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Renesas CD40105BHSR

Part No.:
CD40105BHSR
Manufacturer:
Renesas
Category:
FIFOs Memory
Package:
Die
Datasheet:
AetrixCD40105BHSR.pdf
Description:
RENESAS
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,846

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Product details

Overview

CD40105BHSR from Intersil is a 4-bit × 16-word CMOS FIFO register designed for asynchronous data buffering between mismatched clock domains. It features independent shift-in/shift-out control, 3-state outputs, DATA-IN READY (DIR) and DATA-OUT READY (DOR) status flags, and operates across 5V–15V supply rails with full −55°C to +125°C temperature range support - enabling use in radar data acquisition and CPU/terminal interfaces.

For engineers reviewing the CD40105BHSR datasheet, CD40105BHSR pinout, CD40105BHSR application, or CD40105BHSR equivalent, key selection considerations include its elastic storage architecture, ripple-through propagation timing (≤1.4 µs at VDD = 15V), master reset capability, and radiation-tolerant design validated per MIL-STD-883 Group E irradiation testing.

Technical Context

The CD40105BHSR implements a marker-bit–based control logic architecture where 16 cascaded flip-flops track data occupancy; each "1" bit indicates valid data, and "0" denotes vacancy. Data transfer occurs via edge-triggered ripple propagation: a falling SO edge unloads output data while advancing the next word, and a rising SI edge loads input data when DIR is high.

Its 3-state output buffers are controlled independently of shift operations, allowing bus sharing without interference. The FIFO supports expansion in length (cascading via DIR→SO and DOR→SI) and width (parallel 4-bit banks with AND-gated DIR/DOR), with master reset (MR) forcing all markers to "0" while preserving stored data values until first load.

Key Specifications

Parameter Value and Actual Design Meaning
Storage Capacity 4-bit × 16-word FIFO buffer - holds up to 64 bits with automatic data alignment and vacancy bubbling to input end.
Supply Voltage Range 5V to 15V DC - supports industrial and military-grade systems with wide-rail compatibility and 20V absolute max rating.
Propagation Delay (Ripple) ≤1.4 µs at VDD = 15V - determines maximum latency between input load and output availability in real-time buffering.
Max Shift Rate 4 MHz at VDD = 15V - defines upper bound on sustained data throughput for synchronous interface bridging.
Operating Temperature −55°C to +125°C - qualified for extended-range aerospace, defense, and downhole electronics applications.
Input Leakage Current ≤100 nA at +25°C, VDD = 18V - ensures ultra-low standby power in battery-backed or low-quiescent systems.
Output Drive Strength ±3.5 mA at VDD = 15V - sufficient to drive 50 pF loads directly without external buffers in point-to-point links.

Pinout & Package

CD40105BHSR is supplied in a 16-lead ceramic flatpack (H6W) package with hermetic sealing suitable for high-reliability environments.

Pin/Terminal Circuit Role Design Meaning
1, 2, 3, 4 Data Inputs (D0–D3) Parallel 4-bit input latch inputs; sampled on rising edge of SHIFT-IN (SI).
5, 6, 7, 8 Data Outputs (Q0–Q3) 3-state buffered parallel outputs; enabled by LOW on 3-STATE CONTROL (Pin 9).
9 3-State Control Active-low output enable; must be stable before SO transition to prevent data loss.
10 DATA-IN READY (DIR) Open-drain flag indicating FIFO readiness to accept new word; HIGH = space available.
11 SHIFT-IN (SI) Rising-edge triggered load signal; pulses accepted only when DIR = HIGH.
12 VSS Ground reference for all logic and I/O circuits.
13 D0–D3 (redundant label) Same as Pins 1–4; functional duplication shown in top-view diagram but electrically identical.
14 VDD Positive supply rail (5V–15V); supports wide-voltage operation and high-noise-margin thresholds.
15 DATA-OUT READY (DOR) Open-drain flag indicating valid data present at Q0–Q3; HIGH = word ready for unload.
16 MASTER RESET (MR) Asynchronous active-high reset that clears all marker bits to "0", invalidating FIFO state without erasing data latches.

