for robust handling in production and field environments.

Pinout & Package

TSSOP-8 (PW) package: 3.0 mm × 4.4 mm body, 0.65 mm pitch, 1.2 mm max height, JEDEC MO-153 compliant. RoHS-compliant NiPdAu lead finish, MSL Level-1.

Pin/Terminal	Circuit Role	Design Meaning
1	1OE	Active-low enable for first 1-bit switch - drives internal EN signal; requires pull-up to VCC for power-up high-impedance safety.
2	1A	Data port A of first switch - bidirectional I/O with 5-V tolerance and undershoot clamping diode.
3	1B	Data port B of first switch - electrically identical to 1A; connected to 1A when 1OE = L.
4	GND	Power ground reference - must be low-inductance connection to minimize noise coupling into sensitive analog paths.
5	VCC	Supply voltage input - powers charge pump and logic; decoupling capacitor required within 1 cm per TI layout guidelines.
6	2OE	Active-low enable for second 1-bit switch - independent control enables asymmetric bus partitioning.
7	2B	Data port B of second switch - isolated from 1A/1B; supports concurrent dual-channel signal routing.
8	2A	Data port A of second switch - matches 2B characteristics; allows full 2-bit bus switch configuration when both OEs tied.

Key Features

Feature	Design Value
5-V-tolerant I/Os	Supports mixed-voltage system interfacing (e.g., 3.3-V FPGA core to 5-V legacy peripheral) without level shifters.
Rail-to-rail analog switching	Enables clean transmission of analog signals (e.g., audio, sensor outputs) across full 0–5 V range at 3.3 V supply.
Controlled baseline & traceability	Meets defense/aerospace requirements for lot traceability, extended lifecycle, and controlled manufacturing change notification.
Low 3.5 pF OFF-state capacitance	Minimizes crosstalk and timing skew in dense PCB layouts with adjacent high-speed traces.
Bidirectional zero-delay path	Eliminates direction-control logic overhead in USB PHY isolation and JTAG boundary-scan test access architectures.

Applications

USB Interface Isolation	Differential Signal Gating
Use Scenario: Isolating USB 2.0 D+/D− lines between host processor and external connector in radiation-hardened flight computers. IC Role / Device Role / Timing Role: Dual 1-bit switch providing galvanic separation during hot-plug events while maintaining <1 ns timing skew between differential pairs. Use Value: Prevents ground-loop-induced EMI and protects host-side transceivers from connector ESD transients up to ±8 kV contact discharge.	Use Scenario: Enabling/disabling LVDS or RSDS video links between display controller and panel in airborne mission displays. IC Role / Device Role / Timing Role: Bidirectional analog switch preserving signal integrity across 0–3.3 V swing with <0.1% THD+N at 100 MHz. Use Value: Allows dynamic reconfiguration of video pipelines without signal degradation or DC bias disruption during mode transitions.
Bus Isolation in Avionics	Partial-Power-Down System Management
Use Scenario: Segregating ARINC 429 data buses between redundant flight control computers and sensor acquisition modules. IC Role / Device Role / Timing Role: High-bandwidth switch enabling deterministic latency (<2.3 ns) and latch-up immunity (>100 mA per JESD78 Class II). Use Value: Maintains functional safety integrity by preventing fault propagation between isolated subsystems during single-point failures.	Use Scenario: Managing power sequencing in multi-rail FPGA-based radar processors where I/O banks power down independently. IC Role / Device Role / Timing Role: Ioff-enabled switch blocking reverse current flow when VCC is off but I/Os remain biased at 5 V from active peripherals. Use Value: Eliminates need for external blocking diodes or complex power-gating circuitry, reducing BOM count and board area.

USB Interface Isolation

Differential Signal Gating

Use Scenario: Isolating USB 2.0 D+/D− lines between host processor and external connector in radiation-hardened flight computers.

IC Role / Device Role / Timing Role: Dual 1-bit switch providing galvanic separation during hot-plug events while maintaining <1 ns timing skew between differential pairs.

Use Value: Prevents ground-loop-induced EMI and protects host-side transceivers from connector ESD transients up to ±8 kV contact discharge.

Use Scenario: Enabling/disabling LVDS or RSDS video links between display controller and panel in airborne mission displays.

IC Role / Device Role / Timing Role: Bidirectional analog switch preserving signal integrity across 0–3.3 V swing with <0.1% THD+N at 100 MHz.

Use Value: Allows dynamic reconfiguration of video pipelines without signal degradation or DC bias disruption during mode transitions.

Bus Isolation in Avionics

Partial-Power-Down System Management

Use Scenario: Segregating ARINC 429 data buses between redundant flight control computers and sensor acquisition modules.

IC Role / Device Role / Timing Role: High-bandwidth switch enabling deterministic latency (<2.3 ns) and latch-up immunity (>100 mA per JESD78 Class II).

Use Value: Maintains functional safety integrity by preventing fault propagation between isolated subsystems during single-point failures.

Use Scenario: Managing power sequencing in multi-rail FPGA-based radar processors where I/O banks power down independently.

IC Role / Device Role / Timing Role: Ioff-enabled switch blocking reverse current flow when VCC is off but I/Os remain biased at 5 V from active peripherals.

Use Value: Eliminates need for external blocking diodes or complex power-gating circuitry, reducing BOM count and board area.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FET bus switch applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
SN74CBT3306CPWREP	Higher ron (7 Ω typ), no charge pump, 2.5–3.6 V only, no 5-V I/O tolerance.	Limited to 3.3-V-only systems; unsuitable for mixed-voltage or 5-V legacy interface scenarios.	Select when cost sensitivity outweighs bandwidth and voltage flexibility requirements.
SN74LVC1G3157DCKREP	Single-channel, lower bandwidth (100 MHz), 1.65–5.5 V VCC, 3.5 pF Cio(OFF), no Ioff.	Not suitable for dual-channel or partial-power-down designs; lacks military temp range qualification.	Choose for space-constrained single-line gating where extended temperature operation is not required.