Key Features

Feature Design Value
Elastic FIFO Architecture Automatic data rippling and vacancy bubbling eliminate need for external address management or pointer logic.
Asynchronous Dual-Port Interface Independent SI and SO clocks allow seamless bridging between unrelated clock domains (e.g., UART ↔ CPU bus).
3-State Output Buffers Pin-compatible bus sharing with other CMOS devices; enables multi-drop data paths without contention.
Status Flag Outputs (DIR/DOR) Real-time hardware handshaking signals reduce software polling overhead and improve deterministic response.
Expandable Configuration Supports both depth expansion (cascading multiple units) and width expansion (parallel 4-bit banks) using standard logic gates.

Applications

Radar Data Acquisition CPU/Terminal Buffering

Use Scenario: Capturing burst-mode analog-to-digital samples from phased-array radar receivers operating at variable pulse repetition frequencies.

IC Role / Device Role / Timing Role: Elastic buffer absorbing timing skew between ADC sampling clock and downstream DSP processing clock.

Use Value: Prevents sample loss during clock domain crossing while maintaining deterministic latency ≤1.4 µs at 15V supply.

Use Scenario: Interfacing legacy serial terminals with modern microprocessor-based controllers running at mismatched baud rates.

IC Role / Device Role / Timing Role: Asynchronous FIFO decoupling UART TX/RX streams from CPU memory bus cycles.

Use Value: Eliminates software flow control overhead and guarantees zero-character loss under peak traffic bursts.

Peripheral Buffering Line Printer Input Buffers

Use Scenario: Managing data flow between high-speed USB host controllers and slower SPI-based sensor peripherals.

IC Role / Device Role / Timing Role: Intermediate storage element synchronizing packetized USB transfers with bursty peripheral read/write timing.

Use Value: Enables seamless protocol translation without CPU intervention or DMA resource allocation.

Use Scenario: Storing ASCII character streams from host computers prior to mechanical print-head actuation in impact printers.

IC Role / Device Role / Timing Role: Temporary holding register compensating for mechanical latency between data arrival and physical printing.

Use Value: Sustains continuous print throughput even during intermittent host transmission gaps.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FIFO register applications.

Alternative Part Technical Difference Application Difference Selection Advice
CD40105BM96 Same die, tape-and-reel packaging (SOIC-16); no ceramic H6W hermetic seal or extended temperature qualification. Limited to commercial/industrial ambient conditions (−40°C to +85°C); unsuitable for space or high-radiation environments. Select CD40105BM96 only for cost-sensitive terrestrial applications where hermeticity and radiation tolerance are not required.
74HC40105 High-speed CMOS variant with 2V–6V supply range; faster propagation (≤120 ns) but lower voltage rating (6V max) and no MIL-STD-883 qualification. Optimized for consumer/portable electronics; lacks −55°C operation, 20V abs max rating, and irradiation test validation. Choose 74HC40105 for battery-powered or high-frequency embedded systems where speed outweighs environmental ruggedness.

Compared with CD40105BHSR, CD40105BM96 trades hermetic reliability for volume packaging efficiency, while 74HC40105 sacrifices voltage margin and radiation hardness for higher speed and lower supply voltage - making CD40105BHSR uniquely suited for mission-critical analog/digital interface buffering under extreme conditions.

Availability

CD40105BHSR is available at Aetrix Electronics and suitable for radar data acquisition, CPU/terminal buffering, and peripheral interfacing requiring stable component supply across extended temperature and radiation-exposed environments.

Supply support for CD40105BHSR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Intersil Corporation is a U.S.-based semiconductor manufacturer specializing in high-reliability analog and mixed-signal ICs for aerospace, defense, and industrial markets.