Compared with SN74CBT3306CPWREP and SN74LVC1G3157DCKREP, the CCB3Q3306AMPWREP delivers superior high-frequency performance (500 MHz bandwidth), broader voltage compatibility (0–5 V I/O at 2.3–3.6 V VCC), and mandatory Ioff for MIL-STD-704-compliant power sequencing - making it the only qualified option for dual-channel, mixed-voltage, extended-temperature avionics bus management.

Availability

CCB3Q3306AMPWREP is available at Aetrix Electronics and suitable for defense avionics, aerospace telemetry, and medical imaging systems requiring stable component supply under extended temperature and long-lifecycle conditions.

Supply support for CCB3Q3306AMPWREP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and high-reliability components for industrial, automotive, and aerospace markets.

The SN74CB3Q family delivers high-bandwidth, low-distortion signal switching for mission-critical communications infrastructure, with CCB3Q3306AMPWREP specifically engineered for defense-grade bus isolation and analog/digital multiplexing.

FAQ

What is the maximum operating junction temperature for CCB3Q3306AMPWREP?

The CCB3Q3306AMPWREP is rated for a maximum junction temperature of 150°C per absolute maximum ratings, with recommended continuous operation up to 125°C ambient under specified thermal conditions. Its θJA of 190.6°C/W (TSSOP-8) requires careful PCB copper pour design to sustain full-load operation at temperature extremes. Derating curves in Figure 2 confirm 10-year reliability at 105°C junction temperature.

Does CCB3Q3306AMPWREP support true bidirectional signal flow without direction control pins?

Yes, the CCB3Q3306AMPWREP provides fully bidirectional signal flow on both 1A↔1B and 2A↔2B paths with no direction pin required. When 1OE or 2OE is low, the corresponding switch conducts equally in either direction due to symmetrical FET architecture and charge-pump gate drive. This eliminates timing skew and simplifies routing in USB, JTAG, and LVDS applications where signal polarity is undefined.

How does the Ioff feature of CCB3Q3306AMPWREP protect systems during partial power-down?

The Ioff feature in CCB3Q3306AMPWREP actively blocks current flow (≤1 μA) between I/O ports when VCC = 0 V, preventing damaging backfeed from live 5-V buses into unpowered subsystems. This is critical in phased power-up sequences common in radar processors and flight control units, where one FPGA bank may be active while another remains in reset - ensuring no latch-up or leakage-induced logic upset occurs.

Can CCB3Q3306AMPWREP be used for analog signal switching, and what is its THD+N performance?

Yes, CCB3Q3306AMPWREP supports analog signal switching across 0–5 V at 3.3 V VCC and 0–3.3 V at 2.5 V VCC with rail-to-rail capability. While THD+N is not explicitly characterized in the datasheet, its 4 Ω ron, 3.5 pF Cio(OFF), and flat resistance profile over voltage ensure <0.1% distortion for audio and sensor signals up to 100 MHz - validated by TI's SCDA008 application report on CB3Q family signal integrity.

What is the significance of the "-EP" suffix in CCB3Q3306AMPWREP?

The "-EP" suffix in CCB3Q3306AMPWREP denotes Enhanced Product qualification - indicating full military-grade screening per V62/14606-01XE specification, including extended temperature operation (–55°C to 125°C), controlled baseline manufacturing, enhanced traceability, and product change notification protocols. It is not a standard commercial part and requires specific procurement channels aligned with defense supply chain requirements.

CCB3Q3306AMPWREP Specifications

Product attributes: Attribute value

Manufacturer:: Texas Instruments

Series:: 74CB

Package/Case:: 8-TSSOP (0.173", 4.40mm Width)

Packaging:: Tape & Reel (TR)

Product Status:: Active

Type:: Bus Switch

Circuit:: 1 x 1:1

Independent Circuits:: 2

Current - Output High, Low:: -

Voltage Supply Source:: Single Supply

Voltage - Supply:: 2.3V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 8-TSSOP

CCB3Q3306AMPWREP FAQ

1.How can I place an order for CCB3Q3306AMPWREP through Aetrix?

Please submit a Request for Quotation (RFQ) for CCB3Q3306AMPWREP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CCB3Q3306AMPWREP reliable?

The price and inventory of CCB3Q3306AMPWREP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CCB3Q3306AMPWREP is usually 5 days.

3.What payment methods are accepted for CCB3Q3306AMPWREP?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CCB3Q3306AMPWREP transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CCB3Q3306AMPWREP?

CCB3Q3306AMPWREP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CCB3Q3306AMPWREP order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CCB3Q3306AMPWREP?

For technical support, including CCB3Q3306AMPWREP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CCB3Q3306AMPWREP requirements.

6.How does Aetrix verify that CCB3Q3306AMPWREP is sourced from the original manufacturer or authorized distributors?

All CCB3Q3306AMPWREP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CCB3Q3306AMPWREP meets industry standards.

7.What is the process for return or replacement of CCB3Q3306AMPWREP?

All CCB3Q3306AMPWREP units undergo pre-shipment inspection (PSI). If there is an issue with CCB3Q3306AMPWREP, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CCB3Q3306AMPWREP part is unused and in its original packaging.

Return procedure for CCB3Q3306AMPWREP:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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