The CD40105BHSR belongs to Intersil's radiation-hardened CMOS logic family, engineered specifically for timing-critical data buffering in harsh electromagnetic and thermal environments.

FAQ

What is the function of the MASTER RESET (MR) pin on the CD40105BHSR?

The MASTER RESET (MR) pin on the CD40105BHSR is an asynchronous active-high input that forces all internal marker bits to "0", declaring the entire FIFO empty without altering the contents of the data latches. After MR deassertion, the first valid shift-in pulse restores functionality, and CD40105BHSR resumes normal elastic buffering behavior with DIR going high once space becomes available.

Does the CD40105BHSR support cascading to increase FIFO depth?

Yes, the CD40105BHSR supports depth expansion via cascading: connect DIR of one unit to SO of the next, and DOR of the next to SI of the first. A master reset pulse must be applied after power-up in cascaded configurations. This allows building longer FIFOs while retaining independent status signaling - a capability confirmed in the CD40105BHSR functional diagram and timing specifications.

What is the minimum pulse width required for SHIFT-IN (SI) on the CD40105BHSR?

The minimum SHIFT-IN (SI) pulse width for CD40105BHSR is 60 ns at VDD = 15V, 75 ns at VDD = 10V, and 200 ns at VDD = 5V, as specified in Table 6 of the datasheet. These values ensure reliable capture of the rising edge under worst-case temperature and voltage conditions, and CD40105BHSR will ignore subsequent SI pulses if DIR remains low due to full buffer state.

How does the 3-state control interact with data unloading on the CD40105BHSR?

On the CD40105BHSR, the 3-state control (Pin 9) must be held LOW before applying a falling edge to SHIFT-OUT (SO) to enable Q0–Q3 outputs. If 3-state transitions from HIGH to LOW while SO is at logic 0, the first word shifts out immediately and is lost. Therefore, proper sequencing - enable outputs first, then assert SO - is mandatory for reliable CD40105BHSR operation.

Is the CD40105BHSR qualified for radiation exposure environments?

Yes, the CD40105BHSR is radiation-hardened and qualified per MIL-STD-883 Group E Subgroup 2 for total ionizing dose (TID) exposure. Post-irradiation testing confirms functional integrity and parameter stability up to specified limits, including threshold voltage shifts ≤±1 V and supply current change ≤25 µA at +25°C - critical for CD40105BHSR deployment in satellite, avionics, and nuclear instrumentation systems.

CD40105BHSR Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
Die
Packaging:
Bulk
Product Status:
Obsolete
Programmable:
-
Memory Size:
64 (16 x 4)
Function:
Asynchronous
Data Rate:
4MHz
Access Time:
-
Voltage - Supply:
0 V ~ 20 V
Current - Supply (Max):
600µA
Bus Directional:
Uni-Directional
Expansion Type:
Depth, Width
Programmable Flags Support:
No
Retransmit Capability:
No
FWFT Support:
No
Operating Temperature:
-55°C ~ 125°C
Mounting Type:
Surface Mount
Supplier Device Package:
Die

CD40105BHSR FAQ

1.How can I place an order for CD40105BHSR through Aetrix?

Please submit a Request for Quotation (RFQ) for CD40105BHSR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CD40105BHSR reliable?

The price and inventory of CD40105BHSR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CD40105BHSR is usually 5 days.

3.What payment methods are accepted for CD40105BHSR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CD40105BHSR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CD40105BHSR?

CD40105BHSR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CD40105BHSR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CD40105BHSR?

For technical support, including CD40105BHSR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CD40105BHSR requirements.

6.How does Aetrix verify that CD40105BHSR is sourced from the original manufacturer or authorized distributors?

All CD40105BHSR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CD40105BHSR meets industry standards.

7.What is the process for return or replacement of CD40105BHSR?

All CD40105BHSR units undergo pre-shipment inspection (PSI). If there is an issue with CD40105BHSR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CD40105BHSR part is unused and in its original packaging.

Return procedure for CD40105BHSR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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